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US5494764A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for making printed circuit boards

Assignee: Mitsubishi Paper Mills Ltd
•
Filing: 1995-02-21
•
Granted: 1996-02-27
•
Expires: 2015-02-21
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Abstract

Abstract Disclosed is a method for making a printed circuit board which comprises providing a photoconductive layer by electrodeposition method on a metal conductive layer provided on at least one side of an electrically insulating substrate, forming a toner image on said photoconductive layer by electrophotographic process, then dissolving and removing the area of the photoconductive layer not covered by the toner using a printer and optionally etching the surface of the area of the substrate from which the photoconductive layer has been removed. According to this method, by employing especially the electrophotographic reversal development, a printed circuit board of excellent sensitivity and high resolution can be produced even from both-side copper-clad laminate sheets having through-holes of a high aspect ratio using an exposure source of low energy such as semiconductor laser.

Inventors

  • 👤 Kenji Hyodo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 16:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/065; G; G03; G03G; G03G13/00; G03G13/22; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0517; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/40; H05K3/42; H05K3/425; H05K3/427

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 93 words
A method for making a printed circuit board which comprises the following steps: providing a metal conductive layer on both sides of an electrically insulating substrate having through-holes and on the inner wall of the through-holes to obtain an electrically conductive substrate; providing a photoconductive layer by electrodeposition method on said metal conductive layer; forming a toner image on said photoconductive layer by electrophotographic reversal development method; decoating a portion of the photoconductive layer other than the toner image portion; and etching the metal conductive layer exposed after decoating of the photoconductive layer.
Claim 2
Independent Claim 93 words
A method for making a printed circuit board which comprises the following steps: providing a metal conductive layer on both sides of an electrically insulating substrate having through-holes and on the inner wall of the through-holes to obtain an electrically conductive substrate; providing a photoconductive layer by electrodeposition method on said metal conductive layer; forming a toner image on said photoconductive layer by electrophotographic reversal development method; decoating a portion of the photoconductive layer other than the toner image portion; and etching the metal conductive layer exposed after decoating of the photoconductive layer.
Claim 3
Dependent Claim 43 words
A method for making a printed circuit board according to claim 1, wherein the photoconductive layer is provided by the electrodeposition method using an electrodeposition solution containing a resin having an anionic functional group and a base which neutralizes the anionic functional group.
Claim 4
Dependent Claim 35 words
A method for making a printed circuit board according to claim 2, wherein the anionic functional group is a carboxylic acid group and the base which neutralizes the anionic functional group is an organic base.

References Cited (Backward Citations)

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JPS522437A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-02-26 1999-08-28 2000-02-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-02-26 2003-08-28 2004-02-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-02-26 2007-08-28 2008-02-27 $7700.00 Window Closed / Lapsed

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