Abstract A method of manufacturing a multiple layer circuit board with stacked vias of fine dimension and pitch. A base laminate with conductive pattern is coated with a dielectric which is photolithographically processed to create holes exposing selected regions of the underlying conductive pattern. The holes through the dielectric are plated to form via connections between the surface and the conductive pattern on the base laminate. The recess created by the via is filled with a conductive and plateable polymer which upon curing forms a conductive plug. A second dielectric layer is deposited on the board structure and in succession photolithographically processed to expose the underlying plated via and plug. The hole in the second dielectric is plated and filled with conductive polymer so as to create a second via vertically aligned with and electrically connected to the underlying first via. The ability to form fine pitch stacked vias is particularly important for printed circuit board structures such as carriers of flip chip die, in that the fine pitch of the solder ball array of the flip chip needs to be expanded and/or disbursed through multiple board layers with minimum area and electrical degradation.
A method of manufacturing a die carrier, comprising the steps of: providing a base laminate having front and back sides; forming an electrical interconnect pattern on the front side of the base laminate; forming dielectric layers on the front and back sides of the base laminate; forming holes through the base laminate and dielectric layers; selectively removing regions of the dielectric layer on the front side to expose regions of the electrical interconnect pattern; plating to deposit a conductive layer into the selectively removed regions of the dielectric layer on the front side and through the holes; depositing and photolithographically patterning photoresist to selectively expose the plated conductive layer; and etching in the presence of the patterned photoresist exposed plating to selectively form the die carrier having vias, plated through holes and lands.
Claim 2
Independent Claim
133 words
A method of manufacturing a die carrier, comprising the steps of: providing a base laminate having front and back sides; forming an electrical interconnect pattern on the front side of the base laminate; forming dielectric layers on the front and back sides of the base laminate; forming holes through the base laminate and dielectric layers; selectively removing regions of the dielectric layer on the front side to expose regions of the electrical interconnect pattern; plating to deposit a conductive layer into the selectively removed regions of the dielectric layer on the front side and through the holes; depositing and photolithographically patterning photoresist to selectively expose the plated conductive layer; and etching in the presence of the patterned photoresist exposed plating to selectively form the die carrier having vias, plated through holes and lands.
Claim 3
Dependent Claim
18 words
The method recited in claim 1, wherein the step of depositing photoresist is comprised of conformally electrodepositing photoresist.
Claim 4
Dependent Claim
35 words
The method recited in claim 2, comprising the further steps of: filling the plated holes through the base laminate with a conductive polymer; and curing the polymer to form conductive plugs through the plated holes.