US5057372A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer film and laminate for use in producing printed circuit boards
Assignee: Gould Electronics Inc
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Filing: 1989-03-22
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Granted: 1991-10-15
•
Expires: 2009-03-22
Abstract
Abstract A multilayer film having as one surface layer thereof a support layer containing a thermoplastic resin able to withstand temperatures up to 200 degrees C. without softening and the other surface layer an adhesive layer containing a thermoplastic resin having a melting point ranging from about 100 to 200 degrees C. Optionally, a tie layer may be employed between the support layer and the adhesive layer. The multilayer film is useful as a protective carrier sheet for a cladding metal foil used in the production of printed circuit boards. The carrier sheet provides temporary, peelable surface protection for the cladding metal foil preventing contamination and physical damage to the foil both before and during printed circuit board formation. Adhesion of the carrier sheet to the cladding metal foil, measured using a 180 degree peel test is less than 0.4 pounds/in-width and greater than 0.005 pounds/in-width, and preferably less than 0.1 pounds/in-width and greater than 0.01 pounds/in-width.
Inventors
- 👤 Stephen M. Imfeld
- 👤 Randall S. Shipley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:15
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B27/00; B32B27/06; B32B27/08; B32B27/36; B32B7/00; B32B7/04; B32B7/06; H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/025; H05K3/10; H05K3/20; B32B2311/00; B32B2311/12; B32B2367/00; B32B2457/00; B32B2457/08; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31507; Y10T428/31678; Y10T428/31692; Y10T428/31725; Y10T428/3175; Y10T428/31757; Y10T428/31786; Y10T428/31797; Y10T428/31855; Y10T428/31909; Y10T428/31913
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
97 words
A laminate for use in production of printed circuit boards comprising: a layer of a cladding metal foil and a releasable protective carrier sheet for said metal foil comprising a multilayer film having as one surface thereof a support layer containing an extrudable thermoplastic resin able to withstand up to 200 degrees C. without softening and as the other surface thereof an adhesive layer containing at least one extrudable thermoplastic resin having a melting point range of from 100 to 200 degrees C., said adhesive layer releasably bonding said carrier sheet to said cladding metal foil layer.
Claim 2
Dependent Claim
97 words
A laminate for use in production of printed circuit boards comprising: a layer of a cladding metal foil and a releasable protective carrier sheet for said metal foil comprising a multilayer film having as one surface thereof a support layer containing an extrudable thermoplastic resin able to withstand up to 200 degrees C. without softening and as the other surface thereof an adhesive layer containing at least one extrudable thermoplastic resin having a melting point range of from 100 to 200 degrees C., said adhesive layer releasably bonding said carrier sheet to said cladding metal foil layer.
Claim 3
Dependent Claim
13 words
The laminate of claim 1 wherein said cladding metal foil is copper foil.
Claim 4
Dependent Claim
13 words
The laminate of claim 2 wherein said adhesive layer contains a polyolefin resin.
Claim 5
Dependent Claim
27 words
The laminate of claim 3 wherein said support layer contains a resin selected from the group consisting of polymethylpentene, polyamide, polycarbonate resins, and copolymers and mixture thereof.
Claim 6
Dependent Claim
15 words
The laminate of claim 3 wherein said support layer contains 80-100% polymethylpentene homopolymer or copolymer.
Claim 7
Dependent Claim
37 words
The laminate of claim 5 wherein said multilayer film is coextruded and said support layer comprises about 75-85% by weight of said multilayer film and said adhesive layer comprises about 15-25% by weight of said multilayer film.
Claim 8
Dependent Claim
18 words
The laminate of claim 1 further including a tie layer between said support layer and said adhesive layer.
Claim 9
Dependent Claim
26 words
The laminate of claim 1 wherein said tie layer is a blend of the resin of said support layer and the resin of said adhesive layer.
Claim 10
Dependent Claim
159 words
A laminate for use in production of printed circuit boards comprising: a layer of cladding metal foil, and a carrier sheet comprising a coextruded multilayer film having as one surface thereof a support layer comprising about 10-20% by weight of said multilayer film, said support layer containing an extrudable thermoplastic resin able to withstand up to 200° C. without softening; said multilayer film having as the other surface thereof an adhesive layer comprising about 10-20% by weight of said multilayer film, said adhesive layer containing at least one extrudable thermoplastic resin having a melting point range of from 100° to 200° C., and having a tie layer between said support layer and said adhesive layer, said tie layer being a blend of the resin of said support layer and the resin of said adhesive layer and comprising about 60-80% be weight of said multilayer film, said adhesive layer releasably bonding said carrier sheet to said cladding metal foil layer.
Claim 11
Dependent Claim
159 words
A laminate for use in production of printed circuit boards comprising: a layer of cladding metal foil, and a carrier sheet comprising a coextruded multilayer film having as one surface thereof a support layer comprising about 10-20% by weight of said multilayer film, said support layer containing an extrudable thermoplastic resin able to withstand up to 200° C. without softening; said multilayer film having as the other surface thereof an adhesive layer comprising about 10-20% by weight of said multilayer film, said adhesive layer containing at least one extrudable thermoplastic resin having a melting point range of from 100° to 200° C., and having a tie layer between said support layer and said adhesive layer, said tie layer being a blend of the resin of said support layer and the resin of said adhesive layer and comprising about 60-80% be weight of said multilayer film, said adhesive layer releasably bonding said carrier sheet to said cladding metal foil layer.
Claim 12
Dependent Claim
66 words
A laminate for use in production of printed circuit boards comprising: a copper foil layer, and a releasable protective carrier sheet for said copper foil layer comprising a multilayer film having as one surface thereof a support layer containing polyester resin and as the other surface thereof an adhesive layer containing polyolefin resin, said adhesive layer releasably bonding said copper foil layer to said carrier sheet.
Claim 13
Dependent Claim
66 words
A laminate for use in production of printed circuit boards comprising: a copper foil layer, and a releasable protective carrier sheet for said copper foil layer comprising a multilayer film having as one surface thereof a support layer containing polyester resin and as the other surface thereof an adhesive layer containing polyolefin resin, said adhesive layer releasably bonding said copper foil layer to said carrier sheet.
Claim 14
Dependent Claim
27 words
The laminate of claim 10 further including a tie layer between said support layer and said adhesive layer, said tie layer containing a thermosetting polyethylene terephthalate resin.
Claim 15
Dependent Claim
119 words
A laminate for use in production of printed circuit boards comprising: a copper foil layer, and a carrier sheet comprising a laminated multilayer film having as one surface thereof a support layer comprising about 50-60% by weight of said multilayer film, said support layer containing polyester resin; said multilayer film having as the other surface thereof an adhesive layer comprising about 35-40% by weight of said multilayer film, said adhesive layer containing polyolefin resin, and having a tie layer between said support layer and said adhesive layer, said tie layer comprising about 3-7% by weight of said multilayer film and containing a thermosetting polyethylene terephthalate resin, said adhesive layer releasably bonding said copper foil layer to said carrier sheet.
Claim 16
Dependent Claim
119 words
A laminate for use in production of printed circuit boards comprising: a copper foil layer, and a carrier sheet comprising a laminated multilayer film having as one surface thereof a support layer comprising about 50-60% by weight of said multilayer film, said support layer containing polyester resin; said multilayer film having as the other surface thereof an adhesive layer comprising about 35-40% by weight of said multilayer film, said adhesive layer containing polyolefin resin, and having a tie layer between said support layer and said adhesive layer, said tie layer comprising about 3-7% by weight of said multilayer film and containing a thermosetting polyethylene terephthalate resin, said adhesive layer releasably bonding said copper foil layer to said carrier sheet.
Claim 17
Dependent Claim
58 words
A releasable protective multilayer film for use as a temporary, peelable protectable carrier sheet for cladding metal foil used in the production of printed circuit boards, comprising: a support layer containing polymethylpentene resin, and an adhesive layer containing polyolefin resin adjoined to said polymethylpentene layer, said adhesive layer releasably bonding said support layer to the cladding metal foil.
Claim 18
Dependent Claim
58 words
A releasable protective multilayer film for use as a temporary, peelable protectable carrier sheet for cladding metal foil used in the production of printed circuit boards, comprising: a support layer containing polymethylpentene resin, and an adhesive layer containing polyolefin resin adjoined to said polymethylpentene layer, said adhesive layer releasably bonding said support layer to the cladding metal foil.
Claim 19
Dependent Claim
28 words
The releasable protective multilayer film of claim 13 wherein said support layer contains 80-100% of a polymethylpentene or polymethylpentene copolymer having a melting point of about 220°-240° C.
Claim 20
Dependent Claim
39 words
The releasable multilayer film of claim 14 wherein said polyolefin resin is selected from the group consisting of polyethylene, polypropylene, copolymers of propylene/ethylene, copolymers of ethylene with alpha olefins, and copolymer of ethylene or propylene with a polar comonomer.
Claim 21
Dependent Claim
18 words
The releasable protective multilayer film of claim 15 wherein said support layer and said adhesive layer are coextruded.
Claim 22
Dependent Claim
34 words
The releasable protective multilayer film of claim 16 wherein said support layer comprises about 75-85% by weight of said multilayer film and said adhesive layer comprises about 15-25% by weight of said multilayer film.
Claim 23
Dependent Claim
20 words
The releasable protective film of claim 15 further including a tie layer between said support layer and said adhesive layer.
Claim 24
Dependent Claim
21 words
The releasable protective multilayer film of claim 18 wherein said tie layer is a blend of polymethylpentene resin and polyolefin resin.
Claim 25
Dependent Claim
133 words
A multilayer film adapted for use as a temporary, peelable protection carrier sheet for cladding metal foil used in the production of printed circuit boards, comprising: a support layer comprising 10-20% by weight of said multilayer film, said support layer containing 80-100% of a polymethylpentene or polymethylpentene copolymer having a melting point of about 220°-240° C., an adhesive layer comprising 10-20% by weight of said multilayer film, said adhesive layer containing polyolefin resins selected from the group consisting of polyethylene, polypropylene, copolymers of propylene/ethylene, copolymers of ethylene with alpha olefins, and copolymers of ethylene or propylene with a polar comonomer, and a tie layer between said support layer and said adhesive layer, said tie layer comprising 60-80% by weight of said multilayer film and being a blend of polymethylpentene resin and polyolefin resin.
Claim 26
Dependent Claim
133 words
A multilayer film adapted for use as a temporary, peelable protection carrier sheet for cladding metal foil used in the production of printed circuit boards, comprising: a support layer comprising 10-20% by weight of said multilayer film, said support layer containing 80-100% of a polymethylpentene or polymethylpentene copolymer having a melting point of about 220°-240° C., an adhesive layer comprising 10-20% by weight of said multilayer film, said adhesive layer containing polyolefin resins selected from the group consisting of polyethylene, polypropylene, copolymers of propylene/ethylene, copolymers of ethylene with alpha olefins, and copolymers of ethylene or propylene with a polar comonomer, and a tie layer between said support layer and said adhesive layer, said tie layer comprising 60-80% by weight of said multilayer film and being a blend of polymethylpentene resin and polyolefin resin.
References Cited (Backward Citations)
US3544662A
Cited
US3892900A
Cited
US4302501A
Cited
US4182457A
Cited
US4241129A
Cited
US4501634A
Cited
JPS56111637A
Cited
US4386991A
Cited
US4455181A
Cited
US4410388A
Cited
JPS5770653A
Cited
JPS5770654A
Cited
JPS58128846A
Cited
US4546150A
Cited
US4617207A
Cited
US4690845A
Cited
US4857400A
Cited
US4604324A
Cited
US4753847A
Cited
US4883718A
Cited
US4861648A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-14 | 1995-04-15 | 1995-10-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-14 | 1999-04-15 | 1999-10-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-14 | 2003-04-15 | 2003-10-15 | $7700.00 | Window Closed / Lapsed |