US4455181A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of transfer lamination of copper thin sheets and films
Assignee: General Electric Co
•
Filing: 1983-02-22
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Granted: 1984-06-19
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Expires: 2003-02-22
Abstract
Abstract A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.
Inventors
- 👤 Eric Lifshin
- 👤 Joseph D. Cargioli
- 👤 Stephen J. Schroder
- 👤 Joe Wong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 10:17
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/388; H05K3/02; H05K3/022; H05K3/025; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K3/382; H05K3/389; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/1092; Y10T156/1093; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12542; Y10T428/12549; Y10T428/12771; Y10T428/12785; Y10T428/12792; Y10T428/12861; Y10T428/12903
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
77 words
The method of making a copper-clad laminate which comprises: vapor depositing on a copper body of less than about 80-microns thickness an ultra-thin film of zinc; vapor depositing an ultra-thin film of an oxide selected from the group consisting of silicon dioxide and aluminum oxide on the resulting ultra-thin zinc film; and laminating the resulting coated copper body with a substrate so as to create relatively strong adhesion between the said coated copper body and said substrate.
Claim 2
Independent Claim
77 words
The method of making a copper-clad laminate which comprises: vapor depositing on a copper body of less than about 80-microns thickness an ultra-thin film of zinc; vapor depositing an ultra-thin film of an oxide selected from the group consisting of silicon dioxide and aluminum oxide on the resulting ultra-thin zinc film; and laminating the resulting coated copper body with a substrate so as to create relatively strong adhesion between the said coated copper body and said substrate.
Claim 3
Dependent Claim
15 words
The method of claim 1 in which the copper body is an ultra-thin copper film.
Claim 4
Dependent Claim
44 words
The method of claim 1 including the preliminary step of forming an ultra-thin copper film by vapor deposition on a release agent-coated carrier, and further includes the final step of removing the release agent-coated carrier leaving the coated copper body adhered to the substrate.
Claim 5
Dependent Claim
27 words
The method of claim 3 in which sputtering is the vapor deposition method of applying the zinc film on the copper film to produce a copper-zinc foil.
Claim 6
Dependent Claim
43 words
The method of claim 4 in which the zinc film is of thickness between about 1,200 and 7,000 Angstroms, and in which the silicone dioxide or aluminum oxide film is of thickness between about 200 and 1,200 Angstroms and is produced by sputtering.
Claim 7
Dependent Claim
22 words
The method of claim 1 including the step of providing a coating of a silane coupling agent on the ultra-thin oxide film.
Claim 8
Dependent Claim
35 words
The method of claim 6 in which the coupling agent is provided by contacting the vapor deposited ultra-thin surface with a methanol solution of a silane coupling agent and thereafter removing the methanol by evaporation.
Claim 9
Dependent Claim
17 words
The method of claim 2 including the preliminary step of forming the ultra-thin copper film by sputtering.
Claim 10
Dependent Claim
77 words
The method of claim 2 including the preliminary steps of coating a carrier or press pan with a release agent and sputtering copper to form a film of copper on the release agent coating, and in which zinc is sputtered to form a film of zinc 1,200 to 7,000 microns thick on the copper film, and in which silicone dioxide is sputtered to form a silicone dioxide film 200 to 1,200 Angstroms thick on the zinc film.
Claim 11
Dependent Claim
17 words
The method of claim 1 in which the vapor deposition step is conducted in a moisture-containing atmosphere.
Claim 12
Dependent Claim
15 words
The method of claim 1 in which the copper body is a thin copper sheet.
Claim 13
Dependent Claim
45 words
The method of claim 11 in which a zinc film of thickness between about 1,200 and 7,000 Angstroms is sputtered on the then copper sheet and a silicone dioxide film from about 200 to 1,200 Angstroms thick is sputtered on the resulting ultra-thin zinc film.
Claim 14
Dependent Claim
20 words
The method of claim 11 including the preliminary step of forming the thin copper sheet by electrodeposition or by rolling.
Claim 15
Dependent Claim
25 words
The method of claim 12 including the step of providing a silane coupling agent coating on the ultra-thin silicone dioxide film on the zinc film.
Claim 16
Dependent Claim
27 words
The method of claim 1 in which the vapor deposition step consists of sputtering zinc under an argon atmosphere containing about one part per hundred of moisture.
Claim 17
Dependent Claim
36 words
The method of claim 4 in which the zinc sputtering step is carried out in the presence of a small amount of moisture effective to cause formation of whisker-like dendrites on the resulting ultra-thin zinc film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-06-19 | 1987-12-19 | 1988-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-06-19 | 1991-12-19 | 1992-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-06-19 | 1995-12-19 | 1996-06-19 | $7700.00 | Window Closed / Lapsed |