US4153518A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a metalized substrate having a thin film barrier layer
Assignee: Tektronix Inc
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Filing: 1977-11-18
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Granted: 1979-05-08
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Expires: 1997-11-18
Abstract
Abstract A method of fabricating a hybrid circuit including a siliceous substrate and thick metal conductors. A thin film barrier layer is provided intermediate the substrate and a vacuum-deposited metal layer, which metal layer is subsequently electroplated to provide the desired metal thickness. The barrier layer, which may suitably be a refractory metal oxide such as the oxides of zirconium, tantalum, titanium, or tungsten, prevents loss of adhesion between the vacuum deposited metal and substrate that occurs during electroplating.
Inventors
- 👤 Robert E. Holmes
- 👤 Robert R. Zimmerman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 01:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/388; H10; H10D; H10D86/00; H10D86/80; H10D86/85; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12597; Y10T428/12611; Y10T428/12618
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
97 words
A process of fabricating hybrid circuits on a siliceous substrate, comprising: depositing on said substrate a barrier layer of a refractory metal oxide to prevent loss of adhesion between the adjacent overlying layer and said substrate during a subsequent electrodeposition step; vacuum depositing from about 200 to 1,000 Angstroms of an oxide-forming metal selected from the group consisting of chromium, titanium, and tantalum on said refractory metal oxide layer; vacuum depositing from about 1,000 to 10,000 Angstroms of conductive metal on said oxide-forming metal; and electroplating a layer of conductive metal on said vacuum deposited conductive metal.
Claim 2
Dependent Claim
97 words
A process of fabricating hybrid circuits on a siliceous substrate, comprising: depositing on said substrate a barrier layer of a refractory metal oxide to prevent loss of adhesion between the adjacent overlying layer and said substrate during a subsequent electrodeposition step; vacuum depositing from about 200 to 1,000 Angstroms of an oxide-forming metal selected from the group consisting of chromium, titanium, and tantalum on said refractory metal oxide layer; vacuum depositing from about 1,000 to 10,000 Angstroms of conductive metal on said oxide-forming metal; and electroplating a layer of conductive metal on said vacuum deposited conductive metal.
Claim 3
Dependent Claim
15 words
A process in accordance with claim 1 wherein said refractory metal oxide is zirconium oxide.
Claim 4
Dependent Claim
17 words
A process in accordance with claim 2 wherein said zirconium oxide layer is about 2,000 Angstroms thick.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-05-07 | 1982-11-06 | 1983-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-05-07 | 1986-11-06 | 1987-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-05-07 | 1990-11-06 | 1991-05-08 | $7700.00 | Window Closed / Lapsed |