US6157086A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip package with transfer mold underfill
Assignee: Interconnect Systems Inc
•
Filing: 1999-11-18
•
Granted: 2000-12-05
•
Expires: 2019-11-18
Abstract
Abstract An integrated circuit chip package according to the present invention includes an integrated circuit chip mounted on a substrate by a plurality of solder bumps. A mold compound is used for underfilling air gaps between the chip and the substrate. The integrated circuit chip package is formed by placing the chip and substrate within a mold cavity and pressing a transfer mold compound into the mold cavity. Air spaces between the integrated circuit chip and the substrate are underfilled by the mold compound as it is pressed in between the integrated circuit chip and the substrate. Air is allowed to escape from between the chip and the substrate during the underfilling through a vent which extends through the substrate. The underfilling material may also be used to encapsulate the chip at the same time that underfilling is performed.
Inventors
- 👤 Patrick O. Weber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:25
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W72/00; H10W72/30; H10W74/01; H10W74/012; H10W74/016; H10W74/114; H10W74/15; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W72/071; H10W72/072; H10W72/073; H10W72/07321; H10W72/07327; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S425/00; Y10S425/812; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
140 words
An integrated circuit chip package comprising: an integrated circuit chip having an active surface with interconnection pads disposed thereon; a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a vent hole, having a largest dimension of 0.020 inches, extending from the first side to the second side of the substrate and positioned beneath the integrated circuit chip when the chip is mounted on the substrate; and a transfer molding composition containing between about 70 and 90 percent filler material which is forced by pressure into an air gap between the integrated circuit chip and the substrate, wherein the transfer molding composition is a material which is solid at room temperature before curing, and the transfer molding composition extending into the vent hole in the substrate.
Claim 2
Dependent Claim
140 words
An integrated circuit chip package comprising: an integrated circuit chip having an active surface with interconnection pads disposed thereon; a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a vent hole, having a largest dimension of 0.020 inches, extending from the first side to the second side of the substrate and positioned beneath the integrated circuit chip when the chip is mounted on the substrate; and a transfer molding composition containing between about 70 and 90 percent filler material which is forced by pressure into an air gap between the integrated circuit chip and the substrate, wherein the transfer molding composition is a material which is solid at room temperature before curing, and the transfer molding composition extending into the vent hole in the substrate.
Claim 3
Dependent Claim
21 words
The integrated circuit chip package of claim 1, wherein the transfer molding composition provides an underfilling for the integrated circuit chip.
Claim 4
Dependent Claim
46 words
The integrated circuit chip package of claim 1, wherein as the transfer molding composition is forced into the air gap between the integrated circuit chip and the substrate, the vent hole provides means for air to escape from between the integrated circuit chip and the substrate.
Claim 5
Dependent Claim
46 words
The integrated circuit chip package of claim 1, wherein the transfer molding composition is forced into the air gap between the integrated circuit chip and the substrate, and the vent hole providing means for underfilling of all spaces between said integrated circuit chip and said substrate.
Claim 6
Dependent Claim
130 words
An integrated circuit chip package comprising: an integrated circuit chip having an active surface with interconnection pads disposed thereon; a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a plurality of vent holes, each extending from the first side to the second side of the substrate, the vent holes having a largest dimension of 0.020 inches and positioned beneath the integrated circuit chip when the chip is mounted on the substrate; and a transfer molding composition containing between about 70 and 90 percent filler material which is forced by pressure into an air gap between the integrated circuit chip and the substrate, and the transfer molding composition extending into the vent hole in the substrate.
Claim 7
Dependent Claim
130 words
An integrated circuit chip package comprising: an integrated circuit chip having an active surface with interconnection pads disposed thereon; a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a plurality of vent holes, each extending from the first side to the second side of the substrate, the vent holes having a largest dimension of 0.020 inches and positioned beneath the integrated circuit chip when the chip is mounted on the substrate; and a transfer molding composition containing between about 70 and 90 percent filler material which is forced by pressure into an air gap between the integrated circuit chip and the substrate, and the transfer molding composition extending into the vent hole in the substrate.
Claim 8
Dependent Claim
19 words
The integrated circuit chip package of claim 1, wherein the transfer molding composition substantially encapsulates the integrated circuit chip.
Claim 9
Dependent Claim
40 words
The integrated circuit chip package of claim 1, further comprising: a plurality of solder bumps for providing an electrical connection between the interconnection pads of the integrated circuit chip and the bonding pads on the first side of the substrate.
Claim 10
Dependent Claim
28 words
The integrated circuit chip package of claim 7, wherein the transfer molding composition substantially surrounds each of the solder bumps between the integrated circuit chip and the substrate.
Claim 11
Dependent Claim
124 words
An integrated circuit chip package comprising: an integrated circuit chip having an active surface with interconnection pads disposed thereon; a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a vent hole which extends from the first side to the second side of the substrate and is positioned beneath the integrated circuit chip when said chip is mounted on the substrate; and a transfer molding composition which is forced into an air gap between the integrated circuit chip and the substrate, wherein the transfer molding composition is a material which is solid at room temperature before curing, and the transfer molding composition extending into the vent hole in the substrate.
Claim 12
Dependent Claim
124 words
An integrated circuit chip package comprising: an integrated circuit chip having an active surface with interconnection pads disposed thereon; a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a vent hole which extends from the first side to the second side of the substrate and is positioned beneath the integrated circuit chip when said chip is mounted on the substrate; and a transfer molding composition which is forced into an air gap between the integrated circuit chip and the substrate, wherein the transfer molding composition is a material which is solid at room temperature before curing, and the transfer molding composition extending into the vent hole in the substrate.
Claim 13
Dependent Claim
18 words
The integrated circuit chip of claim 9, wherein the vent hole has a largest dimension of 0.020 inches.
References Cited (Backward Citations)
US4143456A
Cited
US4300153A
Cited
US4859722A
Cited
US4770899A
Cited
US5203076A
Cited
US5218234A
Cited
US5557150A
Cited
US5249101A
Cited
US5380560A
Cited
US5408121A
Cited
US5535101A
Cited
US5371404A
Cited
US5323947A
Cited
US5385869A
Cited
US5619070A
Cited
US5827999A
Cited
US5468995A
Cited
US5814882A
Cited
US5841192A
Cited
US5581122A
Cited
US5641996A
Cited
US5767446A
Cited
US5892290A
Cited
US5710071A
Cited
US5731231A
Cited
US5708304A
Cited
US5700723A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-05 | 2004-06-05 | 2004-12-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-05 | 2008-06-05 | 2008-12-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-05 | 2012-06-05 | 2012-12-05 | $7700.00 | Window Closed / Lapsed |