US5641996A — Semiconductor unit package, semiconductor unit pa…

Claim 1

Independent Claim 116 words

A semiconductor unit package which comprises: (a) a semiconductor device having an electrode pad; (b) a substrate having a terminal electrode; (c) a bump electrode formed on said electrode pad of said semiconductor device; (d) a conductive adhesive layer which is formed of a conductive adhesive with flexibility and which establishes an electrical connection between said bump electrode and said terminal electrode; and (e) an encapsulating layer which is formed by curing a composition having a viscosity of below 100 Pa·s and a thixotropy index of below 1.1 and which fills a gap defined between said semiconductor device and said substrate in such a way that said semiconductor device and said substrate are mechanically joined together.

Claim 2

Dependent Claim 116 words

A semiconductor unit package which comprises: (a) a semiconductor device having an electrode pad; (b) a substrate having a terminal electrode; (c) a bump electrode formed on said electrode pad of said semiconductor device; (d) a conductive adhesive layer which is formed of a conductive adhesive with flexibility and which establishes an electrical connection between said bump electrode and said terminal electrode; and (e) an encapsulating layer which is formed by curing a composition having a viscosity of below 100 Pa·s and a thixotropy index of below 1.1 and which fills a gap defined between said semiconductor device and said substrate in such a way that said semiconductor device and said substrate are mechanically joined together.

Claim 3

Dependent Claim 75 words

A semiconductor unit package of claim 1, wherein: said composition consists essentially of (A) a resin binder that contains at least a polyepoxide, a carboxylic acid's anhydride, a rheology modifier, and a latent curing accelerator, and (B) a filler that is formed of a dielectric material; and said rheology modifier functions to impede interaction between a free acid in said anhydride of said carboxylic acid and a polar group at the surface of said filler.

Claim 4

Dependent Claim 29 words

A semiconductor unit package of claim 2 wherein said rheology modifier contains a substance capable of selective adsorption of said free acid in said anhydride of said carboxylic acid.

Claim 5

Dependent Claim 15 words

A semiconductor unit package of claim 2 wherein said rheology modifier is a Lewis-base compound.

Claim 6

Dependent Claim 44 words

A semiconductor unit package of claim 2 wherein said rheology modifier is either a tertiary amine compound, a tertiary phosphine compound, a quaternary ammonium salt, a quaternary phosphonium salt, or a heterocyclic compound that contains in a cyclic chain thereof an atom of nitrogen.

Claim 7

Dependent Claim 27 words

A semiconductor unit package of claim 2 wherein said anhydride of said carboxylic acid in said resin binder contains at least an anhydride of an alicyclic acid.

Claim 8

Dependent Claim 21 words

A semiconductor unit package of claim 6 wherein said alicyclic acid anhydride contains at least an anhydride of a trialkyltetrahydrophthalic acid.

Claim 9

Dependent Claim 25 words

A semiconductor unit package of claim 1 wherein said bump electrode of said semiconductor device is a stud bump electrode with a two stepped protuberance.

Claim 10

Dependent Claim 161 words

A semiconductor unit packaging method wherein a semiconductor device having an electrode pad is mounted on a substrate having a terminal electrode, said method comprising: (a) a first step of forming a bump electrode on said electrode pad of said semiconductor device; (b) a second step of applying a conductive adhesive around the tip of said bump electrode; (c) a third step comprising: performing alignment of said bump electrode and said terminal electrode; placing said semiconductor device onto said substrate; and establishing, through said conductive adhesive, an electrical connection between said bump electrode and said terminal electrode; (d) a fourth step of preparing an encapsulant formed of a composition the viscosity and thixotropy index of which are below 100 Pa·s and below 1.1, respectively; (e) a fifth step of filling a gap defined between said semiconductor device and said substrate with said encapsulant; and (f) a sixth step of curing said encapsulant to mechanically joint said semiconductor device and said substrate.

Claim 11

Dependent Claim 161 words

A semiconductor unit packaging method wherein a semiconductor device having an electrode pad is mounted on a substrate having a terminal electrode, said method comprising: (a) a first step of forming a bump electrode on said electrode pad of said semiconductor device; (b) a second step of applying a conductive adhesive around the tip of said bump electrode; (c) a third step comprising: performing alignment of said bump electrode and said terminal electrode; placing said semiconductor device onto said substrate; and establishing, through said conductive adhesive, an electrical connection between said bump electrode and said terminal electrode; (d) a fourth step of preparing an encapsulant formed of a composition the viscosity and thixotropy index of which are below 100 Pa·s and below 1.1, respectively; (e) a fifth step of filling a gap defined between said semiconductor device and said substrate with said encapsulant; and (f) a sixth step of curing said encapsulant to mechanically joint said semiconductor device and said substrate.

Claim 12

Dependent Claim 80 words

A semiconductor unit packaging method of claim 9 wherein: said composition of said fourth step consists essentially of (A) a resin binder that contains at least a polyepoxide, an anhydride of a carboxylic acid, a rheology modifier, and a latent curing accelerator, and (B) a filler that is formed of a dielectric material; and said rheology modifier functions to impede interaction between a free acid in said carboxylic acid's anhydride and a polar group at the surface of said filler.

Claim 13

Dependent Claim 43 words

A semiconductor unit packaging method of claim 9 wherein said rheology modifier contains a substance, which acts also as a curing accelerator for a double-liquid type encapsulant, by such a trace amount as to prevent said substance from exhibiting its curing accelerant function.

Claim 14

Dependent Claim 32 words

A semiconductor unit packaging method of claim 10 wherein said anhydride of said carboxylic acid in said resin binder of said fourth step contains at least an anhydride of an alicyclic acid.

Claim 15

Dependent Claim 26 words

A semiconductor unit packaging method of claim 12 wherein said alicyclic acid anhydride of said fourth step contains at least an anhydride of a trialkyltetrahydrophthalic acid.

Claim 16

Dependent Claim 26 words

A semiconductor unit packaging method of claim 9 wherein said bump electrode of said first step is a stud bump electrode with a two stepped protuberance.

Claim 17

Dependent Claim 27 words

A semiconductor unit packaging method of claim 9 wherein in said fifth step said encapsulant is injected between said semiconductor device and said substrate at room temperature.

Claim 18

Dependent Claim 28 words

A semiconductor unit packaging method of claim 9 wherein in said fifth step said encapsulant is injected between said semiconductor device and said substrate under a depressurized condition.

Claim 19

Dependent Claim 55 words

A semiconductor unit packaging method of claim 9 wherein in said fourth step said composition of said encapsulant is prepared by: providing a mixture of an anhydride of a carboxylic acid and a part of a filler; subjecting said mixture to an aging process; and adding a polyepoxide and the remaining filler to said mixture.

Claim 20

Dependent Claim 30 words

A semiconductor unit packaging method of claim 10 wherein said rheology modifier contains a substance capable of selective adsorption of said free acid in said anhydride of said carboxylic acid.

Claim 21

Dependent Claim 16 words

A semiconductor unit packaging method of claim 10 wherein said rheology modifier is a Lewis-base compound.

Claim 22

Dependent Claim 45 words

A semiconductor unit packaging method of claim 10 wherein said rheology modifier is either a tertiary amine compound, a tertiary phosphine compound, a quaternary ammonium salt, a quaternary phosphonium salt, or a heterocyclic compound that contains in a cyclic chain thereof an atom of nitrogen.

Claim 23

Dependent Claim 124 words

An encapsulant for filling a gap between a semiconductor device and a substrate for use in the packaging of a semiconductor unit, said encapsulant essentially consisting of: (A) a resin binder that contains at least a polyepoxide, an anhydride of a carboxylic acid, a rheology modifier, and a latent curing accelerator wherein the weight percentage of said resin binder is within the range of from 80% to 25%; and (B) a filler that is formed of a dielectric material wherein the weight percentage of said filler is within the range of from 20% to 75%; wherein said rheology modifier functions to impede interaction between a free acid in said anhydride of said carboxylic acid and a polar group at the surface of said filler.

Claim 24

Dependent Claim 124 words

An encapsulant for filling a gap between a semiconductor device and a substrate for use in the packaging of a semiconductor unit, said encapsulant essentially consisting of: (A) a resin binder that contains at least a polyepoxide, an anhydride of a carboxylic acid, a rheology modifier, and a latent curing accelerator wherein the weight percentage of said resin binder is within the range of from 80% to 25%; and (B) a filler that is formed of a dielectric material wherein the weight percentage of said filler is within the range of from 20% to 75%; wherein said rheology modifier functions to impede interaction between a free acid in said anhydride of said carboxylic acid and a polar group at the surface of said filler.

Claim 25

Dependent Claim 27 words

An encapsulant of claim 21 wherein said rheology modifier contains a substance capable of selective adsorption of said free acid in said anhydride of said carboxylic acid.

Claim 26

Dependent Claim 13 words

An encapsulant of claim 21 wherein said rheology modifier is a Lewis-base compound.

Claim 27

Dependent Claim 42 words

An encapsulant of claim 21 wherein said rheology modifier is either a tertiary amine compound, a tertiary phosphine compound, a quaternary ammonium salt, a quaternary phosphonium salt, or a heterocyclic compound that contains in a cyclic chain thereof an atom of nitrogen.

Claim 28

Dependent Claim 25 words

An encapsulant of claim 21 wherein said anhydride of said carboxylic acid in said resin binder contains at least an anhydride of an alicyclic acid.

Claim 29

Dependent Claim 19 words

An encapsulant of claim 25 wherein said alicyclic acid anhydride contains at least an anhydride of a trialkyltetrahydrophthalic acid.

Claim 30

Dependent Claim 20 words

An encapsulant of claim 21 wherein said resin binder and said filler are arranged to stay as a single liquid.

Claim 31

Dependent Claim 85 words

An encapsulant of claim 21, said resin binder having a composition wherein: (a) the chemical equivalent ratio of said anhydride of said carboxylic acid to said polyepoxide is within the range of from 0.8 to 1.1; (b) the weight percentage of said curing accelerator to the entirety of said resin binder is within the range of from 0.3% to 3%; and (c) the weight percentage of said rheology modifier to the entirety of said resin binder is within the range of from 0.02% to 0.3%.

Claim 32

Dependent Claim 135 words

An encapsulant for filling a gap between a semiconductor device and a substrate for use in the packaging of a semiconductor unit, said encapsulant essentially consisting of: (A) a resin binder that contains at least a polyepoxide, an anhydride of a carboxylic acid, a rheology modifier, and a latent curing accelerator wherein the weight percentage of said resin binder is within the range of from 80% to 25%; and (B) a filler that is formed of a dielectric material wherein the weight percentage of said filler is within the range of from 20% to 75%; wherein said encapsulant is prepared by: providing a mixture of an anhydride of a carboxylic acid and a part of a filler; subjecting said mixture to an aging process; and adding a polyepoxide and the remaining filler to said mixture.

Claim 33

Dependent Claim 135 words

An encapsulant for filling a gap between a semiconductor device and a substrate for use in the packaging of a semiconductor unit, said encapsulant essentially consisting of: (A) a resin binder that contains at least a polyepoxide, an anhydride of a carboxylic acid, a rheology modifier, and a latent curing accelerator wherein the weight percentage of said resin binder is within the range of from 80% to 25%; and (B) a filler that is formed of a dielectric material wherein the weight percentage of said filler is within the range of from 20% to 75%; wherein said encapsulant is prepared by: providing a mixture of an anhydride of a carboxylic acid and a part of a filler; subjecting said mixture to an aging process; and adding a polyepoxide and the remaining filler to said mixture.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2000-06-23	2000-12-23	2001-06-24	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2004-06-23	2004-12-23	2005-06-24	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2008-06-23	2008-12-23	2009-06-24	$7700.00	Window Closed / Lapsed

Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

Abstract

Inventors

Bibliographic Details

Claims Analysis

References Cited (Backward Citations)

USPTO Annuity & Maintenance Windows

Assigned Categories & Tags

Assign Category Tag