US5121190A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder interconnection structure on organic substrates
Assignee: International Business Machines Corp
•
Filing: 1990-03-14
•
Granted: 1992-06-09
•
Expires: 2010-03-14
Abstract
Abstract Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.
Inventors
- 👤 Richard Hsiao
- 👤 Jack M. McCreary
- 👤 Voya R. Markovich
- 👤 Donald P. Seraphim
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 16:41
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W74/40; H10W74/47; H10W74/473; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
129 words
A solder interconnection for forming connections between an integrated semiconductor device and an organic substrate comprising a plurality of solder connections that extend from the carrier substrate to electrodes on said semiconductor device to form a gap between said organic substrate and the semiconductor device, wherein said gap is filled with a composition obtained from curing a composition containing: A. a thermosetting binder having a viscosity at room temperature of no greater than about 1,000 centipoise; B. filler having a maximum particle size of 50 microns wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B.
Claim 2
Dependent Claim
129 words
A solder interconnection for forming connections between an integrated semiconductor device and an organic substrate comprising a plurality of solder connections that extend from the carrier substrate to electrodes on said semiconductor device to form a gap between said organic substrate and the semiconductor device, wherein said gap is filled with a composition obtained from curing a composition containing: A. a thermosetting binder having a viscosity at room temperature of no greater than about 1,000 centipoise; B. filler having a maximum particle size of 50 microns wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B.
Claim 3
Dependent Claim
17 words
The solder interconnection of claim 1 wherein said gap is about 2 to about 6.0 mils wide.
Claim 4
Dependent Claim
22 words
The solder interconnection of claim 1 wherein the viscosity of said binder at 25° C. is about 300 to about 450 centipoise.
Claim 5
Dependent Claim
28 words
The solder interconnection of claim 1 wherein said filler is an inorganic filler selected from the group of silica, quartz and fused silica, optionally treated with coupling agents.
Claim 6
Dependent Claim
20 words
The solder interconnection of claim 1 wherein said filler has emission rate of less than 0.01 alpha particles/cm 2 -hr.
Claim 7
Dependent Claim
19 words
The solder interconnection of claim 1 wherein said filler has particle sizes of about 0.5 to about 20 micrometers.
Claim 8
Dependent Claim
22 words
The solder interconnection of claim 1 wherein the viscosity at 25° C. of said composition is about 3,000 to about 30,000 centipoise.
Claim 9
Dependent Claim
15 words
The solder interconnection of claim 1 wherein said composition is free of unreactive organic solvents.
Claim 10
Dependent Claim
21 words
The solder interconnection of claim 1 wherein said binder is a polyepoxide, cyanate ester, prepolymer of cyanate ester or mixture thereof.
Claim 11
Dependent Claim
12 words
The solder interconnection of claim 1 wherein said binder is a polyepoxide.
Claim 12
Dependent Claim
13 words
The solder interconnection of claim 1 wherein said substrate contains a fluorocarbon polymer.
References Cited (Backward Citations)
US3949125A
Cited
US3429040A
Cited
US4504283A
Cited
US4579806A
Cited
US4864471A
Cited
US4825284A
Cited
US4818728A
Cited
US4999699A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-09 | 1995-12-09 | 1996-06-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-09 | 1999-12-09 | 2000-06-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-09 | 2003-12-09 | 2004-06-09 | $7700.00 | Window Closed / Lapsed |