Patent US4158179A successfully refreshed from Google Patents.
US5203076A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vacuum infiltration of underfill material for flip-chip devices
Assignee: NXP USA Inc
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Filing: 1991-12-23
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Granted: 1993-04-20
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Expires: 2011-12-23
Abstract
Abstract A method of attaching an integrated circuit (10) to a substrate (20) starts with electrically interconnecting (14) the integrated circuit on the substrate. Next, a bead of underfill material (22) is provided on the substrate (20) about the periphery (24) of the integrated circuit (10). At least a partial vacuum (34) is then applied to the integrated circuit (10) and the substrate (20) to substantially evacuate the area (18) between the integrated circuit (10) and the substrate (20). Finally, fluid pressure (42) is applied to the integrated circuit (10) and the substrate (20) to force at least a portion of the underfill material (22) into the area (18) between the integrated circuit (10) and the substrate (20).
Inventors
- 👤 Kingshuk Banerji
- 👤 Francisco D. Alves
- 👤 Robert F. Darveaux
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:50
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W72/00; H10W72/30; H10W74/10; H10W74/15; H10W72/071; H10W72/072; H10W72/073; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
115 words
A method of attaching a semiconductor device to a substrate not having a through-hole, comprising the steps of: electrically interconnecting the semiconductor device on the substrate; providing a bead of underfill material on the substrate about the periphery of the semiconductor device; applying at least a partial vacuum to the semiconductor device and the substrate to substantially evacuate entrapped air in the underchip area between the semiconductor device and the substrate by bubbling the entrapped air through the underfill material; releasing the vacuum by applying fluid pressure to the semiconductor device and the substrate to force at least a portion of the underfill material into the underchip area between the semiconductor device and the substrate.
Claim 2
Independent Claim
115 words
A method of attaching a semiconductor device to a substrate not having a through-hole, comprising the steps of: electrically interconnecting the semiconductor device on the substrate; providing a bead of underfill material on the substrate about the periphery of the semiconductor device; applying at least a partial vacuum to the semiconductor device and the substrate to substantially evacuate entrapped air in the underchip area between the semiconductor device and the substrate by bubbling the entrapped air through the underfill material; releasing the vacuum by applying fluid pressure to the semiconductor device and the substrate to force at least a portion of the underfill material into the underchip area between the semiconductor device and the substrate.
Claim 3
Dependent Claim
32 words
The method of claim 1 wherein the applying at least a partial vacuum step comprises positioning a vacuum chamber over the top of the semiconductor device, the underfill material, and the substrate.
Claim 4
Dependent Claim
27 words
The method of claim 1 wherein the applying at least a partial vacuum step comprises controlling the rate of the vacuum to provide a continuous evacuation rate.
Claim 5
Dependent Claim
25 words
The method of claim 1 wherein the applying fluid pressure step comprises controlling the rate of the fluid pressure to provide a continuous evacuation rate.
Claim 6
Dependent Claim
15 words
The method of claim 1 wherein the applying fluid pressure step comprise applying air pressure.
Claim 7
Dependent Claim
15 words
The method of claim 1 wherein the method comprises attaching a flip-chip to the substrate.
Claim 8
Dependent Claim
34 words
The method of claim 1 wherein the providing a bead of underfill material step comprises providing a continuous bead of underfill material extending from the substrate to all the sides of the semiconductor device.
Claim 9
Dependent Claim
17 words
The method of claim 1 wherein the method comprises attaching a flip-chip chip carrier to a substrate.
Claim 10
Independent Claim
120 words
A method of attaching a flip-chip bonded integrated circuit to a substrate not having a through-hole, comprising the steps of: electrically interconnecting the flip-chip bonded integrated circuit on the substrate; providing a bead of underfill material on the substrate about the periphery of the integrated circuit; applying at least a partial vacuum to the integrated circuit and the substrate to substantially evacuate entrapped air in the underchip area between the integrated circuit and the substrate by bubbling the entrapped air through the underfill material; and releasing the vacuum by applying fluid pressure to the integrated circuit and the substrate to force at least a portion of the underfill material into the underchip area between the integrated circuit and the substrate.
Claim 11
Independent Claim
120 words
A method of attaching a flip-chip bonded integrated circuit to a substrate not having a through-hole, comprising the steps of: electrically interconnecting the flip-chip bonded integrated circuit on the substrate; providing a bead of underfill material on the substrate about the periphery of the integrated circuit; applying at least a partial vacuum to the integrated circuit and the substrate to substantially evacuate entrapped air in the underchip area between the integrated circuit and the substrate by bubbling the entrapped air through the underfill material; and releasing the vacuum by applying fluid pressure to the integrated circuit and the substrate to force at least a portion of the underfill material into the underchip area between the integrated circuit and the substrate.
Claim 12
Independent Claim
140 words
A method of attaching a flip-chip bonded integrated circuit to a printed circuit board not having a through-hole in the area of flip-chip bonding, comprising the steps of: electrically interconnecting the flip-chip bonded integrated circuit on the printed circuit board; providing a bead of underfill material on the printed circuit board about the periphery of the integrated circuit; applying at least a partial vacuum to the integrated circuit and the printed circuit board to substantially evacuate entrapped air in the underchip area between the integrated circuit and the printed circuit board by bubbling the entrapped air through the underfill material; and releasing the vacuum by applying air pressure to the integrated circuit and the printed circuit board to force at least a portion of the underfill material into the underchip area between the integrated circuit and the printed circuit board.
Claim 13
Independent Claim
140 words
A method of attaching a flip-chip bonded integrated circuit to a printed circuit board not having a through-hole in the area of flip-chip bonding, comprising the steps of: electrically interconnecting the flip-chip bonded integrated circuit on the printed circuit board; providing a bead of underfill material on the printed circuit board about the periphery of the integrated circuit; applying at least a partial vacuum to the integrated circuit and the printed circuit board to substantially evacuate entrapped air in the underchip area between the integrated circuit and the printed circuit board by bubbling the entrapped air through the underfill material; and releasing the vacuum by applying air pressure to the integrated circuit and the printed circuit board to force at least a portion of the underfill material into the underchip area between the integrated circuit and the printed circuit board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-19 | 1996-10-19 | 1997-04-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-19 | 2000-10-19 | 2001-04-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-19 | 2004-10-19 | 2005-04-20 | $7700.00 | Window Closed / Lapsed |