US5323947A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement
Assignee: NXP USA Inc
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Filing: 1993-05-03
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Granted: 1994-06-28
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Expires: 2013-05-03
Abstract
Abstract A method and apparatus for use in forming pre-positioned solder bumps (104) on a pad arrangement (100) of a substrate (101) include placing a predetermined pattern (306) of solder preforms (304) in contact with a meltable adhesive fluxing agent (302) on a carrier tape (402), and then heating the fluxing agent (302) to melt it. Next, the fluxing agent (302) is cooled to resolidify it, thereby securing the solder preforms (304) to the carrier tape (402). The carrier tape (402) is then aligned over the pad arrangement (100) and the solder preforms (304) are transferred to the pad arrangement (100) by heating the solder preforms (304) to form the solder bumps (104) in the predetermined pattern (306).
Inventors
- 👤 Frank Juskey
- 👤 Kenneth M. Wasko
- 👤 Douglas W. Hendricks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:27
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/20; B23K1/203; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H10; H10W; H10W70/00; H10W70/099; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10424; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0156; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/041; H05K2203/043; H05K3/3489; H05K3/36; H05K3/361; H05K3/363; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
99 words
A method of attaching a predetermined pattern of solder preforms onto a carrier tape for use in forming pre-positioned solder bumps on a pad arrangement of a substrate, the method comprising the steps of: placing the predetermined pattern of solder preforms into contact with a meltable adhesive fluxing agent on the carrier tape; heating the fluxing agent to melt the fluxing agent while the predetermined pattern of solder preforms is in contact with the fluxing agent; and thereafter cooling the fluxing agent to solidify the fluxing agent, thereby securing the predetermined pattern of solder preforms to the carrier tape.
Claim 2
Independent Claim
99 words
A method of attaching a predetermined pattern of solder preforms onto a carrier tape for use in forming pre-positioned solder bumps on a pad arrangement of a substrate, the method comprising the steps of: placing the predetermined pattern of solder preforms into contact with a meltable adhesive fluxing agent on the carrier tape; heating the fluxing agent to melt the fluxing agent while the predetermined pattern of solder preforms is in contact with the fluxing agent; and thereafter cooling the fluxing agent to solidify the fluxing agent, thereby securing the predetermined pattern of solder preforms to the carrier tape.
Claim 3
Dependent Claim
32 words
The method of claim 1, further comprising the step of repeating the placing, heating, and cooling steps to attach a plurality of the predetermined patterns of solder preforms onto the carrier tape.
Claim 4
Dependent Claim
31 words
The method of claim 1, further comprising the step of adding registration means to the carrier tape prior to said placing step for registering the carrier tape to a tooling fixture.
Claim 5
Dependent Claim
25 words
The method of claim 1, further comprising the step of coating the carrier tape with the meltable adhesive fluxing agent prior to said placing step.
Claim 6
Dependent Claim
30 words
The method of claim 1, wherein the placing step comprises the step of loading a tooling fixture with the solder preforms to pre-position the solder preforms into the predetermined pattern.
Claim 7
Dependent Claim
25 words
The method of claim 1 wherein the carrier tape is formed of a material selected from the group of materials consisting of polyimide and polyetherimide.
Claim 8
Dependent Claim
20 words
The method of claim 1 wherein the meltable adhesive fluxing agent is a medium molecular weight organic poly acid compound.
Claim 9
Dependent Claim
47 words
The method of claim 1, wherein the placing step further comprises the step of positioning the carrier tape into contact with the predetermined pattern of solder preforms in a tooling fixture such that registration means of the carrier tape registers with aligning means of the tooling fixture.
Claim 10
Dependent Claim
36 words
The method of claim 8, wherein the heating step comprises the step of releasing the solder preforms from the tooling fixture, thereby allowing the predetermined pattern of solder preforms to adhere to the melted fluxing agent.
Claim 11
Independent Claim
69 words
A method of forming pre-positioned solder bumps on a pad arrangement of a substrate, the method comprising the steps of: positioning a predetermined pattern of solder preforms attached to a carrier tape by a meltable adhesive fluxing agent into aligned contact with the pad arrangement on the substrate; and transferring thereafter the predetermined pattern of solder preforms to the pad arrangement by heating the predetermined pattern of solder preforms.
Claim 12
Independent Claim
69 words
A method of forming pre-positioned solder bumps on a pad arrangement of a substrate, the method comprising the steps of: positioning a predetermined pattern of solder preforms attached to a carrier tape by a meltable adhesive fluxing agent into aligned contact with the pad arrangement on the substrate; and transferring thereafter the predetermined pattern of solder preforms to the pad arrangement by heating the predetermined pattern of solder preforms.
Claim 13
Dependent Claim
25 words
The method of claim 10, wherein the transferring step comprises the step of heating the predetermined pattern of solder preforms by a reflow soldering process.
Claim 14
Dependent Claim
21 words
The method of claim 10, wherein the positioning step comprises the step of loading a tooling fixture with the carrier tape.
Claim 15
Dependent Claim
22 words
The method of claim 10, wherein the positioning step further comprises the step of aligning the carrier tape with the pad arrangement.
Claim 16
Dependent Claim
33 words
The method of claim 13, wherein the positioning step further comprises the step of placing the predetermined pattern of solder preforms attached to the aligned carrier tape into contact with the pad arrangement.
Claim 17
Dependent Claim
83 words
A processed tape for use in forming pre-positioned solder bumps on a pad arrangement of a substrate, the processed tape comprising: a carrier tape; a meltable adhesive fluxing agent coated onto the carrier tape for attaching a predetermined pattern of solder preforms thereto; and the predetermined pattern of solder preforms secured to the meltable adhesive fluxing agent through a process of heating and subsequently cooling the fluxing agent while the fluxing agent is positioned in contact with the predetermined pattern of solder preforms.
Claim 18
Dependent Claim
83 words
A processed tape for use in forming pre-positioned solder bumps on a pad arrangement of a substrate, the processed tape comprising: a carrier tape; a meltable adhesive fluxing agent coated onto the carrier tape for attaching a predetermined pattern of solder preforms thereto; and the predetermined pattern of solder preforms secured to the meltable adhesive fluxing agent through a process of heating and subsequently cooling the fluxing agent while the fluxing agent is positioned in contact with the predetermined pattern of solder preforms.
Claim 19
Dependent Claim
22 words
The processed tape of claim 15, further comprising a plurality of the predetermined patterns of solder preforms secured to the carrier tape.
Claim 20
Dependent Claim
19 words
The processed tape of claim 15, further comprising registration means for registering the carrier tape to a tooling fixture.
Claim 21
Dependent Claim
26 words
The processed tape of claim 15, wherein the carrier tape is formed of a material selected from the group of materials consisting of polyimide and polyetherimide.
Claim 22
Dependent Claim
21 words
The processed tape of claim 15, wherein the meltable adhesive fluxing agent is a medium molecular weight organic poly acid compound.
References Cited (Backward Citations)
US3396894A
Cited
US4462534A
Cited
US4897918A
Cited
US4720324A
Cited
US4680199A
Cited
US4832255A
Cited
US5088639A
Cited
US5118027A
Cited
US5205896A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-27 | 1997-12-27 | 1998-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-27 | 2001-12-27 | 2002-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-27 | 2005-12-27 | 2006-06-28 | $7700.00 | Window Closed / Lapsed |