US5700723A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of packaging an integrated circuit
Assignee: Bell Semiconductor LLC
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Filing: 1996-05-15
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Granted: 1997-12-23
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Expires: 2016-05-15
Abstract
Abstract A method of packaging an integrated circuit. The integrated circuit is connected to a substrate, and a mold is applied to the substrate. The mold and the substrate define a cavity and at least one covered chase, and the integrated circuit is disposed within the cavity. A compound is injected into the cavity through one of the covered chases, underfilling and encapsulating the integrated circuit. In one embodiment the mold is then removed from the substrate. In an alternate embodiment the mold is fixedly applied to the substrate.
Inventors
- 👤 Ivor G. Barber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:09
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/01; H10W74/016; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
67 words
A method of packaging an integrated circuit comprising: connecting the integrated circuit to a substrate, applying a mold to the substrate, the mold and substrate defining a cavity and at least one covered chase extending from the cavity to the exterior of the applied mold and substrate, the integrated circuit disposed within the cavity, and injecting a compound into the cavity through one of the covered chases.
Claim 2
Independent Claim
67 words
A method of packaging an integrated circuit comprising: connecting the integrated circuit to a substrate, applying a mold to the substrate, the mold and substrate defining a cavity and at least one covered chase extending from the cavity to the exterior of the applied mold and substrate, the integrated circuit disposed within the cavity, and injecting a compound into the cavity through one of the covered chases.
Claim 3
Dependent Claim
18 words
The method of claim 1 further comprising underfilling the integrated circuit with the compound injected into the cavity.
Claim 4
Dependent Claim
18 words
The method of claim 1 further comprising encapsulating the integrated circuit with the compound injected into the cavity.
Claim 5
Dependent Claim
26 words
The method of claim 1 wherein the step of connecting the integrated circuit to a substrate further comprises electrically connecting the integrated circuit to a substrate.
Claim 6
Dependent Claim
27 words
The method of claim 1 wherein the step of applying a mold to the substrate further comprises fixedly applying a mold to the substrate using an adhesive.
Claim 7
Dependent Claim
29 words
The method of claim 1 wherein the step of applying a mold to the substrate further comprises fixedly applying a heat conductive mold to the substrate using an adhesive.
Claim 8
Dependent Claim
25 words
The method of claim 1 wherein the step of injecting a compound into the cavity further comprises injecting a heat conductive epoxy into the cavity.
Claim 9
Dependent Claim
13 words
The method of claim 1 further comprising removing the mold from the substrate.
Claim 10
Dependent Claim
11 words
A packaged integrated circuit made by the method of claim 1.
Claim 11
Independent Claim
76 words
A method of packaging an integrated circuit comprising: electrically connecting the integrated circuit to a substrate, fixedly applying a heat conductive mold to the substrate using an adhesive, the mold and substrate defining a cavity and at least one covered chase extending from the cavity to the exterior of the applied mold and substrate, the integrated circuit disposed within the cavity, and injecting a heat conductive epoxy into the cavity through one of the covered chases.
Claim 12
Independent Claim
76 words
A method of packaging an integrated circuit comprising: electrically connecting the integrated circuit to a substrate, fixedly applying a heat conductive mold to the substrate using an adhesive, the mold and substrate defining a cavity and at least one covered chase extending from the cavity to the exterior of the applied mold and substrate, the integrated circuit disposed within the cavity, and injecting a heat conductive epoxy into the cavity through one of the covered chases.
Claim 13
Dependent Claim
18 words
The method of claim 10 further comprising underfilling the integrated circuit with the compound injected into the cavity.
Claim 14
Dependent Claim
18 words
The method of claim 10 further comprising encapsulating the integrated circuit with the compound injected into the cavity.
Claim 15
Dependent Claim
11 words
A packaged integrated circuit made by the method of claim 10.
Claim 16
Independent Claim
64 words
A method of packaging an integrated circuit comprising: electrically connecting the integrated circuit to a substrate, removably applying a mold to the substrate, the mold and substrate defining a cavity and at least one covered chase, the integrated circuit disposed within the cavity, injecting a heat conductive epoxy into the cavity through one of the covered chases, and removing the mold from the substrate.
Claim 17
Independent Claim
64 words
A method of packaging an integrated circuit comprising: electrically connecting the integrated circuit to a substrate, removably applying a mold to the substrate, the mold and substrate defining a cavity and at least one covered chase, the integrated circuit disposed within the cavity, injecting a heat conductive epoxy into the cavity through one of the covered chases, and removing the mold from the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-22 | 2001-06-23 | 2001-12-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-22 | 2005-06-23 | 2005-12-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-22 | 2009-06-23 | 2009-12-23 | $7700.00 | Window Closed / Lapsed |