US5557150A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Overmolded semiconductor package
Assignee: LSI Corp
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Filing: 1995-04-27
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Granted: 1996-09-17
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Expires: 2015-04-27
Abstract
Abstract A technique for providing partially and fully overmolded semiconductor packages is described which prevents delamination (detachment) of the molding compound from the substrate by allowing the molding compound to flow through holes in the substrate and forming it into rivet-like anchors on the opposite side of the substrate. Various shapes of rivet-like anchors are described. Different embodiments provide for the formation of molded standoffs and locating pins integral to the anchor structures.
Inventors
- 👤 Patrick Variot
- 👤 Chok J. Chia
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 08:52
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70425; G03F7/70433; H; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W46/00; H10W70/00; H10W70/40; H10W70/421; H10W70/464; H10W70/479; H10W70/60; H10W70/62; H10W70/65; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W46/601; H10W70/67; H10W70/68; H10W70/681; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W74/127; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
94 words
An overmolded semiconductor package, comprising: a sandwich structure of a leadframe disposed between an upper substrate and a lower substrate; a semiconductor die mounted within an opening in the lower substrate and connected to wiring traces disposed on the lower substrate; means for selectively electrically connecting the wiring traces to leads of the leadframe; at least one hole extending through the upper and lower substrates; and a plastic molded structure disposed over the die and partially over the lower substrate, and extending through the at least one hole of the upper and lower substrates.
Claim 2
Dependent Claim
94 words
An overmolded semiconductor package, comprising: a sandwich structure of a leadframe disposed between an upper substrate and a lower substrate; a semiconductor die mounted within an opening in the lower substrate and connected to wiring traces disposed on the lower substrate; means for selectively electrically connecting the wiring traces to leads of the leadframe; at least one hole extending through the upper and lower substrates; and a plastic molded structure disposed over the die and partially over the lower substrate, and extending through the at least one hole of the upper and lower substrates.
Claim 3
Dependent Claim
56 words
An overmolded semiconductor package according to claim 1, wherein: at least a portion of the plastic molded structure includes locating pins arranged in a pattern; and the pattern of the locating pins is adapted to enforce a particular orientation of the package when inserted into a set of corresponding holes formed in a printed circuit board.
Claim 4
Dependent Claim
16 words
An overmolded semiconductor package according to claim 1, wherein the molded structure includes a rivet-like anchor.
Claim 5
Dependent Claim
15 words
An overmolded semiconductor package according to claim 1, wherein the molded structure includes a standoff.
Claim 6
Dependent Claim
16 words
An overmolded semiconductor package according to claim 1, wherein the molded structure includes a locating pin.
Claim 7
Dependent Claim
20 words
An overmolded semiconductor package according to claim 1, wherein the molded structure includes a standoff with locating pin extending therefrom.
References Cited (Backward Citations)
JPH01106449A
Cited
JPH01191457A
Cited
JPH02205055A
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JPH03116856A
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US5136366A
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US5255157A
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US5262927A
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US5355283A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-17 | 2000-03-18 | 2000-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-17 | 2004-03-18 | 2004-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-17 | 2008-03-18 | 2008-09-17 | $7700.00 | Window Closed / Lapsed |