US5814882A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Seal structure for tape carrier package
Assignee: NEC Corp
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Filing: 1995-07-06
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Granted: 1998-09-29
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Expires: 2015-07-06
Abstract
Abstract An organic insulation film has inner leads electrically connecting a conductor thereof with an LSI chip. The inner leads are connected to pads on the periphery of the LSI chip. The connecting portions between the inner leads and the pads of the LSI chip are sealed by casting a plastic seal. The plastic seal extends over the back side of the organic insulative film. The projected portion of the plastic seal at the back side of the organic insulative film is covered with a moisture-proofing seal member to provide more inexpensive than transfer molding and highly reliable seal structure for a tape carrier package.
Inventors
- 👤 Yuzo Shimada
- 👤 Koetsu Tamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:56
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/131; H10W74/141; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
95 words
A seal structure for a tape carrier package comprising: an organic insulation film formed with a conductor pattern; inner leads electrically connected to said conductor pattern; a chip electrically connected to said inner leads to establish a structure wherein a connecting portion between a circuit surface of said chip and said inner leads 15 covered with a plastic member; and a cap for covering said plastic member projecting from a back surface of said organic insulation film, wherein said chip sits above said inner leads projecting from a front surface of said organic insulation film.
Claim 2
Dependent Claim
95 words
A seal structure for a tape carrier package comprising: an organic insulation film formed with a conductor pattern; inner leads electrically connected to said conductor pattern; a chip electrically connected to said inner leads to establish a structure wherein a connecting portion between a circuit surface of said chip and said inner leads 15 covered with a plastic member; and a cap for covering said plastic member projecting from a back surface of said organic insulation film, wherein said chip sits above said inner leads projecting from a front surface of said organic insulation film.
Claim 3
Dependent Claim
46 words
A seal structure for a tape carrier package as set forth in claim 1, which further comprises: a heat radiation plate mounted on a top surface of said chip; and a framing plate shielding a gap between said heat radiation plate and said organic insulation film.
Claim 4
Dependent Claim
35 words
A seal structure for a tape carrier package as set forth in claim 2, wherein said plastic member is filled in a space defined by said cap, said framing plate, and said heat radiation plate.
Claim 5
Dependent Claim
21 words
A seal structure for a tape carrier package as set forth in claim 1, wherein said cap comprises a ceramic cap.
Claim 6
Dependent Claim
30 words
A seal structure for a tape carrier package as set forth in claim 2, wherein said cap comprises a ceramic cap and said framing plate comprises a ceramic framing plate.
Claim 7
Dependent Claim
30 words
A seal structure for a tape carrier package as set forth in claim 3, wherein said cap comprises a ceramic cap and said framing plate comprises a ceramic framing plate.
Claim 8
Dependent Claim
22 words
A seal structure for a tape carrier package as set forth in claim 1, wherein said cap member comprises a metallic cap.
Claim 9
Dependent Claim
31 words
A seal structure for a tape carrier package as set forth in claim 2, wherein said cap member comprises a metallic cap and said framing plate comprises a metallic framing plate.
Claim 10
Dependent Claim
31 words
A seal structure for a tape carrier package as set forth in claim 3, wherein said cap member comprises a metallic cap and said framing plate comprises a metallic framing plate.
Claim 11
Dependent Claim
23 words
A seal structure for a tape carrier package as set forth in claim 7, wherein said metallic cap comprises an outer insulation layer.
Claim 12
Dependent Claim
35 words
A seal structure for a tape carrier package as set forth in claim 8, wherein said metallic cap comprises a first outer insulation layer, and said metallic framing member comprises a second outer insulation layer.
Claim 13
Dependent Claim
35 words
A seal structure for a tape carrier package as set forth in claim 9, wherein said metallic cap comprises a first outer insulation layer, and said metallic framing member comprises a second outer insulation layer.
Claim 14
Dependent Claim
104 words
A seal structure for a tape carrier package comprising a semiconductor chip connected with leads to a conductive pattern on an insulating film, said seal structure comprising: a plastic sealing member covering connecting portions between said leads and a circuit surface of said semiconductor chip; and a hermetic sealing member covering said plastic sealing member for establishing a moisture-proof seal around said plastic sealing member, said hermetic sealing member comprises a cap attached to an underside of said insulating film under said semiconductor chip, wherein a gap between an underside of said semiconductor chip and said cap is filled with said plastic sealing member.
Claim 15
Dependent Claim
104 words
A seal structure for a tape carrier package comprising a semiconductor chip connected with leads to a conductive pattern on an insulating film, said seal structure comprising: a plastic sealing member covering connecting portions between said leads and a circuit surface of said semiconductor chip; and a hermetic sealing member covering said plastic sealing member for establishing a moisture-proof seal around said plastic sealing member, said hermetic sealing member comprises a cap attached to an underside of said insulating film under said semiconductor chip, wherein a gap between an underside of said semiconductor chip and said cap is filled with said plastic sealing member.
Claim 16
Dependent Claim
34 words
A seal structure for a tape carrier package as set forth in claim 12, wherein said plastic sealing member comprises a plastic material having an adhesion property which fixes to said hermetic sealing member.
Claim 17
Dependent Claim
23 words
A seal structure for a tape carrier package as set forth in claim 12, wherein said hermetic sealing member comprises a moisture-proof ceramic.
Claim 18
Dependent Claim
22 words
A seal structure for a tape carrier package as set forth in claim 12, wherein said hermetic sealing member comprises a metal.
Claim 19
Dependent Claim
103 words
A hermetically sealed semiconductor package, comprising: an electrically insulating film; conductive wiring on said electrically insulating film; a semiconductor chip having bonding pads around a periphery of a bottom surface, said semiconductor chip positioned over an opening in said electrically insulating film; leads for electrically connecting said bonding pads to said conductive wiring; a cap positioned under said electrically insulating film for covering said opening in said electrically insulating film; and a hermetic sealing plastic filling said cap to encapsulate said leads, and said bonding pads, and a bottom surface of said semiconductor chip to create a hermetic seal to said semiconductor chip.
Claim 20
Dependent Claim
103 words
A hermetically sealed semiconductor package, comprising: an electrically insulating film; conductive wiring on said electrically insulating film; a semiconductor chip having bonding pads around a periphery of a bottom surface, said semiconductor chip positioned over an opening in said electrically insulating film; leads for electrically connecting said bonding pads to said conductive wiring; a cap positioned under said electrically insulating film for covering said opening in said electrically insulating film; and a hermetic sealing plastic filling said cap to encapsulate said leads, and said bonding pads, and a bottom surface of said semiconductor chip to create a hermetic seal to said semiconductor chip.
Claim 21
Dependent Claim
18 words
A hermetically sealed semiconductor package as recited in claim 17 wherein said cap comprises an outer insulating coating.
Claim 22
Dependent Claim
37 words
A hermetically sealed semiconductor package as recited in claim 17 further comprising a heat sink mounted to a top surface of said semiconductor chip, wherein said hermetic sealing plastic forms a hermetic seal with said heat sink.
Claim 23
Dependent Claim
16 words
A hermetically sealed semiconductor package as recited in claim 17 wherein said cap comprises a ceramic.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-28 | 2002-03-30 | 2002-09-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-28 | 2006-03-30 | 2006-09-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-28 | 2010-03-30 | 2010-09-29 | $7700.00 | Window Closed / Lapsed |