Patent US6066889A successfully refreshed from Google Patents.
US6066889A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods of selectively filling apertures
Assignee: International Business Machines Corp
•
Filing: 1998-09-22
•
Granted: 2000-05-23
•
Expires: 2018-09-22
Abstract
Abstract A novel method of filling apertures in substrates, such as through holes, is provided. The method utilizes a photoimageable film, and comprises the following steps: applying a photoimagable, hole fill film over the apertures; reflowing the hole fill film to flow into the apertures; exposing the hole fill film to actinic radiation, preferably ultraviolet light, through a phototool, which preferably has openings slightly larger than the diameter of the apertures; then at least partially curing the hole fill film; and developing the hole fill film to remove the unexposed hole fill film. An advantage of the present method is that the apertures may be selectively filled. After the apertures are filled, the hole fill film is cured, preferably by baking. Thereafter, the substrate is preferably subjected to further processing steps; for example, nubs of cured hole fill film are preferably removed. If desired, the substrate is circuitized. If desired, features are gold plated, such as for example, electrolessly gold plated. The hole fill film preferably has solids which comprise 0 to about 20% of a thixotrope and about 80% to about 100% parts of an epoxy resin system; the epoxy resin system comprises: from about 10% to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; from about 35% to about 50% of a diglycidyl ether of bisphenol A, preferably halogenated, and having a molecular weight of from about 600 to about 2,500; and from about 0.1 to about 15 parts by weight of the total resin weight, a cationic photoinitiator. The invention also relates to circuitized structures produced according to the method.
Inventors
- 👤 Gerald Walter Jones
- 👤 Heike Marcello
- 👤 Kostas Papathomas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:55
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H05; H05K; H05K3/00; H05K3/0094; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/0959; H05K2203/00; H05K2203/02; H05K2203/0278; H05K3/0073; H05K3/0082
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
125 words
A circuitized structure comprising: a circuitized substrate; apertures disposed in said circuitized substrate; cured hole fill film disposed in said apertures; wherein the hole fill film comprises solids which comprise an epoxy resin system comprising: i. from about 10 to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; ii. from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; iii. from 0 to 50% of a diglycidyl ether of bisphenol A having a molecular weight of from about 600 to about 2,500; from 0 to about 20% of a thixotrope.
Claim 2
Dependent Claim
125 words
A circuitized structure comprising: a circuitized substrate; apertures disposed in said circuitized substrate; cured hole fill film disposed in said apertures; wherein the hole fill film comprises solids which comprise an epoxy resin system comprising: i. from about 10 to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; ii. from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; iii. from 0 to 50% of a diglycidyl ether of bisphenol A having a molecular weight of from about 600 to about 2,500; from 0 to about 20% of a thixotrope.
Claim 3
Dependent Claim
81 words
The circuitized structure of claim 1, wherein there is: from about 20% to about 40% of phenoxy polyol resin having a molecular weight of from about 60,000 to about 90,000; from about 25 to about 30% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 5,000 to about 7,000; from about 35 to about 50%, of a brominated diglycidyl ether of bisphenol A having a molecular weight of from about 1,000 to about 1,700.
Claim 4
Dependent Claim
124 words
The circuitized structure of claim 2, wherein there is: about 30% of phenoxy polyol resin having an epoxide value of about 0.03 equivalents per kg, a weight per epoxide of about 37,000 and a glass transition temperature of about 98° C.; about 25% of an octafunctional epoxy bisphenol A formaldehyde novolac resin having an epoxide value of about 4.7 equivalents per kilogram, as weight per epoxide of about 215 and a melting point of about 82° C.; about 45% diglycidyl ether a tetrabromobisphenol A having an epoxide value of about 1.5 equivalents per kilogram, a weight per epoxide of about 675 and a melting point of about 97° C.; and about 5 parts by weight of the resin weight complex triarylsulfonium hexafluoroantimonate salt photoinitiator.
Claim 5
Dependent Claim
35 words
The circuitized structure of claim 2, wherein the circuitized structure is a circuit board, card, carrier, organic or inorganic single chip module, organic or inorganic multi-chip module, ceramic carrier, laminate chip carrier or interposer card.
Claim 6
Dependent Claim
19 words
The circuitized structure of claim 3, wherein the circuitized structure is a printed circuit board or laminate chip carrier.
Claim 7
Dependent Claim
173 words
A circuitized structure comprising: a circuitized substrate; apertures disposed in said substrate filled with cured hole fill film; wherein the hole fill film comprises solids which comprise an epoxy resin system comprising: i. from about 10 to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; ii. from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; iii. from 0 to 50% of a diglycidyl ether of bisphenol A having a molecular weight of from about 600 to about 2,500; iv. from about 0.1 to 15 parts by weight of the total resin weight, a cationic photoinitiator; and from 0 to about 20% of a thixotrope; an electrolessly plated structure, disposed on and in contact with the substrate; solder mask disposed on, and in contact with the substrate; electronic components, soldered or wire bonded to the electrolessly plated structure.
Claim 8
Dependent Claim
173 words
A circuitized structure comprising: a circuitized substrate; apertures disposed in said substrate filled with cured hole fill film; wherein the hole fill film comprises solids which comprise an epoxy resin system comprising: i. from about 10 to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; ii. from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; iii. from 0 to 50% of a diglycidyl ether of bisphenol A having a molecular weight of from about 600 to about 2,500; iv. from about 0.1 to 15 parts by weight of the total resin weight, a cationic photoinitiator; and from 0 to about 20% of a thixotrope; an electrolessly plated structure, disposed on and in contact with the substrate; solder mask disposed on, and in contact with the substrate; electronic components, soldered or wire bonded to the electrolessly plated structure.
Claim 9
Dependent Claim
81 words
The circuitized structure of claim 6, wherein there is: from about 20% to about 40% of phenoxy polyol resin having a molecular weight of from about 60,000 to about 90,000; from about 25 to about 30% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 5,000 to about 7,000; from about 35 to about 50%, of a brominated diglycidyl ether of bisphenol A having a molecular weight of from about 1,000 to about 1,700.
Claim 10
Dependent Claim
124 words
The circuitized structure of claim 7, wherein there is: about 30% of phenoxy polyol resin having an epoxide value of about 0.03 equivalents per kg, a weight per epoxide of about 37,000 and a glass transition temperature of about 98° C.; about 25% of an octafunctional epoxy bisphenol A formaldehyde novolac resin having an epoxide value of about 4.7 equivalents per kilogram, as weight per epoxide of about 215 and a melting point of about 82° C.; about 45% diglycidyl ether a tetrabromobisphenol A having an epoxide value of about 1.5 equivalents per kilogram, a weight per epoxide of about 675 and a melting point of about 97° C.; and about 5 parts by weight of the resin weight complex triarylsulfonium hexafluoroantimonate salt photoinitiator.
Claim 11
Dependent Claim
35 words
The circuitized structure of claim 6, wherein the circuitized structure is a circuit board, card, carrier, organic or inorganic single chip module, organic or inorganic multi-chip module, ceramic carrier, laminate chip carrier or interposer card.
Claim 12
Dependent Claim
19 words
The circuitized structure of claim 8, wherein the circuitized structure is a printed circuit board or laminate chip carrier.
References Cited (Backward Citations)
US4058401A
Cited
US4069055A
Cited
US4175963A
Cited
US3982045A
Cited
US4081276A
Cited
US4138255A
Cited
US4169732A
Cited
US4230814A
Cited
US4246147A
Cited
US4376815A
Cited
US4378074A
Cited
US4358552A
Cited
US4544623A
Cited
US4442197A
Cited
US4693961A
Cited
US4855333A
Cited
US4451550A
Cited
US4465760A
Cited
US4479983A
Cited
US4735891A
Cited
US4578425A
Cited
US5246817A
Cited
US4882245A
Cited
US5208067A
Cited
US4820549A
Cited
US4701351A
Cited
US5079129A
Cited
JPS63126775A
Cited
US4994346A
Cited
US4867839A
Cited
US4885319A
Cited
US4983252A
Cited
US5502889A
Cited
US5439766A
Cited
US4940651A
Cited
US5264325A
Cited
US5300402A
Cited
US5026624A
Cited
US5278010A
Cited
US5304457A
Cited
US4911786A
Cited
US5667934A
Cited
US5665526A
Cited
US5707749A
Cited
US5276290A
Cited
US5397685A
Cited
US5486655A
Cited
US5443672A
Cited
US5528000A
Cited
US5557844A
Cited
US5654126A
Cited
GB2301826A
Cited
US5883219A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-23 | 2003-11-22 | 2004-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-23 | 2007-11-22 | 2008-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-23 | 2011-11-22 | 2012-05-23 | $7700.00 | Window Closed / Lapsed |