US5304457A
Expired / Lapsed
US
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Composition for photo imaging
Assignee: International Business Machines Corp
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Filing: 1992-10-05
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Granted: 1994-04-19
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Expires: 2012-10-05
Abstract
Abstract An improved photoimagable cationically polymerizable epoxy based coating material is provided. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight of 4,000 to 10,000; and if flame retardancy is required between about 35% and 50% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and 2,500. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
Inventors
- 👤 Richard A. Day
- 👤 Jeffrey D. Gelorme
- 👤 David J. Russell
- 👤 Stephen J. Witt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 21:43
CPC Classifications
G; G03; G03C; G03C1/00; G03C1/72; G03C1/725; C; C08; C08L; C08L63/00; G03F; G03F7/00; G03F7/004; G03F7/038
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
166 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: an epoxy based resin system having solids consistent essentially of between about 10% and about 80% by weight of a polyol resin having epoxy functionality and said polyol resin having a molecular weight of from about 40,000 to about 130,000; between about 20% and about 90% by weight of an epoxidized bromonated bisphenol A resin to impart flame resistance having a molecular weight of from about 4,000 to about 10,000; an effective amount up to about 50% by weight of an epoxidized bromonated bisphenol A resin having a molecular weight of from about 600 to about 2,500 to impart flame resistance; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film.
Claim 2
Dependent Claim
166 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: an epoxy based resin system having solids consistent essentially of between about 10% and about 80% by weight of a polyol resin having epoxy functionality and said polyol resin having a molecular weight of from about 40,000 to about 130,000; between about 20% and about 90% by weight of an epoxidized bromonated bisphenol A resin to impart flame resistance having a molecular weight of from about 4,000 to about 10,000; an effective amount up to about 50% by weight of an epoxidized bromonated bisphenol A resin having a molecular weight of from about 600 to about 2,500 to impart flame resistance; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film.
Claim 3
Dependent Claim
37 words
The invention as defined in claim 1 wherein the molecular weight of the polyol resin is between about 40,000 and about 130,000 and the molecular weight of the polyepoxy resin is between about 4,000 and about 10,000.
Claim 4
Dependent Claim
14 words
The invention as defined in claim 1 wherein the photoinitiator is a sulfonium salt.
Claim 5
Dependent Claim
19 words
The invention as defined in claim 1 further characterized by said resin system being in a moderately polar solvent.
Claim 6
Dependent Claim
16 words
The invention as defined in claim 4 wherein said solvent is propylene glycol monomethyl ether acetate.
Claim 7
Dependent Claim
22 words
The invention as defined in claim 4 wherein there is a concentration of about 40% epoxy resin system solids in the solvent.
Claim 8
Dependent Claim
20 words
The invention as defined in claim 1, wherein the polyol resin is a condensation product of epichlorohydrin and bisphenol A.
Claim 9
Dependent Claim
21 words
The invention as defined in claim 1, wherein the epoxidized novolak resin is an epoxidized octafunctional bisphenol A formaldehyde novolak resin.
Claim 10
Dependent Claim
23 words
The invention as defined in claim 1, wherein the epoxidized bromonated bisphenol A resin is an epoxidized glycidyl ether of tetrabromo bisphenol A.
Claim 11
Dependent Claim
123 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: an epoxy resin system having solids consisting essentially of between about 10% and about 80% by weight of a polyol resin having epoxy functionality and a molecular weight of between about 40,000 and about 130,000; between about 20% and about 90% by weight of an epoxidized novolak resin having a molecular weight between about 4,000 and about 10,000; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film.
Claim 12
Dependent Claim
123 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: an epoxy resin system having solids consisting essentially of between about 10% and about 80% by weight of a polyol resin having epoxy functionality and a molecular weight of between about 40,000 and about 130,000; between about 20% and about 90% by weight of an epoxidized novolak resin having a molecular weight between about 4,000 and about 10,000; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film.
Claim 13
Dependent Claim
20 words
The invention as defined in claim 10, wherein the polyol resin is a condensation product of epichlorohydrin and bisphenol A.
Claim 14
Dependent Claim
21 words
The invention as defined in claim 10, wherein the epoxidized novolak resin is an epoxidized octafunctional bisphenol A formaldehyde novolak resin.
Claim 15
Dependent Claim
179 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: an epoxy resin system having solids consisting essentially of between about 10% and about 80% by weight of a polyol resin having epoxy functionality wherein said polyol resin is a condensation product of epichlorohydrin and bisphenol A and said polyol resin having a molecular weight of from about 40,000 to about 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight of from about 4,000 to about 10,000; an effective amount up to about 50% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A resin having a molecular weight of from about 600 to about 2,500 to impart flame resistance; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film.
Claim 16
Dependent Claim
179 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: an epoxy resin system having solids consisting essentially of between about 10% and about 80% by weight of a polyol resin having epoxy functionality wherein said polyol resin is a condensation product of epichlorohydrin and bisphenol A and said polyol resin having a molecular weight of from about 40,000 to about 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight of from about 4,000 to about 10,000; an effective amount up to about 50% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A resin having a molecular weight of from about 600 to about 2,500 to impart flame resistance; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film.
Claim 17
Dependent Claim
140 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: an epoxy resin system having solids consisting essentially of between about 10% and about 80% by weight of a polyol resin having epoxy functionality wherein said polyol resin is a condensation product of epichlorohydrin and bisphenol A and a molecular weight of between about 40,000 and about 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight between about 4,000 and about 10,000; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film.
Claim 18
Dependent Claim
140 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: an epoxy resin system having solids consisting essentially of between about 10% and about 80% by weight of a polyol resin having epoxy functionality wherein said polyol resin is a condensation product of epichlorohydrin and bisphenol A and a molecular weight of between about 40,000 and about 130,000; between about 20% and about 90% by weight of an epoxidized octafunctional bisphenol A formaldehyde novolak resin having a molecular weight between about 4,000 and about 10,000; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-04-18 | 1997-10-18 | 1998-04-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-04-18 | 2001-10-18 | 2002-04-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-04-18 | 2005-10-18 | 2006-04-19 | $7700.00 | Window Closed / Lapsed |