US5654126A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photodefinable dielectric composition useful in the manufacture of printed circuits
Assignee: MacDermid Acumen Inc
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Filing: 1996-03-15
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Granted: 1997-08-05
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Expires: 2016-03-15
Abstract
Abstract A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.
Inventors
- 👤 Peter Kukanskis
- 👤 Peter Gabriele
- 👤 Raymond Letize
- 👤 William Adams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:50
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/033; G03F7/0035; H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4673; H05K3/4676; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K3/0011; H05K3/0017; H05K3/0023
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
160 words
A process for fabricating a circuitry package comprising: (a) Coating the surface of a substrate with a composition comprising: (1) at least one carboxy functional resin; (2) at least one acrylate oligomer; (3) at least one epoxy functional resin; (4) at least one butadiene nitrile resin; (5) at least one photoinitiator; and (6) at least one reactive monomer; (b) exposing the coating to an imagewise pattern of radiation, to which the composition is responsive, in an mount sufficient to at least partially cure the exposed areas of the composition; (c) developing the exposed composition with a solution which will selectively remove the non-exposed areas of the coating; (d) optionally, further curing the coating which remains on the surface; (e) optionally repeating Steps (a)-(d); (f) depositing a conductive material on at least those portions of the substrate which are not covered by the developed imagewise coating so as to form defined circuitry and interconnects; (g) optionally, repeating steps (a) through (f).
Claim 2
Dependent Claim
160 words
A process for fabricating a circuitry package comprising: (a) Coating the surface of a substrate with a composition comprising: (1) at least one carboxy functional resin; (2) at least one acrylate oligomer; (3) at least one epoxy functional resin; (4) at least one butadiene nitrile resin; (5) at least one photoinitiator; and (6) at least one reactive monomer; (b) exposing the coating to an imagewise pattern of radiation, to which the composition is responsive, in an mount sufficient to at least partially cure the exposed areas of the composition; (c) developing the exposed composition with a solution which will selectively remove the non-exposed areas of the coating; (d) optionally, further curing the coating which remains on the surface; (e) optionally repeating Steps (a)-(d); (f) depositing a conductive material on at least those portions of the substrate which are not covered by the developed imagewise coating so as to form defined circuitry and interconnects; (g) optionally, repeating steps (a) through (f).
Claim 3
Dependent Claim
14 words
A process according to claim 1 wherein the photoinitiator is a non-sulfur bearing photoinitiator.
Claim 4
Dependent Claim
18 words
A process according to claim 2 wherein the butadiene nitrile resin is an epoxy terminated butadiene nitrile resin.
Claim 5
Dependent Claim
18 words
A process according to claim 1 wherein the butadiene nitrile resin is an epoxy terminated butadiene nitrile resin.
Claim 6
Dependent Claim
13 words
A process according to claim 1 wherein the composition also comprises a filler.
Claim 7
Dependent Claim
12 words
A process according to claim 5 wherein the filler is fumed silica.
Claim 8
Dependent Claim
79 words
A process according to claim 1 wherein the composition comprises: (a) from 2 to 50 weight percent of a carboxy functional resin; (b) from 20 to 50 weight percent of an acrylate oligomer; (c) from 20 to 50 weight percent of an epoxy functional resin; (d) from 1 to 10 weight percent of a butadiene nitrile resin; (e) from 2 to 15 weight percent of a photoinitiator; and (f) from 1 to 20 weight percent of a reactive monomer.
Claim 9
Dependent Claim
14 words
A process according to claim 7 wherein the photoinitiator is a non-sulfur bearing photoinitiator.
Claim 10
Dependent Claim
18 words
A process according to claim 7 wherein the butadiene nitrile resin is an epoxy terminated butadiene nitrile resin.
Claim 11
Dependent Claim
13 words
A process according to claim 7 wherein the composition also comprises a filler.
Claim 12
Dependent Claim
12 words
A process according to claim 10 wherein the filler is fumed silica.
Claim 13
Dependent Claim
22 words
A process according to claim 7 wherein the reactive monomer is selected from the group consisting of multifunctional acrylates and multifunctional methacrylates.
Claim 14
Dependent Claim
159 words
A process for fabricating a circuitry package comprising: (a) Coating the surface of a substrate with a composition comprising: (1) at least one carboxy functional resin; (2) at least one acrylate oligomer; (3) at least one epoxy functional resin; (4) at least one butadiene nitrile resin; (5) at least one photoinitiator; and (6) at least one reactive monomer; (b) exposing the coating to an imagewise pattern of radiation, to which the composition is responsive, in an amount sufficient to at least partially cure the exposed areas of the composition; (c) developing the exposed composition with a solution which will selectively remove the non-exposed areas of the coating; (d) optionally, further curing the coating which remains on the surface; (e) optionally repeating steps (a)-(d); (f) depositing a conductive material so as to form defined circuitry and interconnects upon the surface of the coating; (g) optionally, repeating steps (a) through (f) so as to build more than one layer of circuitry.
Claim 15
Dependent Claim
159 words
A process for fabricating a circuitry package comprising: (a) Coating the surface of a substrate with a composition comprising: (1) at least one carboxy functional resin; (2) at least one acrylate oligomer; (3) at least one epoxy functional resin; (4) at least one butadiene nitrile resin; (5) at least one photoinitiator; and (6) at least one reactive monomer; (b) exposing the coating to an imagewise pattern of radiation, to which the composition is responsive, in an amount sufficient to at least partially cure the exposed areas of the composition; (c) developing the exposed composition with a solution which will selectively remove the non-exposed areas of the coating; (d) optionally, further curing the coating which remains on the surface; (e) optionally repeating steps (a)-(d); (f) depositing a conductive material so as to form defined circuitry and interconnects upon the surface of the coating; (g) optionally, repeating steps (a) through (f) so as to build more than one layer of circuitry.
Claim 16
Dependent Claim
13 words
A process according to claim 13 wherein the composition also comprises a filler.
Claim 17
Dependent Claim
12 words
A process according to claim 14 wherein the filler is fumed silica.
Claim 18
Dependent Claim
80 words
A process according to claim 13 wherein the composition comprises: (a) from 2 to 50 weight percent of a carboxy functional resin; (b) from 20 to 50 weight percent of an acrylate oligomer; (c) from 20 to 50 weight percent of an epoxy functional resin; (d) from 1 to 10 weight percent of a butadiene nitrile resin; (e) from 2 to 15 weight percent of a non-sulfur bearing photoinitiator (f) from 1 to 20 weight percent of a reactive monomer.
References Cited (Backward Citations)
US3649274A
Cited
DE2363321A1
Cited
US3982045A
Cited
US4444848A
Cited
US4795693A
Cited
US4847114A
Cited
US4554229A
Cited
US4572764A
Cited
US4902610A
Cited
US5246817A
Cited
US4701351A
Cited
US4976990A
Cited
US4996132A
Cited
US5364736A
Cited
US5122440A
Cited
US5262280A
Cited
EP0570094A2
Cited
US5288589A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-08-04 | 2001-02-03 | 2001-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-08-04 | 2005-02-03 | 2005-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-08-04 | 2009-02-03 | 2009-08-05 | $7700.00 | Window Closed / Lapsed |