Process for metallizing non-conductive substrates

Claim 2

A process for providing a full-coverage, essentially void-free, adherent metal layer on the surface of a non-conductive material, said surface consisting of the surface of a through-hole formed in a printed circuit board substrate material comprised of a glass-reinforced thermosetting or thermoplastic material, said process comprising the steps of: contacting said surface with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surface; depositing on the so-treated surface species catalytic to electroless metal deposition; and contacting said catalyzed surface with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed surface.

Claim 3

A process for fully covering with an adherent essentially void-free metal layer the non-conductive surfaces of a through-hole formed in a printed circuit board substrate material comprised of glass-reinforced thermosetting or thermoplastic material, said process comprising the steps of: contacting said surfaces with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said through-hole surfaces; depositing on the so-treated through-hole surfaces species catalytic to electroless metal deposition; and contacting the catalyzed through-hole surfaces with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 4

A process for fully covering with an adherent essentially void-free metal layer the non-conductive surfaces of a through-hole formed in a printed circuit board substrate material comprised of glass-reinforced thermosetting or thermoplastic material, said process comprising the steps of: contacting said surfaces with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said through-hole surfaces; depositing on the so-treated through-hole surfaces species catalytic to electroless metal deposition; and contacting the catalyzed through-hole surfaces with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 5

In a process for manufacturing printed circuit boards of the double-sided type in which a planar non-conductive substrate material comprised of a glass-reinforced thermosetting or thermoplastic material is provided with conductive circuit patterns on both sides thereof, and in which through-holes are provided through said non-conductive substrate, the surfaces of said through-holes being metallized to provide conductive interconnection between the conductive circuitry patterns on both sides of said substrate, the improvement comprising metallizing the surfaces of said through-holes by a process comprising the steps of: contacting said surfaces with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surfaces; depositing on the so-treated surfaces species catalytic to electroless metal deposition; and contacting the catalyzed through-hole surfaces with an electroless depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 6

In a process for manufacturing printed circuit boards of the double-sided type in which a planar non-conductive substrate material comprised of a glass-reinforced thermosetting or thermoplastic material is provided with conductive circuit patterns on both sides thereof, and in which through-holes are provided through said non-conductive substrate, the surfaces of said through-holes being metallized to provide conductive interconnection between the conductive circuitry patterns on both sides of said substrate, the improvement comprising metallizing the surfaces of said through-holes by a process comprising the steps of: contacting said surfaces with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surfaces; depositing on the so-treated surfaces species catalytic to electroless metal deposition; and contacting the catalyzed through-hole surfaces with an electroless depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 7

In a process for manufacturing printed circuit boards of the multi-layer type, in which a planar composite substrate material is provided comprised of a laminate of alternating parallel layers of metal and non-conductive, glass-reinforced thermosetting or thermoplastic material, and in which through-holes are provided through said composite substrate, the surfaces of said through-holes being metallized to provide conductive interconnection among metal portions of said composite substrate, the improvement comprising metallizing the surfaces of said through-holes by a process comprising the steps of: contacting said surfaces with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surfaces; depositing on the so-treated surfaces species catalytic to electroless metal deposition; and contacting the catalyzed through-hole surfaces with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 8

In a process for manufacturing printed circuit boards of the multi-layer type, in which a planar composite substrate material is provided comprised of a laminate of alternating parallel layers of metal and non-conductive, glass-reinforced thermosetting or thermoplastic material, and in which through-holes are provided through said composite substrate, the surfaces of said through-holes being metallized to provide conductive interconnection among metal portions of said composite substrate, the improvement comprising metallizing the surfaces of said through-holes by a process comprising the steps of: contacting said surfaces with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surfaces; depositing on the so-treated surfaces species catalytic to electroless metal deposition; and contacting the catalyzed through-hole surfaces with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 9

In a process for manufacturing printed circuit boards of the multi-layer type, in which a planar composite substrate material is provided comprised of a laminate of alternating parallel layers of metal and non-conductive, glass-reinforced thermosetting or thermoplastic material, and in which through-holes are provided through said composite substrate, the surfaces of said through-holes being first subjected to a desmearing process and then metallized to provide conductive interconnection among metal portions of said composite substrate, the improvement comprising metallizing the surfaces of said desmeared through-holes by a process comprising the steps of: contacting said surfaces with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surfaces; depositing on the so-treated surfaces species catalytic to electroless metal deposition; and contacting the catalyzed through-hole surfaces with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 10

In a process for manufacturing printed circuit boards of the multi-layer type, in which a planar composite substrate material is provided comprised of a laminate of alternating parallel layers of metal and non-conductive, glass-reinforced thermosetting or thermoplastic material, and in which through-holes are provided through said composite substrate, the surfaces of said through-holes being first subjected to a desmearing process and then metallized to provide conductive interconnection among metal portions of said composite substrate, the improvement comprising metallizing the surfaces of said desmeared through-holes by a process comprising the steps of: contacting said surfaces with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surfaces; depositing on the so-treated surfaces species catalytic to electroless metal deposition; and contacting the catalyzed through-hole surfaces with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 11

The process according to any of claims 1, 2, 3, 4 or 5 wherein said organosilane is a compound represented by the formula: ##STR2## wherein R represents a reactive organic function attached to the silicon atom or to the terminal carbon of the methylene chain bound to the silicon, X represents a readily hydrolyzable moiety, and n is an integer from 0 to 3.

Claim 12

The process according to any of claims 1, 2, 3, 4 or 5 wherein said organosilane compound is an aminoalkylsilane.

Claim 13

The process according to any of claims 1, 2, 3, 4 or 5 wherein said organosilane compound comprises an aqueous admixture containing said compound.

Claim 14

The process according to any of claims 1, 2, 3, 4 or 5 wherein said organosilane compound comprises an aqueous admixture containing said compound in a concentration of from about 0.5 to about 25 g/1.

Claim 15

The process according to any of claims 1, 2, 3, 4 or 5 wherein said organosilane compound comprises an aqueous admixture containing said compound, said aqueous admixture having a pH of from about 7.5 to about 11.

Claim 16

The process according to any of claims 2, 3, 4 or 5 wherein said substrate material is metal-clad on its outerfacing surfaces at the time of said process for metallizing said through-hole surfaces.

Claim 17

A process for providing metallized through-holes in a printed circuit board of the double-sided or multi-layer type, comprising the steps of: (a) providing a printed circuit substrate material comprised of a member selected from the group consisting of (1) a planar non-conductive material comprised of glass-reinforced thermosetting or thermoplastic material clad with metal on both sides thereof and (2) a planar material comprised of alternating layers of metal and non-conductive material comprised of glass-reinforced thermosetting or thermoplastic material, the outer-facing planar surfaces of which are clad with metal; (b) forming through-holes through said printed circuit substrate material; (c) contacting the surfaces of said through-holes with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said through-hole surfaces; (d) thereafter depositing on the so-treated through-hole surfaces species catalytic to electroless metal deposition; and (e) thereafter contacting said catalyzed through-hole surfaces with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 18

A process for providing metallized through-holes in a printed circuit board of the double-sided or multi-layer type, comprising the steps of: (a) providing a printed circuit substrate material comprised of a member selected from the group consisting of (1) a planar non-conductive material comprised of glass-reinforced thermosetting or thermoplastic material clad with metal on both sides thereof and (2) a planar material comprised of alternating layers of metal and non-conductive material comprised of glass-reinforced thermosetting or thermoplastic material, the outer-facing planar surfaces of which are clad with metal; (b) forming through-holes through said printed circuit substrate material; (c) contacting the surfaces of said through-holes with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said through-hole surfaces; (d) thereafter depositing on the so-treated through-hole surfaces species catalytic to electroless metal deposition; and (e) thereafter contacting said catalyzed through-hole surfaces with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed through-hole surfaces.

Claim 19

The process according to claim 12 wherein said printed circuit board is of the multi-layer type and wherein said through-hole surfaces are desmeared between steps (b) and (c).

Claim 20

A process for providing a full-coverage, essentially void-free, adherent metal layer on the surface of a non-conductive material, said surface consisting of the surface of a through-hole formed in a printed circuit board substrate material comprised of a glass-reinforced thermosetting or thermoplastic material, said process comprising the steps of: contacting said surface with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surface; depositing on the so-treated surface species catalytic to electroless metal deposition; and contacting said catalyzed surface with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed surface, wherein said organosilane compound is selected from the group consisting of aminoalkylsilanes, vinylsilanes, ureidoalkylsilane esters, epoxyalkylsilanes, and methacryloalkylsilane esters.

Claim 21

A process for providing a full-coverage, essentially void-free, adherent metal layer on the surface of a non-conductive material, said surface consisting of the surface of a through-hole formed in a printed circuit board substrate material comprised of a glass-reinforced thermosetting or thermoplastic material, said process comprising the steps of: contacting said surface with a conditioning agent consisting essentially of an organosilane compound for a time sufficient to deposit said compound on said surface; depositing on the so-treated surface species catalytic to electroless metal deposition; and contacting said catalyzed surface with an electroless metal depositing solution to deposit metal fully and adherently and essentially void-free onto said catalyzed surface, wherein said organosilane compound is selected from the group consisting of aminoalkylsilanes, vinylsilanes, ureidoalkylsilane esters, epoxyalkylsilanes, and methacryloalkylsilane esters.