US4515829A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Through-hole plating
Assignee: Shipley Co Inc
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Filing: 1983-10-14
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Granted: 1985-05-07
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Expires: 2003-10-14
Abstract
Abstract Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.
Inventors
- 👤 Cheryl A. Deckert
- 👤 Edward C. Couble
- 👤 William F. Bonetti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/381; C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/22; H05K3/0011; H05K3/0055; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783; H05K2203/0786; H05K2203/0793; H05K2203/0796
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
160 words
A process for the manufacture of a printed circuit board having a plurality of metal plated holes interconnecting at least two circuits comprising the steps of, in either order, forming holes in an epoxy printed circuit board material and forming the circuits and thereafter, metallizing the holes, said metallization comprising a pretreatment sequence between the steps of forming the holes and metal plating including the steps of contact of the holes with a first aqueous alkaline solution of an oxygenated epoxy solvent at a pH greater than 10 and at a temperature and for a time sufficient to soften the hole walls, contact with a second solution comprising an aqueous alkaline solution of permanganate ions maintained at an elevated temperature and a pH in excess of 13, and contact with a third solution of a reducing agent for permanganate ions at a temperature and for a time sufficient to remove any manganese residues remaining on the walls of the holes.
Claim 2
Dependent Claim
160 words
A process for the manufacture of a printed circuit board having a plurality of metal plated holes interconnecting at least two circuits comprising the steps of, in either order, forming holes in an epoxy printed circuit board material and forming the circuits and thereafter, metallizing the holes, said metallization comprising a pretreatment sequence between the steps of forming the holes and metal plating including the steps of contact of the holes with a first aqueous alkaline solution of an oxygenated epoxy solvent at a pH greater than 10 and at a temperature and for a time sufficient to soften the hole walls, contact with a second solution comprising an aqueous alkaline solution of permanganate ions maintained at an elevated temperature and a pH in excess of 13, and contact with a third solution of a reducing agent for permanganate ions at a temperature and for a time sufficient to remove any manganese residues remaining on the walls of the holes.
Claim 3
Dependent Claim
43 words
The process of claim 1 where the oxygenated epoxy solvent is an aqueous alkaline solution of an oxygenated organic solvent for epoxy, where the solvent comprises from 10 to 70 percent by volume of the solution and has a pH greater than 10.
Claim 4
Dependent Claim
17 words
The process of claim 2 where the pH of the permanganate solution varies between 13.1 and 13.6.
Claim 5
Dependent Claim
23 words
The process of claim 3 where the concentration of the permanganate ions in solution varies from about 10 to 100 grams per liter.
Claim 6
Dependent Claim
20 words
The process of claim 3 where the permanganate ion is derived from an alkali or alkaline earth metal permanganate salt.
Claim 7
Dependent Claim
14 words
The process of claim 5 where the permanganate ion is derived from potassium permanganate.
Claim 8
Dependent Claim
16 words
The process of claim 6 where the permanganate solution is at a temperature exceeding 140° F.
Claim 9
Dependent Claim
15 words
The process of claim 7 where the temperature varies between 160° F. and 200° F.
Claim 10
Dependent Claim
24 words
The process of claim 8 where a buffer for the permanganate solution is selected from the group of compounds of phosphate; carbonate and borate.
Claim 11
Dependent Claim
12 words
The process of claim 9 where the buffer is a phosphate compound.
Claim 12
Dependent Claim
22 words
The process of claim 3 where the oxygenated solvent is a solvent selected from the group of ketones, ethers and ether alcohols.
Claim 13
Dependent Claim
17 words
The process of claim 11 where the solvent is an aqueous alkaline solution of an aliphatic ether.
Claim 14
Dependent Claim
16 words
The process of claim 11 where the solvent is an aqueous alkaline solution of Butyl Carbitol.
Claim 15
Dependent Claim
19 words
The process of claim 11 where the treatment temperature with the solvent varies between 130° F. and 165° F.
Claim 16
Dependent Claim
26 words
The process of claim 11 where the reducing agent is an aqueous solution of a member from the group of bisulphites, stannous ions, hydroxylamine and sugar.
Claim 17
Dependent Claim
16 words
The process of claim 15 where the reducing agent is an acid solution of hydroxylamine sulfate.
Claim 18
Dependent Claim
21 words
The process of claim 15 where the treatment temperature of the reducing solution varies between about 130° F. and 165° F.
Claim 19
Dependent Claim
15 words
The process of claim 16 where the solution of the reducing agent contains a surfactant.
Claim 20
Dependent Claim
17 words
The process of claim 3 used for the manufacture of a double sided through-hole printed circuit board.
Claim 21
Dependent Claim
15 words
The process of claim 3 used for the manufacture of a multi-layered printed circuit board.
References Cited (Backward Citations)
US4054693A
Cited
US4425380A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-05-06 | 1988-11-05 | 1989-05-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-05-06 | 1992-11-05 | 1993-05-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-05-06 | 1996-11-05 | 1997-05-07 | $7700.00 | Window Closed / Lapsed |