US3978252A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
Assignee: MacDermid Inc
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Filing: 1975-02-24
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Granted: 1976-08-31
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Expires: 1995-02-24
Abstract
Abstract An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil by heat and pressure, chemically stripping the foil from the substrate surface, activating the surface for electroless plating and electrolessly depositing a metal thereon, wherein the substrate is contacted with an aqueous solution containing an organic silicon compound at some stage subsequent to said chemical stripping operation. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment.
Inventors
- 👤 Michael S. Lombardo
- 👤 Elaine F. Jacovich
- 👤 Eugene D. D'Ottavio
- 👤 John J. Grunwald
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 07:14
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/2006; H; H05; H05B; H05B3/00; H05B3/0019; H05K; H05K3/00; H05K3/38; H05K3/389; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31529; Y10T428/31678
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
173 words
The method of improving adhesion between a plastic substrate and a deposited film of metal formed in situ on the surface of the substrate by an electroless metal plating process, which comprises the steps of first forming a laminate of the plastic substrate and a sacrificial metal foil by bonding said foil to said substrate, chemically stripping said foil from the laminate thus formed, activating said substrate for electroless metal deposition, and electrolessly depositing said film of metal thereon, wherein said substrate is contacted by a dilute solution containing an organic silicon compound at some step subsequent to said chemical stripping operation but at least cotemporaneously with the electroless metal deposition step, said organic silicon compound being insufficient in amount to form an intermediate layer thereof between the substrate and said deposited film of metal, said silicon compound being a silane having the general formula: R.Si(R.sub.1).sub.3 where R is an amino substituted lower alkyl radical containing up to 6 carbons and R 1 is a lower alkanoxy radical containing up to 3 carbons.
Claim 2
Independent Claim
173 words
The method of improving adhesion between a plastic substrate and a deposited film of metal formed in situ on the surface of the substrate by an electroless metal plating process, which comprises the steps of first forming a laminate of the plastic substrate and a sacrificial metal foil by bonding said foil to said substrate, chemically stripping said foil from the laminate thus formed, activating said substrate for electroless metal deposition, and electrolessly depositing said film of metal thereon, wherein said substrate is contacted by a dilute solution containing an organic silicon compound at some step subsequent to said chemical stripping operation but at least cotemporaneously with the electroless metal deposition step, said organic silicon compound being insufficient in amount to form an intermediate layer thereof between the substrate and said deposited film of metal, said silicon compound being a silane having the general formula: R.Si(R.sub.1).sub.3 where R is an amino substituted lower alkyl radical containing up to 6 carbons and R 1 is a lower alkanoxy radical containing up to 3 carbons.
Claim 3
Dependent Claim
31 words
The method as defined in claim 1, wherein said substrate is contacted with said organic silicon compound in solution after stripping said sacrificial foil and prior to activation of said substrate.
Claim 4
Dependent Claim
33 words
The method as defined in claim 1, wherein said substrate is contacted with said organic silicon compound in solution after activation of said substrate surface and prior to electroless deposition of metal thereon.
Claim 5
Dependent Claim
26 words
The method as defined in claim 1, wherein said substrate is contacted with said organic silicon compound in solution with said metal to be electrolessly deposited.
Claim 6
Dependent Claim
17 words
The method as defined in claim 1, wherein the plastic substrate is formed of an epoxy resin.
Claim 7
Dependent Claim
21 words
The method as defined in claim 1, wherein said sacrificial metal foil is aluminum anodized in phosphoric or sulfuric acid solution.
Claim 8
Dependent Claim
25 words
The method as defined in claim 1, wherein said silane is a member of the group consisting of gamma-aminopropyl trimethoxy silane and n-beta-(aminoethyl)-gamma-aminopropyl trimethoxy silane.
Claim 9
Dependent Claim
28 words
The method as defined in claim 1, wherein said silane is in aqueous solution and contains from about 0.5 ml to 5 ml per liter of said silane.
Claim 10
Dependent Claim
26 words
The method as defined in claim 8, wherein said substrate is immersed in said silane solution for from 30 seconds to 5 minutes at room temperature.
Claim 11
Independent Claim
147 words
The method of improving the adhesion between a molded plastic substrate and a deposited film of metal formed in situ on the substrate by electroless metal plating or vacuum metallization processes, which comprises the step of subjecting said substrate to contact at room temperature by a dilute solution of an organic silicon compound preliminary to deposition of the metal film thereon, wherein said silicon compound is selected from the group consisting of vinyl-tris(beta-methoxy-ethoxy) silane, gamma-methacryloxy propyltrimethoxy silane, gamma-glycidoxypropyl trimethoxy silane, gamma-aminopropyl trimethoxy silane and n-beta-(aminoethyl)-gamma-aminopropyl trimethoxy silane, and such silicon compound is present in solution from about 0.5 ml/1 to 5.0 ml/l, said organic silicon compound being insufficient in amount in said solution to form an intermediate layer between said substrate and deposited metal film, said substrate being maintained in contact with said organic silicon containing solution for a period of from 30 seconds to 5 minutes.
Claim 12
Independent Claim
147 words
The method of improving the adhesion between a molded plastic substrate and a deposited film of metal formed in situ on the substrate by electroless metal plating or vacuum metallization processes, which comprises the step of subjecting said substrate to contact at room temperature by a dilute solution of an organic silicon compound preliminary to deposition of the metal film thereon, wherein said silicon compound is selected from the group consisting of vinyl-tris(beta-methoxy-ethoxy) silane, gamma-methacryloxy propyltrimethoxy silane, gamma-glycidoxypropyl trimethoxy silane, gamma-aminopropyl trimethoxy silane and n-beta-(aminoethyl)-gamma-aminopropyl trimethoxy silane, and such silicon compound is present in solution from about 0.5 ml/1 to 5.0 ml/l, said organic silicon compound being insufficient in amount in said solution to form an intermediate layer between said substrate and deposited metal film, said substrate being maintained in contact with said organic silicon containing solution for a period of from 30 seconds to 5 minutes.
Claim 13
Dependent Claim
17 words
The method as defined in claim 10, wherein the metal film is applied by vacuum metal deposition.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-08-31 | 1980-03-01 | 1980-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-08-31 | 1984-03-01 | 1984-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-08-31 | 1988-03-01 | 1988-08-31 | $7700.00 | Window Closed / Lapsed |