US5122440A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ultraviolet curing of photosensitive polyimides
Assignee: Individual
•
Filing: 1990-05-07
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Granted: 1992-06-16
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Expires: 2010-05-07
Abstract
Abstract Photosensitive polyimides used in microelectronic structures are cross-linked without exposing the associated microelectronic structures to elevated temperatures that can lower the process yield and reduce the reliability of the microelectronic structures. The photosensitive polyimides are cured by exposing them to deep ultraviolet radiation that has a spectral output effective to crosslink the polyimide. The cross-linking hardens the polyimide and renders it insoluble in solvents such as photoresist strippers.
Inventors
- 👤 Chung-Ping Chien
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:43
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70425; G03F7/70458; G03F7/70466; H; H05; H05K; H05K3/00; H05K3/0073; H05K3/0082; H05K3/46; H05K3/4644
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
96 words
A method for photolithographically patterning a layer comprising a photosensitive polyimide, the method comprising the steps: exposing first portions of the layer to a first dosage of radiation; removing second portions of the layer that were not exposed to the first dosage of radiation; and by contacting the second portions with a developing solvent exposing the first portions remaining after the removing step to a second dosage of ultraviolet radiation, the second dosage of ultraviolet radiation rendering the first portions substantially insoluble in a solvent selected from the group consisting of methylethylketone, acetonitrile, and N-methyl pyrollidone.
Claim 2
Independent Claim
96 words
A method for photolithographically patterning a layer comprising a photosensitive polyimide, the method comprising the steps: exposing first portions of the layer to a first dosage of radiation; removing second portions of the layer that were not exposed to the first dosage of radiation; and by contacting the second portions with a developing solvent exposing the first portions remaining after the removing step to a second dosage of ultraviolet radiation, the second dosage of ultraviolet radiation rendering the first portions substantially insoluble in a solvent selected from the group consisting of methylethylketone, acetonitrile, and N-methyl pyrollidone.
Claim 3
Dependent Claim
20 words
The method of claim 1, wherein the second dosage of ultraviolet radiation is at least about 75 joules/centimeter 2 /micron.
Claim 4
Dependent Claim
20 words
The method of claim 1, wherein the second dosage of ultraviolet radiation is at least about 100 joules/centimeter 2 /micron.
Claim 5
Dependent Claim
19 words
The method of claim 1, wherein the first dosage of radiation has a wavelength ranging above about 300 nanometers.
Claim 6
Dependent Claim
32 words
The method of claim 1, wherein the photosensitive polyimide comprises a polymer represented by the structural unit: ##STR2## wherein R is an aliphatic group and R' is hydrogen or an aliphatic group.
Claim 7
Dependent Claim
128 words
A process for electroplating a conductor seed pattern comprising the steps: providing a layer comprising a photosensitive polyimide over said conductor seed pattern; photolithographically patterning the layer of the photosensitive polyimide by exposing first portions of the layer to a first dosage of radiation and removing the second portions of the layer that were not exposed to the first dosage of radiation by contacting the second portions with a developing solvent; electroplating the conductor seed pattern; and exposing the photolithographically patterned layer of the photosensitive polyimide to a second dosage of ultraviolet radiation, the photolithographically patterned layer of the photosensitive polyimide after being exposed to the second dosage of ultraviolet radiation being substantially insoluble in a solvent selected from the group consisting of methylethylketone, acetonitrile, and N-methyl pyrollidone.
Claim 8
Dependent Claim
128 words
A process for electroplating a conductor seed pattern comprising the steps: providing a layer comprising a photosensitive polyimide over said conductor seed pattern; photolithographically patterning the layer of the photosensitive polyimide by exposing first portions of the layer to a first dosage of radiation and removing the second portions of the layer that were not exposed to the first dosage of radiation by contacting the second portions with a developing solvent; electroplating the conductor seed pattern; and exposing the photolithographically patterned layer of the photosensitive polyimide to a second dosage of ultraviolet radiation, the photolithographically patterned layer of the photosensitive polyimide after being exposed to the second dosage of ultraviolet radiation being substantially insoluble in a solvent selected from the group consisting of methylethylketone, acetonitrile, and N-methyl pyrollidone.
Claim 9
Dependent Claim
21 words
The process of claim 6, wherein the second dosage of ultraviolet radiation has a wavelength ranging between about 200and 280 nanometers.
Claim 10
Dependent Claim
20 words
The process of claim 6, wherein the second dosage of ultraviolet radiation is at least about 75 joules/centimeter 2 /micron.
Claim 11
Dependent Claim
20 words
The process of claim 6, wherein the second dosage of ultraviolet radiation is at least about 100 joules/centimeter 2 /micron.
Claim 12
Dependent Claim
19 words
The process of claim 6, wherein the first dosage of radiation has a wavelength ranging above about 300 nanometers.
Claim 13
Independent Claim
79 words
A method for photolithographically patterning a layer comprising a photosensitive polyimide, the method comprising the steps; exposing first portions of the layer to a first dosage of radiation; removing second portions of the layer that were not exposed to the first dosage of radiation by contacting the second portions with a developing solvent; and exposing the first portions remaining after the removing step to a second dosage of radiation having a wavelength ranging between about 200 to 280 nanometers.
Claim 14
Independent Claim
79 words
A method for photolithographically patterning a layer comprising a photosensitive polyimide, the method comprising the steps; exposing first portions of the layer to a first dosage of radiation; removing second portions of the layer that were not exposed to the first dosage of radiation by contacting the second portions with a developing solvent; and exposing the first portions remaining after the removing step to a second dosage of radiation having a wavelength ranging between about 200 to 280 nanometers.
Claim 15
Dependent Claim
19 words
The method of claim 11, wherein the second dosage of radiation is at least about 75 joules/centimeter 2 /micron.
Claim 16
Dependent Claim
19 words
The method of claim 11, wherein the second dosage of radiation is at least about 100 joules/centimeter 2 /micron.
Claim 17
Dependent Claim
18 words
the method of claim 11, wherein the first dosage of radiation has a wavelength above about 300 nanometers.
Claim 18
Dependent Claim
32 words
The method of claim 11, wherein the photosensitive polyimide comprises a polymer represented by the structural unit: ##STR3## wherein R is an aliphatic group and R' is hydrogen or an aliphatic group.
Claim 19
Dependent Claim
20 words
The process of claim 6, wherein the second dosage of ultraviolet radiation has a wavelength less than about 280 nanometers.
Claim 20
Dependent Claim
20 words
The process of claim 1, wherein the second dosage of ultraviolet radiation has a wavelength less than about 280 nanometers.
Claim 21
Dependent Claim
21 words
The process of claim 1, wherein the second dosage of ultraviolet radiation has a wavelength ranging between 200 and 280 nanometers.
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