US4847114A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Preparation of printed circuit boards by selective metallization
Assignee: Shipley Co Inc
•
Filing: 1988-06-01
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Granted: 1989-07-11
•
Expires: 2008-06-01
Abstract
Abstract The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.
Inventors
- 👤 William R. Brasch
- 👤 Carlo Favini
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:34
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0716; H05K2203/12; H05K2203/122; H05K2203/14; H05K2203/1415; H05K3/38; H05K3/381; H05K3/40; H05K3/42; H05K3/425; H05K3/427
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
180 words
A method for the manufacture of printed circuit boards of plastic construction, which comprises: drilling a plurality of holes through a circuit board comprising a plastic substrate having adhered thereto a metal foil forming a circuit pattern in the foil by the image/print/etch procedure; applying a polymeric resist to the entire surface of the board but not onto the pads or into the holes thereof; treating the imaged board with a charge extender to create a higher differential of charge between the resist image and the surfaces of the hole walls; selectively catalyzing the surfaces of the hole walls with a catalyst having a charge higher than the charge on the surfaces of the hole walls and sufficiently lower than the charge of the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the surface of the hole walls to cause the catalyst to be absorbed thereon; and plating the catalyzed surfaces of the hole walls with a first metal by electroless deposition to form the completed circuit of the circuit board.
Claim 2
Independent Claim
180 words
A method for the manufacture of printed circuit boards of plastic construction, which comprises: drilling a plurality of holes through a circuit board comprising a plastic substrate having adhered thereto a metal foil forming a circuit pattern in the foil by the image/print/etch procedure; applying a polymeric resist to the entire surface of the board but not onto the pads or into the holes thereof; treating the imaged board with a charge extender to create a higher differential of charge between the resist image and the surfaces of the hole walls; selectively catalyzing the surfaces of the hole walls with a catalyst having a charge higher than the charge on the surfaces of the hole walls and sufficiently lower than the charge of the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the surface of the hole walls to cause the catalyst to be absorbed thereon; and plating the catalyzed surfaces of the hole walls with a first metal by electroless deposition to form the completed circuit of the circuit board.
Claim 3
Dependent Claim
25 words
The method of claim 1 wherein the desired circuit pattern is obtained by etching a laminate of a metal foil adhered to a plastic substrate.
Claim 4
Dependent Claim
19 words
The method of claim 1 which further comprises subsequently plating the board with a second metal by electroless deposition.
Claim 5
Dependent Claim
25 words
The method of claim 3 wherein said first metal is copper or nickel and wherein said second metal is tin, a tin-lead alloy, or gold.
Claim 6
Dependent Claim
11 words
The method of claim 1 wherein the catalyst comprises colloidal particles.
Claim 7
Dependent Claim
22 words
The method of claim 5 wherein the colloidal catalyst has a zeta potential between about 3 and 20 (plus or minus) millivolts.
Claim 8
Dependent Claim
11 words
The method of claim 1 wherein the catalyst comprises metal ions.
Claim 9
Dependent Claim
15 words
The method of claim 7 wherein the metal ions are reduced by a reducing agent.
Claim 10
Dependent Claim
29 words
The method of claim 1 wherein the charge extender is an oxidizing agent, a strong base, strong acid, or a surfactant that alters the surface charge of the board.
Claim 11
Dependent Claim
29 words
The method of claim 9 wherein the charge extender is a fatty acid sulfate, an alkyl aryl sulfonate, sulfuric acid, chromic acid, potassium permanganate, hydrogen peroxide or sodium hydroxide.
Claim 12
Dependent Claim
11 words
The method of claim 1 wherein the metal foil is copper.
Claim 13
Independent Claim
150 words
A method for the manufacture of printed circuit boards of plastic construction, which comprises: microroughening the surfaces of a plastic substrate by chemical or mechanical methods; applying a polymeric resist to a portion of the microroughened substrate to form an imaged circuit board; treating the microroughened, imaged board with a charge extender to create a higher differential of charge between the resist image and non-imaged areas; selectively catalyzing those areas not covered by the resist image with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge of the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause the catalyst to be absorbed thereon; and plating the catalyzed areas of the boards with a first metal by electroless deposition to form the completed circuit of the circuit board.
Claim 14
Independent Claim
150 words
A method for the manufacture of printed circuit boards of plastic construction, which comprises: microroughening the surfaces of a plastic substrate by chemical or mechanical methods; applying a polymeric resist to a portion of the microroughened substrate to form an imaged circuit board; treating the microroughened, imaged board with a charge extender to create a higher differential of charge between the resist image and non-imaged areas; selectively catalyzing those areas not covered by the resist image with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge of the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause the catalyst to be absorbed thereon; and plating the catalyzed areas of the boards with a first metal by electroless deposition to form the completed circuit of the circuit board.
Claim 15
Dependent Claim
24 words
The method of claim 12 which further comprises providing said molded board with one or a plurality of holes prior to applying the resist.
Claim 16
Dependent Claim
14 words
The method of claim 12 wherein the plastic substrate is of a molded construction.
Claim 17
Dependent Claim
19 words
The method of claim 12 wherein further comprises subsequently plating the board with a second metal by electroless deposition.
Claim 18
Dependent Claim
25 words
The method of claim 15 wherein said first metal is copper or nickel, and wherein said second metal is tin, a tin-lead alloy, or gold.
Claim 19
Dependent Claim
11 words
The method of claim 12 wherein the catalyst comprises colloidal particles.
Claim 20
Dependent Claim
22 words
The method of claim 17 wherein the colloidal catalyst has a zeta potential between about 3 and 20 (plus or minus) millivolts.
Claim 21
Dependent Claim
11 words
The method of claim 12 wherein the catalyst comprises metal ions.
Claim 22
Dependent Claim
15 words
The method of claim 19 wherein the metal ions are reduced by a reducing agent.
Claim 23
Dependent Claim
29 words
The method of claim 12 wherein the charge extender is an oxidizing agent, a strong base, strong acid, or a surfactant that alters the surface charge of the board.
Claim 24
Dependent Claim
29 words
The method of claim 21 wherein the charge extender is a fatty acid sulfate, an alkyl aryl sulfonate, sulfuric acid, chromic acid, potassium permanganate, hydrogen peroxide or sodium hydroxide.
Claim 25
Dependent Claim
18 words
The method of claim 12 wherein the microroughening step comprises treating the board with an adhesion promotion system.
Claim 26
Independent Claim
167 words
A method for the manufacture of printed circuited boards of plastic construction, which comprises: drilling a plurality of holes through a circuit board comprising a laminate of a metal foil adhered to a molded plastic substrate; etching the board to completely remove the metal foil and expose said plastic surface; applying a polymeric resist to the substrate to form the circuit; treating the imaged board with a charge extender to create a higher differential of charge between the resist image and non-imaged areas; selectively catalyzing those areas not covered by the resist image with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge of the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause the catalyst to be absorbed thereon; and plating the catalyzed areas of the boards with a first metal by electroless deposition to form the completed circuit of the circuit board.
Claim 27
Independent Claim
167 words
A method for the manufacture of printed circuited boards of plastic construction, which comprises: drilling a plurality of holes through a circuit board comprising a laminate of a metal foil adhered to a molded plastic substrate; etching the board to completely remove the metal foil and expose said plastic surface; applying a polymeric resist to the substrate to form the circuit; treating the imaged board with a charge extender to create a higher differential of charge between the resist image and non-imaged areas; selectively catalyzing those areas not covered by the resist image with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge of the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause the catalyst to be absorbed thereon; and plating the catalyzed areas of the boards with a first metal by electroless deposition to form the completed circuit of the circuit board.
Claim 28
Dependent Claim
19 words
The method of claim 24 which further comprises subsequently plating the board with a second metal by electroless deposition.
Claim 29
Dependent Claim
25 words
The method of claim 25 wherein said first metal is copper or nickel and wherein said second metal is tin, a tin-lead alloy, or gold.
Claim 30
Dependent Claim
11 words
The method of claim 24 wherein the catalyst comprises colloidal particles.
Claim 31
Dependent Claim
22 words
The method of claim 27 wherein the colloidal catalyst has a zeta potential between about 3 and 20 (plus or minus) millivolts.
Claim 32
Dependent Claim
11 words
The method of claim 24 wherein the catalyst comprises metal ions.
Claim 33
Dependent Claim
15 words
The method of claim 29 wherein the metal ions are reduced by a reducing agent.
Claim 34
Dependent Claim
29 words
The method of claim 24 wherein the charge extender is an oxidizing agent, a strong base, strong acid, or a surfactant that alters the surface charge of the boards.
Claim 35
Dependent Claim
29 words
The method of claim 31 wherein the charge extender is a fatty acid sulfate, an alkyl aryl sulfonate, sulfuric acid, chromic acid, potassium permanganate, hydrogen peroxide or sodium hydroxide.
Claim 36
Dependent Claim
30 words
The method of claim 24 which further comprises treating the exposed plastic surfaces with an adhesion promotion system after the foil is removed to impart additional microroughening to said surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-10 | 1993-01-09 | 1993-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-10 | 1997-01-09 | 1997-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-10 | 2001-01-09 | 2001-07-11 | $7700.00 | Window Closed / Lapsed |