US4259113A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composition for sensitizing articles for metallization
Assignee: AMP-AKZO Corp A CORP OF
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Filing: 1978-02-21
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Granted: 1981-03-31
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Expires: 1998-02-21
Abstract
Abstract Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with a liquid containing an activatable complex of copper. The copper-containing complexes of the instant invention are the product of forming solutions comprising a halogen component, a cuprous component and a cupric component. The solutions may optionally be in contact with elemental metal.
Inventors
- 👤 Francis J. Nuzzi
- 👤 Edward J. Leech
- 👤 Richard W. Charm
- 👤 Joseph Polichette
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:01
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/2086; C23C18/1851; C23C18/1872; C23C18/1886; C23C18/1893
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
77 words
A aqueous seeder solution for sensitizing a non-metallic surface to the electroless deposition of metal, comprising cuprous ion and cupric ion produced by mixing water, an acid, a halogen-containing compound, a cuprous compound and a cupric compound, wherein the weight ratio of cuprous ion to cupric ion is at least about 0.4 to 1, said seeder solution being capable of forming a water-insoluble derivative upon contacting with water, said water-insoluble derivative being adherent to said non-metallic surface.
Claim 2
Dependent Claim
77 words
A aqueous seeder solution for sensitizing a non-metallic surface to the electroless deposition of metal, comprising cuprous ion and cupric ion produced by mixing water, an acid, a halogen-containing compound, a cuprous compound and a cupric compound, wherein the weight ratio of cuprous ion to cupric ion is at least about 0.4 to 1, said seeder solution being capable of forming a water-insoluble derivative upon contacting with water, said water-insoluble derivative being adherent to said non-metallic surface.
Claim 3
Dependent Claim
16 words
A aqueous seeder solution as defined in claim 1, wherein said halogen-containing compound is a chloride.
Claim 4
Dependent Claim
32 words
A aqueous seeder solution as defined in claim 1 wherein the copper ions are in the form of a copper-containing complex which yields a precipitate which is adherent to said non-metallic surface.
Claim 5
Dependent Claim
30 words
A aqueous seeder solution as defined in claim 1, wherein the weight ratio of cuprous ion to cupric ion is from about 0.4 to 1 to about 30 to 1.
Claim 6
Dependent Claim
29 words
A aqueous seeder solution as defined in claim 4, wherein said ratio of cuprous ion to cupric ion is from about 0.7 to 1 to about 20 to 1.
Claim 7
Dependent Claim
14 words
A aqueous seeder solution as defined in claim 1 which also contains a stabilizer.
Claim 8
Dependent Claim
25 words
A aqueous seeder solution as defined in claim 6, wherein the stabilizer is selected from the group consisting of resorcinol, barium ions and cobalt ions.
Claim 9
Dependent Claim
84 words
An aqueous seeder solution for sensitizing a non-metallic surface to the electroless deposition of metal, comprising cuprous ions and cupric ions produced by mixing water, an acid, a halogen-containing compound, a cuprous compound and a cupric compound, wherein the weight ratio of cuprous ion to cupric ion is at least 0.4 to 1 said seeder solution also containing a wetting agent, and wherein said solution is capable upon contacting with water of forming a water insoluble derivative which is adherent to said non-metallic surface.
Claim 10
Dependent Claim
84 words
An aqueous seeder solution for sensitizing a non-metallic surface to the electroless deposition of metal, comprising cuprous ions and cupric ions produced by mixing water, an acid, a halogen-containing compound, a cuprous compound and a cupric compound, wherein the weight ratio of cuprous ion to cupric ion is at least 0.4 to 1 said seeder solution also containing a wetting agent, and wherein said solution is capable upon contacting with water of forming a water insoluble derivative which is adherent to said non-metallic surface.
Claim 11
Dependent Claim
17 words
A liquid seeder solution as defined in claim 8, wherein said wetting agent is a fluorinated hydrocarbon.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-03-30 | 1984-09-29 | 1985-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-03-30 | 1988-09-29 | 1989-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-03-30 | 1992-09-29 | 1993-03-31 | $7700.00 | Window Closed / Lapsed |