US4087586A
Expired / Lapsed
US
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Electroless metal deposition and article
Assignee: Individual
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Filing: 1975-12-29
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Granted: 1978-05-02
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Expires: 1995-12-29
Abstract
Abstract Catalysts for activating dielectric substrates preparatory to electroless metal deposition are prepared by admixing a soluble metal salt of a non-precious catalytic metal with a secondary compound which causes the formation of a colloidal dispersion and an extraneous colloid stabilizer. The substrates are immersed in the colloidal dispersion, rinsed, activated, rinsed, and then immersed in an electroless plating bath.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 21:39
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31692; Y10T428/31696
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
66 words
An Electroless plating process comprising the steps of (a) immersing a dielectric substrate in a colloidal dispersion of insoluble or sparingly soluble compounds of a non-precious metal catalytic agent, (b) activating the colloid adsorbed on the surface whereby the induction time for the actual electroless build-up is reduced, and (c) electrolessly plating a metal on said substrate, and wherein said compounds are devoid of hydrous oxides.
Claim 2
Dependent Claim
66 words
An Electroless plating process comprising the steps of (a) immersing a dielectric substrate in a colloidal dispersion of insoluble or sparingly soluble compounds of a non-precious metal catalytic agent, (b) activating the colloid adsorbed on the surface whereby the induction time for the actual electroless build-up is reduced, and (c) electrolessly plating a metal on said substrate, and wherein said compounds are devoid of hydrous oxides.
Claim 3
Dependent Claim
21 words
The electroless plating process recited in claim 1 wherein said activation is by immersion in an activator selected from soluble borohydrides.
Claim 4
Dependent Claim
28 words
The electroless plating process recited in claim 1 wherein said dispersion comprises an inorganic compound of a cation selected from the group consisting of copper, cobalt and nickel.
Claim 5
Dependent Claim
13 words
The process according to claim 1 wherein steps b and c are combined.
Claim 6
Dependent Claim
65 words
An improved process for rendering dielectric substrates receptive to deposition of metals and alloys by electroless plating comprising the steps: a. contacting said substrate with a colloidal dispersion of insoluble or sparingly soluble compounds of non-precious metal catalytic agent and wherein said compounds are devoid of hydrous oxide, b. activating said contacted substrate to form catalytic sites of greater activity capable of electroless plating initiation.
Claim 7
Dependent Claim
65 words
An improved process for rendering dielectric substrates receptive to deposition of metals and alloys by electroless plating comprising the steps: a. contacting said substrate with a colloidal dispersion of insoluble or sparingly soluble compounds of non-precious metal catalytic agent and wherein said compounds are devoid of hydrous oxide, b. activating said contacted substrate to form catalytic sites of greater activity capable of electroless plating initiation.
Claim 8
Dependent Claim
22 words
The process according to claim 5 wherein said non-precious metals are selected from the group consisting of copper, cobalt, nickel, and iron.
Claim 9
Dependent Claim
19 words
The process according to claim 5 wherein activation is accomplished by contacting said substrate with a suitable reducing agent.
Claim 10
Dependent Claim
16 words
The process according to claim 5 wherein the colloid of said colloidal dispersion is negatively charged.
Claim 11
Dependent Claim
16 words
The process according to claim 5 wherein the colloid of said colloidal dispersion is positively charged.
Claim 12
Dependent Claim
14 words
The process according to claim 5 wherein said inorganic colloidal dispersion includes a stabilizer.
Claim 13
Dependent Claim
16 words
The process according to claim 5 wherein step b) is part of the electroless plating formulation.
Claim 14
Dependent Claim
76 words
An article produced by the steps comprising: a. contacting said article with a colloidal dispersion of insoluble or sparingly soluble compounds of a non-precious metal catalytic agent for electroless plating and excluding hydrous oxides and the product resulting from admixing and interaction of borides with metal ions selected from the group consisting of copper, cobalt, nickel, iron and manganese, and b. activating said contacted article whereby the induction time for the actual electroless build-up is reduced.
Claim 15
Dependent Claim
76 words
An article produced by the steps comprising: a. contacting said article with a colloidal dispersion of insoluble or sparingly soluble compounds of a non-precious metal catalytic agent for electroless plating and excluding hydrous oxides and the product resulting from admixing and interaction of borides with metal ions selected from the group consisting of copper, cobalt, nickel, iron and manganese, and b. activating said contacted article whereby the induction time for the actual electroless build-up is reduced.
Claim 16
Dependent Claim
22 words
The article according to claim 12 wherein said non-precious metals are selected from the group consisting of copper, cobalt, nickel and iron.
Claim 17
Dependent Claim
15 words
The article according to claim 12 wherein the colloid of the dispersion is negatively charged.
Claim 18
Dependent Claim
17 words
The article according to claim 12 wherein the said inorganic colloidal dispersion further includes a colloidal stabilizer.
Claim 19
Dependent Claim
13 words
The article according to claim 15 wherein the colloidal stabilizer is a surfactant.
Claim 20
Dependent Claim
16 words
The article according to claim 12 wherein the colloid of the colloidal dispersion is positively charged.
Claim 21
Dependent Claim
16 words
The article according to claim 5 wherein step b) is part of the electroless plating formulation.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-05-01 | 1981-10-31 | 1982-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-05-01 | 1985-10-31 | 1986-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-05-01 | 1989-10-31 | 1990-05-02 | $7700.00 | Window Closed / Lapsed |