Process for sensitizing articles for metallization and resulting articles

Claim 2

In the process for the electroless deposition of metal on a non-metallic surface, the improvement which comprises presensitizing the non-metallic surface to the electroless deposition of metal by a method which comprises: (a) contacting said non-metallic surface with an activatable copper complex in a liquid medium containing cuprous ions and cupric ions in a weight ratio of cuprous ions to cupric ions not less than 0.4:1, said medium resulting from the admixture of a polar liquid, an acid, a halogen-containing compound, a cuprous compound, and absorbing on said surface a derivative from said liquid medium, (b) rinsing said contacted surface with said derivative thereon with an aqueous medium to remove the excess of said medium from said surface and to water-insolubilize said derivative adsorbed on said non-metallic surface, (c) after said surface has been rinsed and the excess of said medium has been removed from said surface, treating the water-insolubilized derivative on said sensitized surface with a reducing agent to render the surface catalytically active to electroless deposition of metal.

Claim 3

A process according to claim 1, wherein said polar liquid is water.

Claim 4

A process according to claim 2, wherein said halogen-containing compound is chlorine.

Claim 5

A process according to claim 1, wherein said medium is in at least intermittent contact with an elemental metal.

Claim 6

A process according to claim 4, wherein said elemental metal is selected from the group consisting of copper, cobalt, iron, aluminum and nickel.

Claim 7

A process according to claim 1, wherein said aqueous rinsing medium is water.

Claim 8

A process according to claim 1 including the further step of rendering said water-insolublized adsorbed derivative on said surface catalytically active to the deposition of electroless metal and electrolessly depositing metal thereon by simultaneously contacting said surface with a reducing agent to reduce said derivative and with an electroless metal deposition solution.

Claim 9

A process according to claim 1, including the further step of metallizing said catalytically active surface in an electroless metal deposition bath and electrolessly depositing metal thereon.

Claim 10

A process according to claim 1, wherein said reducing agent is selected from the group consisting of borohydrides, amine boranes and hydrazine hydrate.

Claim 11

A process according to claim 8, wherein said water-insolublized adsorbed derivative is rendered catalytically active and said catalytically active surface is metallized in an electroless metal deposition bath containing a reducing agent.

Claim 12

A process according to claim 10 including the further step of treating said water-insolublized adsorbed derivative on said sensitizable surface with a reducing agent selected from the group consisting of borohydrides, amine boranes and hydrazine hydrate to render said surface catalytically active to electroless metal deposition.

Claim 13

A process according to claim 1, wherein said liquid medium is aqueous and acidic.

Claim 14

A process according to claim 12, wherein said halogen is chlorine.

Claim 15

A process according to claim 1, wherein the weight ratio of cuprous ions to cupric ions is at least about 0.7 to 1.

Claim 16

A process according to claim 1, wherein said ratio is from about 0.4 to 1 to about 30 to 1.

Claim 17

A process according to claim 14, wherein said ratio is from about 0.7 to 1 to about 20 to 1.

Claim 18

A process according to claim 15 wherein said liquid medium contains a stabilizer for maintaining said weight ratio.

Claim 19

A process according to claim 17, wherein said stabilizer is selected from the group consisting of resorcinol, barium ions, and cobalt ions.

Claim 20

A process according to claim 14, wherein said liquid medium also contains a wetting agent.

Claim 21

A process according to claim 19 wherein said wetting agent is a fluorinated hydrocarbon.

Claim 22

In a process for the electroless deposition of metal on a non-metallic surface, the improvement which comprises pre-sensitizing the non-metallic surface to the electroless deposition of metal by a method which comprises: (a) contacting said non-metallic surface with an activatable copper complex in a liquid medium containing cupric ions and cuprous ions in a weight ratio of cuprous ions to cupric ions not substantially less than 0.4:1 and not substantially more than 30:1, said medium resulting from the admixture of a polar liquid medium, a halogen-containing compound, a cupric compound, and a cuprous compound, and adsorbing on said surface a derivative therefrom. (b) rinsing said contacted surface with said derivative thereon with water to rinse the excess of said medium from said surface and to water-insolublize said derivative adsorbed on said non-metallic surface, and (c) treating said water-insolublized adsorbed derivative on said sensitizable surface with a reducing agent selected from the group consisting of borohydrides, amine boranes and hydrazine hydrate to render said surface catalytically active to electroless metal deposition.

Claim 23

In a process for the electroless deposition of metal on a non-metallic surface, the improvement which comprises pre-sensitizing the non-metallic surface to the electroless deposition of metal by a method which comprises: (a) contacting said non-metallic surface with an activatable copper complex in a liquid medium containing cupric ions and cuprous ions in a weight ratio of cuprous ions to cupric ions not substantially less than 0.4:1 and not substantially more than 30:1, said medium resulting from the admixture of a polar liquid medium, a halogen-containing compound, a cupric compound, and a cuprous compound, and adsorbing on said surface a derivative therefrom. (b) rinsing said contacted surface with said derivative thereon with water to rinse the excess of said medium from said surface and to water-insolublize said derivative adsorbed on said non-metallic surface, and (c) treating said water-insolublized adsorbed derivative on said sensitizable surface with a reducing agent selected from the group consisting of borohydrides, amine boranes and hydrazine hydrate to render said surface catalytically active to electroless metal deposition.

Claim 24

A process according to claim 21, wherein said liquid medium is in at least intermittent contact with an elemental metal.

Claim 25

A process according to claim 22, wherein said elemental metal is selected from the group consisting of copper, cobalt, iron, aluminum and nickel.

Claim 26

A process according to claim 23 wherein said elemental metal is copper.

Claim 27

In a process for the electroless deposition of metal on a non-metallic surface, the improvement which comprises sensitizing the non-metallic surface to the electroless deposition of metal by a method comprising the steps of: (a) contacting said non-metallic surface with an activatable copper complex in a liquid medium containing cuprous ions and cupric ions in a weight ratio of cuprous ions to cupric ions not substantially less than 0.4:1 and not substantially more than 30:1, said medium resulting from the admixture of a polar liquid, a halogen-containing compound, a cupric compound, and a cuprous compound and absorbing on said surface a derivative from said medium; (b) rinsing said contacted surface with an aqueous solution to water-insolublize the adsorbed derivative on said surface and to remove from said surface the excess of said medium; and (c) treating said rinsed surface with a reducing agent to render said water-insolublized adsorbed derivative catalytic to the electroless deposition of metal.

Claim 28

In a process for the electroless deposition of metal on a non-metallic surface, the improvement which comprises sensitizing the non-metallic surface to the electroless deposition of metal by a method comprising the steps of: (a) contacting said non-metallic surface with an activatable copper complex in a liquid medium containing cuprous ions and cupric ions in a weight ratio of cuprous ions to cupric ions not substantially less than 0.4:1 and not substantially more than 30:1, said medium resulting from the admixture of a polar liquid, a halogen-containing compound, a cupric compound, and a cuprous compound and absorbing on said surface a derivative from said medium; (b) rinsing said contacted surface with an aqueous solution to water-insolublize the adsorbed derivative on said surface and to remove from said surface the excess of said medium; and (c) treating said rinsed surface with a reducing agent to render said water-insolublized adsorbed derivative catalytic to the electroless deposition of metal.

Claim 29

A process according to claim 25, wherein said polar liquid is aqueous and said halogen is chlorine.

Claim 30

A process according to claim 26, wherein said aqueous rinsing solution is water.

Claim 31

A process according to claim 25, wherein said reducing agent is a hydride.

Claim 32

A process according to claim 28, wherein said hydride is borohydride or borane.

Claim 33

A process according to claim 25, wherein said liquid medium is in at least intermittent contact with an elemental metal.

Claim 34

A process according to claim 30, wherein said elemental metal is selected from the group consisting of copper, cobalt, iron, aluminum and nickel.

Claim 35

A process according to claim 30, wherein said elemental metal is copper.

Claim 36

A process according to claim 25, wherein the combined weight of said cupric and cuprous compounds in said liquid medium is not substantially less than 0.5% and not substantially more than 30% and the weight ratio of cuprous ions to cupric ions is at least about 0.4 to 1.

Claim 37

A process according to claim 33, wherein said ratio of cuprous ions to cupric ions is from about 0.4 to 1 to about 30 to 1.

Claim 38

A process according to claim 25, wherein the combined weight and said cupric and cuprous compounds in said liquid medium is not substantially less than 5% and not substantially more than 15% and the ratio of cuprous ions to cupric ions from about 0.7 to 1 to about 20 to 1.

Claim 39

A process according to claim 25, wherein said liquid medium also contains a stabilizer.

Claim 40

A process according to claim 36, wherein said stabilizer is selected from the group consisting of resorcinol, barium ions, and cobalt ions.

Claim 41

A process according to claim 36, wherein said solution also contains a wetting agent.

Claim 42

A process according to claim 38, wherein said wetting agent is a fluorinated hydrocarbon.

Claim 43

A process for the electroless deposition of metal on a non-metallic surface, said process comprising the steps of: (a) pre-sensitizing the non-metallic surface to the electroless deposition of metal by contacting said non-metallic surface with an activatable copper complex in a liquid medium formed from an admixture of a polar liquid, a halide, cupric ions and cuprous ions in a weight ratio of cuprous ions to cupric ions of at least 0.4 to 1; (b) rinsing said contacted surface with an aqueous solution and forming an adherent water-insoluble derivative of said liquid medium adsorbed on said non-metallic surface; (c) treating said rinsed surface with a reducing agent to render said insoluble derivative catalytic to the electroless deposition of metal; and (d) contacting said catalytically sensitive surface with an electroless metal deposition bath to form an electroless deposit of metal thereon.

Claim 44

A process for the electroless deposition of metal on a non-metallic surface, said process comprising the steps of: (a) pre-sensitizing the non-metallic surface to the electroless deposition of metal by contacting said non-metallic surface with an activatable copper complex in a liquid medium formed from an admixture of a polar liquid, a halide, cupric ions and cuprous ions in a weight ratio of cuprous ions to cupric ions of at least 0.4 to 1; (b) rinsing said contacted surface with an aqueous solution and forming an adherent water-insoluble derivative of said liquid medium adsorbed on said non-metallic surface; (c) treating said rinsed surface with a reducing agent to render said insoluble derivative catalytic to the electroless deposition of metal; and (d) contacting said catalytically sensitive surface with an electroless metal deposition bath to form an electroless deposit of metal thereon.

Claim 45

A process according to claim 40, where steps (c) and (d) are carried out simultaneously by contacting said rinsed surface with reducing agent-containing electroless metal deposition bath.

Claim 46

A process according to claim 40 wherein said reducing agent includes at least one member selected from the group consisting of borohydrides, amine boranes and hydrazine hydrate.

Claim 47

A process according to claim 40, wherein said liquid medium also contains a stabilizer.

Claim 48

A process according to claim 43 wherein said liquid medium also contains a wetting agent.

Claim 49

In the process for the electroless deposition of metal on a non-metallic surface, the improvement which comprises pre-sensitizing the non-metallic surface to the electroless deposition of metal by a method which comprises: (a) contacting said non-metallic surface with an activatable copper complex in a liquid medium containing cuprous ions and cupric ions in a weight ratio of cuprous ions to cupric ions of at least 0.4:1, said medium resulting from the admixture of a polar liquid, an acid, a halogen-containing compound and a cuprous compound, and adsorbing on said surface a derivative from said liquid medium; (b) rinsing said contacted surface with said derivative thereon with water to remove the excess of said medium from said surface and to water-insolubilize said derivative adsorbed on said non-metallic surface; and (c) prolonging said water treatment to sensitize said surface to the electroless deposition of metal.

Claim 50

In the process for the electroless deposition of metal on a non-metallic surface, the improvement which comprises pre-sensitizing the non-metallic surface to the electroless deposition of metal by a method which comprises: (a) contacting said non-metallic surface with an activatable copper complex in a liquid medium containing cuprous ions and cupric ions in a weight ratio of cuprous ions to cupric ions of at least 0.4:1, said medium resulting from the admixture of a polar liquid, an acid, a halogen-containing compound and a cuprous compound, and adsorbing on said surface a derivative from said liquid medium; (b) rinsing said contacted surface with said derivative thereon with water to remove the excess of said medium from said surface and to water-insolubilize said derivative adsorbed on said non-metallic surface; and (c) prolonging said water treatment to sensitize said surface to the electroless deposition of metal.