US5262280A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Radiation sensitive compositions
Assignee: Shipley Co Inc
•
Filing: 1992-04-02
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Granted: 1993-11-16
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Expires: 2012-04-02
Abstract
Abstract Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.
Inventors
- 👤 Philip D. Knudsen
- 👤 Charles R. Shipley
- 👤 Daniel Y. Pai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 20:55
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; G03F7/0045; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287; Y; Y02; Y02P; Y02P20/00; Y02P20/50; Y02P20/582; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
112 words
A process for the formation of a circuit board having two or more layers of circuitry, comprising: applying a photodielectric coating layer over a first circuit layer, the photodielectric coating layer comprising a resin binder, a polybutadiene that comprises one or more internal epoxide groups, and a radiation sensitive component selected from the group consisting of a photoacid generator or a photobase generator, forming in the photoelectric coating layer one or more photoimaged openings defining electrical interconnections, and sequentially forming a second circuit layer over the photodielectric coating layer, the second circuit layer being in electrical connection with the first circuit layer by means of the photoimaged openings of the coating layer.
Claim 2
Dependent Claim
112 words
A process for the formation of a circuit board having two or more layers of circuitry, comprising: applying a photodielectric coating layer over a first circuit layer, the photodielectric coating layer comprising a resin binder, a polybutadiene that comprises one or more internal epoxide groups, and a radiation sensitive component selected from the group consisting of a photoacid generator or a photobase generator, forming in the photoelectric coating layer one or more photoimaged openings defining electrical interconnections, and sequentially forming a second circuit layer over the photodielectric coating layer, the second circuit layer being in electrical connection with the first circuit layer by means of the photoimaged openings of the coating layer.
Claim 3
Dependent Claim
13 words
The process of claim 1 where the composition further comprises a crosslinking agent.
Claim 4
Dependent Claim
12 words
The process of claim 2 where the crosslinking agent comprises a melamine.
Claim 5
Dependent Claim
24 words
The process of claim 2 where the crosslinking agent comprises a mixture of a melamine and a compound containing one or more epoxy groups.
Claim 6
Dependent Claim
59 words
The process of claim 2 where the crosslinking agent comprises one or more materials selected from the group consisting of an amine-based compound, a compound containing one ore more epoxy groups, a compound containing one or more vinyl ether groups, a compound containing one or more electrophilic multiple bonds, and an aromatic compound containing one or more allyl substituents.
Claim 7
Dependent Claim
13 words
The process of claim 2 where the polybutadiene comprises hydroxyl and vinyl groups.
Claim 8
Dependent Claim
22 words
The process of claim 2 where the polybutadiene is miscible with the polymerizable components of the composition upon curing of the composition.
Claim 9
Dependent Claim
66 words
The process of claim 2 where the polybutadiene is a compound of the following formula (I): ##STR4## where R and R 1 are each independently selected from the group consisting of hydrogen, substituted and unsubstituted alkyl, substituted and unsubstituted aryl, epoxy, hydroxy and alkylene; R 2 is selected from the group consisting of alkylene and alkyl; and n is an integer equal to 2 or greater.
Claim 10
Dependent Claim
26 words
The process of 2 where the polybutadiene is a compound of the following formula (IA): ##STR5## where n is an integer between about 10 and 25.
Claim 11
Dependent Claim
26 words
The process of 2 where the polybutadiene is a compound of the following formula (IA): ##STR5## where n is an integer between about 10 and 25.
Claim 12
Dependent Claim
17 words
The process of claim 2 where the polybutadiene has a molecular weight of at least about 4,000.
Claim 13
Dependent Claim
18 words
The process of claim 2 where the polybutadiene has a molecular weight of from about 4,000 to 8,000.
Claim 14
Dependent Claim
13 words
The process of claim 2 where the resin binder comprises a phenolic resin.
Claim 15
Dependent Claim
41 words
The process of claim 2 where the phenolic resin binder is selected from the group consisting of (1) a novolak resin, (2) a poly(vinylphenol) resin, (3) a resin containing phenolic units and cyclic alcohol units, and (4) a brominated phenolic resin.
Claim 16
Dependent Claim
14 words
The process of claim 2 where the resin binder component comprises a non-reactive resin.
Claim 17
Dependent Claim
25 words
The process of claim 1 where the applied photodielectric coating layer is exposed to patterned activating radiation and then developed to form said photoimaged openings.
Claim 18
Dependent Claim
17 words
The process of claim 15 where the photodielectric coating layer is developed with an aqueous alkaline solution.
Claim 19
Dependent Claim
13 words
The process of claim 1 where the polybutadiene comprises hydroxyl and vinyl groups.
Claim 20
Dependent Claim
22 words
The process of claim 1 where the polybutadiene is miscible with the polymerizable components of the composition upon curing of the composition.
Claim 21
Dependent Claim
66 words
The process of claim 1 where the polybutadiene is a compound of the following formula (I): ##STR6## where R and R 1 are each independently selected from the group consisting of hydrogen, substituted and unsubstituted alkyl, substituted and unsubstituted aryl, epoxy, hydroxy and alkylene; R 2 is selected from the group consisting of alkylene and alkyl; and n is an integer equal to 2 or greater.
Claim 22
Dependent Claim
26 words
The process of 1 where the polybutadiene is a compound of the following formula (IA): ##STR7## where n is an integer between about 10 and 25.
Claim 23
Dependent Claim
26 words
The process of 1 where the polybutadiene is a compound of the following formula (IA): ##STR7## where n is an integer between about 10 and 25.
Claim 24
Dependent Claim
17 words
The process of claim 1 where the polybutadiene has a molecular weight of at least about 4,000.
Claim 25
Dependent Claim
18 words
The process of claim 1 where the polybutadiene has a molecular weight of from about 4,000 to 8,000.
Claim 26
Dependent Claim
13 words
The process of claim 1 where the resin binder comprises a phenolic resin.
Claim 27
Dependent Claim
41 words
The process of claim 1 where the phenolic resin binder is selected from the group consisting of (1) a novolak resin, (2) a poly(vinylphenol) resin, (3) a resin containing phenolic units and cyclic alcohol units, and (4) a brominated phenolic resin.
Claim 28
Dependent Claim
14 words
The process of claim 1 where the resin binder component comprises a non-reactive resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-15 | 1997-05-17 | 1997-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-15 | 2001-05-17 | 2001-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-15 | 2005-05-17 | 2005-11-16 | $7700.00 | Window Closed / Lapsed |