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US4701351A
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Seeding process for electroless metal deposition
Assignee: International Business Machines Corp
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Filing: 1986-06-16
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Granted: 1987-10-20
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Expires: 2006-06-16
Abstract
Abstract A process for depositing and tightly binding noble metal seeds onto a substrate by coating the substrate with a very thin layer of a polymer which complexes with a noble metal compound and contacting the layer of polymer with a noble metal compound which forms a complex with the layer of polymer.
Inventors
- 👤 Robert L. Jackson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 03:53
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1605; C23C18/18; C23C18/1851; C23C18/1862; C23C18/1865; C23C18/1872; C23C18/1875; C23C18/1879; C23C18/1886; C23C18/1893; C23C18/20; C23C18/2006; C23C18/2026; C23C18/2033; C23C18/2046; C23C18/2053; C23C18/206; C23C18/2066; C23C18/2073; C23C18/2086; C23C18/28; C23C18/30; C23C18/31; C23C18/32; C23C18/38; C23C18/40; C23C18/405; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
72 words
A process for depositing and tightly binding noble metal seeds onto a substrate, said process being characterized by the steps of: (1) coating the substrate with a thin layer less than 1 micron thick of a polyamine, polyacid or salt of a polyacid polymer which complexes with a noble metal compound, and (2) contacting said layer of polymer with a noble metal compound which forms a complex with the layer of polymer.
Claim 2
Dependent Claim
72 words
A process for depositing and tightly binding noble metal seeds onto a substrate, said process being characterized by the steps of: (1) coating the substrate with a thin layer less than 1 micron thick of a polyamine, polyacid or salt of a polyacid polymer which complexes with a noble metal compound, and (2) contacting said layer of polymer with a noble metal compound which forms a complex with the layer of polymer.
Claim 3
Dependent Claim
19 words
A process as claimed in claim 1 wherein the noble metal complex is subsequently activated to form metal particles.
Claim 4
Dependent Claim
19 words
A process as claimed in claim 1 wherein the substrate is subsequently placed in a copper electroless plating bath.
Claim 5
Dependent Claim
22 words
A process as claimed in claim 1 wherein the noble metal is palladium (II) chloride, palladium (II) sulfate, or palladium (II) acetylacetonate.
Claim 6
Dependent Claim
15 words
A process as claimed in claim 1 wherein the substrate is an electronic packaging substrate.
Claim 7
Dependent Claim
14 words
A process as claimed in claim 1 wherein the substrate is a circuit board.
Claim 8
Dependent Claim
102 words
A process for depositing and tightly binding noble metal seeds in a pattern onto a substrate, said process being characterized by the steps of: (1) coating the substrate with a thin layer less than 1 micron thick of a polyamine, polyacid or salt of a polyacid polymer which complexes with a noble metal compound, (2) overcoating said thin polymer layer with a photoresist, (3) patternwise exposing and developing the photoresist to define the pattern to be metallized, and (4) coating the substrate with a noble metal compound which selectively forms a complex with the thin polymer layer and not with the photoresist.
Claim 9
Dependent Claim
102 words
A process for depositing and tightly binding noble metal seeds in a pattern onto a substrate, said process being characterized by the steps of: (1) coating the substrate with a thin layer less than 1 micron thick of a polyamine, polyacid or salt of a polyacid polymer which complexes with a noble metal compound, (2) overcoating said thin polymer layer with a photoresist, (3) patternwise exposing and developing the photoresist to define the pattern to be metallized, and (4) coating the substrate with a noble metal compound which selectively forms a complex with the thin polymer layer and not with the photoresist.
Claim 10
Dependent Claim
26 words
A process as claimed in claim 7 wherein the noble metal is complexed with the thin polymer lay prior to coating the substrate with the photoresist.
Claim 11
Dependent Claim
14 words
A process as claimed in claim 7 wherein the photoresist is a permanent resist.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-10-19 | 1991-04-20 | 1991-10-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-10-19 | 1995-04-20 | 1995-10-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-10-19 | 1999-04-20 | 1999-10-20 | $7700.00 | Window Closed / Lapsed |