US4572764A
Expired / Lapsed
US
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Preparation of photoformed plastic multistrate by via formation first
Assignee: EIDP Inc
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Filing: 1984-12-13
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Granted: 1986-02-25
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Expires: 2004-12-13
Abstract
Abstract Process for preparing multilayer printed circuits comprising laminating to a substrate bearing a circuit pattern or electrically conductive surface a photosensitive layer which is tacky or becomes tacky upon exposure; exposing the laminate to actinic radiation through a via image related to the underlying circuit pattern, if present; optionally removing the removable via image of the photosensitive layer in either the exposed or unexposed areas, e.g., with a solvent or peeling apart by removal of a cover sheet, if present; laminating to the remaining tacky photosensitive layer a layer of a second photosensitive composition; exposing the laminate to actinic radiation through a registered image pattern of at least one overlying segment of the via image area and conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; removing the removable circuit image areas of the photosensitive layer in the exposed or unexposed areas with a solvent therefor, or peeling apart by means of a cover sheet, if present, the removable via image areas of the lower photosensitive, if present, are removed by a solvent therefor; embedding finely divided material, e.g., copper, into the tacky areas; optionally curing the laminate by means of actinic radiation and/or heat; plating electrolessly to form an interconnected electrically conductive circuit. Additional circuit layers can be added.
Inventors
- 👤 Roxy N. Fan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 03:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/46; H05K3/4644; H05K3/4661; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0376; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0525; H05K2203/07; H05K2203/0703; H05K2203/072; H05K2203/14; H05K2203/1415; H05K3/102; H05K3/22; H05K3/24; H05K3/245; H05K3/246; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T29/49204
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
321 words
A process for preparing a multilayer printed circuit having conductive interconnections which comprises: (a) laminating to a substrate bearing an electrically conductive surface or circuit pattern a layer of a photosensitive composition which is tacky or becomes tacky upon exposure, the layer optionally having a removable cover sheet; (b) exposing the laminate to actinic radiation through a via image which is related to the underlying circuit pattern if present leaving removable via image areas overlying at least one segment of the underlying conductive circuit pattern; (c) optionally removing the removable via image areas of the photosensitive layer in either the exposed or unexposed areas with a solvent therefor or peeling apart by removal of the cover sheet, if present: (d) laminating to the tacky photosensitive layer remaining from step (b) or step (c) a layer of a second photosensitive composition, the layer optionally having a removable cover sheet; (e) exposing the laminate of step (d) to actinic radiation through a registered circuit image pattern which is related to the underlying circuit pattern having at least one segment thereof overlying at least one segment of the via image area resulting from step (b) and the underlying conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; (f) removing the removable circuit image areas of the photosensitive layer of step (d) in either the exposed or unexposed areas with a solvent therefor, or peeling apart by removal of the cover sheet, if present; (g) removing the removable via image areas of the lower photosensitive layer, if present, with a solvent therefor; (h) embedding finely divided metal, alloy, or plating catalyst material to the tacky image areas; (i) optionally curing the laminate by exposing the laminate to actinic radiation, and/or heating; (j) plating electrolessly the metallized or catalyzed vias, the uncovered segments, and overlying circuit image to form an electrically conductive circuit pattern interconnected with electrically conductive vias.
Claim 2
Dependent Claim
321 words
A process for preparing a multilayer printed circuit having conductive interconnections which comprises: (a) laminating to a substrate bearing an electrically conductive surface or circuit pattern a layer of a photosensitive composition which is tacky or becomes tacky upon exposure, the layer optionally having a removable cover sheet; (b) exposing the laminate to actinic radiation through a via image which is related to the underlying circuit pattern if present leaving removable via image areas overlying at least one segment of the underlying conductive circuit pattern; (c) optionally removing the removable via image areas of the photosensitive layer in either the exposed or unexposed areas with a solvent therefor or peeling apart by removal of the cover sheet, if present: (d) laminating to the tacky photosensitive layer remaining from step (b) or step (c) a layer of a second photosensitive composition, the layer optionally having a removable cover sheet; (e) exposing the laminate of step (d) to actinic radiation through a registered circuit image pattern which is related to the underlying circuit pattern having at least one segment thereof overlying at least one segment of the via image area resulting from step (b) and the underlying conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; (f) removing the removable circuit image areas of the photosensitive layer of step (d) in either the exposed or unexposed areas with a solvent therefor, or peeling apart by removal of the cover sheet, if present; (g) removing the removable via image areas of the lower photosensitive layer, if present, with a solvent therefor; (h) embedding finely divided metal, alloy, or plating catalyst material to the tacky image areas; (i) optionally curing the laminate by exposing the laminate to actinic radiation, and/or heating; (j) plating electrolessly the metallized or catalyzed vias, the uncovered segments, and overlying circuit image to form an electrically conductive circuit pattern interconnected with electrically conductive vias.
Claim 3
Dependent Claim
24 words
A process according to claim 1 wherein removing the unexposed areas of the photosensitive layers in steps (c) and (f) is by solvent development.
Claim 4
Dependent Claim
19 words
A process according to claim 2 wherein the same solvent removes the unexposed areas in the two photosensitive layers.
Claim 5
Dependent Claim
24 words
A process according to claim 1 wherein removing the exposed areas of the photosensitive layers in steps (c) and (f) is by solvent development.
Claim 6
Dependent Claim
19 words
A process according to claim 4 wherein the same solvent removes the exposed areas in the two photosensitive layers.
Claim 7
Dependent Claim
24 words
A process according to claim 1 wherein the unexposed areas of layer (c) are removed and the exposed areas of layer (f) are removed.
Claim 8
Dependent Claim
24 words
A process according to claim 1 wherein the exposed areas of layer (c) are removed and the unexposed areas of layer (f) are removed.
Claim 9
Dependent Claim
31 words
A process according to claim 6 wherein the unexposed areas of layer (c) are removed with a solvent therefor and the exposed areas of layer (f) are removed by peeling apart.
Claim 10
Dependent Claim
31 words
A process according to claim 6 wherein the unexposed areas of layer (c) are removed by peeling apart and the exposed areas of layer (f) are removed with a solvent therefor.
Claim 11
Dependent Claim
30 words
A process according to claim 1 wherein the unexposed areas of the photosensitive layer in step (c) are removed by peeling off the cover sheet, the unexposed areas adhering thereto.
Claim 12
Dependent Claim
30 words
A process according to claim 1 wherein the unexposed areas of the photosensitive layer in step (f) are removed by peeling off the cover sheet, the unexposed areas adhering thereto.
Claim 13
Dependent Claim
30 words
A process according to claim 10 wherein the unexposed areas of the photosensitive layer in step (f) are removed by peeling off the cover sheet, the unexposed areas adhering thereto.
Claim 14
Dependent Claim
30 words
A process according to claim 1 wherein the exposed areas of the photosensitive layer in step (c) are removed by peeling off the cover sheet, the exposed areas adhering thereto.
Claim 15
Dependent Claim
30 words
A process according to claim 1 wherein the exposed areas of the photosensitive layer in step (f) are removed by peeling off the cover sheet, the exposed areas adhering thereto.
Claim 16
Dependent Claim
30 words
A process according to claim 13 wherein the exposed areas of the photosensitive layer in step (f) are removed by peeling off the cover sheet, the exposed areas adhering thereto.
Claim 17
Dependent Claim
298 words
A process for preparing a multilayer printed circuit having conductive interconnections which comprises: (a) laminating to a substrate bearing an electrically conductive surface or circuit pattern a layer of a tacky photopolymerizable composition optionally having a removable cover sheet; (b) exposing the laminate to actinic radiation through a via image which is related to the underlying circuit pattern if present leaving removable via image areas overlying at least one segment of the underlying conductive circuit pattern; (c) optionally removing the removable via image areas of the photopolymerizable layer with a solvent therefor or peeling apart by removal of the cover sheet, if present; (d) laminating to the tacky photopolymerizable layer remaining from step (b) or step (c) a layer of a second photopolymerizable composition, the layer optionally having a removable cover sheet; (e) exposing the laminate of step (d) to actinic radiation through a registered circuit image pattern which is related to the underlying circuit pattern having at least one segment thereof overlying at least one segment of the via image area resulting from step (b) and the underlying conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; (f) removing the removable circuit image areas of the photopolymerizable layer of step (d) with a solvent therefor, or peeling apart by removal of the cover sheet, if present; (g) removing the removable via image areas of the lower photopolymerizable layer, if present, with a solvent therefor; (h) embedding finely divided metal, alloy, or plating catalyst material to the tacky image areas; (i) optionally curing the laminate by exposing the laminate to actinic radiation, and/or heating; (j) plating electrolessly the metallized or catalyzed vias, the uncovered segments, and overlying circuit image to form an electrically conductive circuit pattern interconnected with electrically conductive vias.
Claim 18
Dependent Claim
298 words
A process for preparing a multilayer printed circuit having conductive interconnections which comprises: (a) laminating to a substrate bearing an electrically conductive surface or circuit pattern a layer of a tacky photopolymerizable composition optionally having a removable cover sheet; (b) exposing the laminate to actinic radiation through a via image which is related to the underlying circuit pattern if present leaving removable via image areas overlying at least one segment of the underlying conductive circuit pattern; (c) optionally removing the removable via image areas of the photopolymerizable layer with a solvent therefor or peeling apart by removal of the cover sheet, if present; (d) laminating to the tacky photopolymerizable layer remaining from step (b) or step (c) a layer of a second photopolymerizable composition, the layer optionally having a removable cover sheet; (e) exposing the laminate of step (d) to actinic radiation through a registered circuit image pattern which is related to the underlying circuit pattern having at least one segment thereof overlying at least one segment of the via image area resulting from step (b) and the underlying conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; (f) removing the removable circuit image areas of the photopolymerizable layer of step (d) with a solvent therefor, or peeling apart by removal of the cover sheet, if present; (g) removing the removable via image areas of the lower photopolymerizable layer, if present, with a solvent therefor; (h) embedding finely divided metal, alloy, or plating catalyst material to the tacky image areas; (i) optionally curing the laminate by exposing the laminate to actinic radiation, and/or heating; (j) plating electrolessly the metallized or catalyzed vias, the uncovered segments, and overlying circuit image to form an electrically conductive circuit pattern interconnected with electrically conductive vias.
Claim 19
Dependent Claim
14 words
A process according to claim 1 wherein the substrate bears an electrically conductive surface.
Claim 20
Dependent Claim
31 words
A process according to claim 1 wherein steps (a) to (j) are repeated at least once using the newly plated circuit pattern in step (j) for the succeeding process step (a).
Claim 21
Dependent Claim
31 words
A process according to claim 16 wherein steps (a) to (j) are repeated at least once using the newly plated circuit pattern in step (j) for the succeeding process step (a).
Claim 22
Dependent Claim
39 words
A process according to claim 1 wherein after removal of the removable image areas and prior to applying finely divided metal, alloy, or plating catalyst in step (h) the laminate is heated to a temperature up to 100° C.
Claim 23
Dependent Claim
22 words
A process according to claim 1 wherein the finely divided material is a metal powder, 1.0 to 250 μm in average diameter.
Claim 24
Dependent Claim
16 words
A process according to claim 21 wherein the metal powder is copper or a copper alloy.
Claim 25
Dependent Claim
16 words
A process according to claim 1 wherein any excess finely divided material is removed by washing.
Claim 26
Dependent Claim
28 words
A process according to claim 1 wherein after step (h) the metallized or catalyzed laminate is cured by heating to a temperature up to at least 150° C.
Claim 27
Dependent Claim
25 words
A process according to claim 1 wherein after step (h) the metallized or catalyzed laminate is cured by exposing the laminate overall to actinic radiation.
Claim 28
Dependent Claim
40 words
A process according to claim 1 wherein after step (h) the metallized or catalyzed laminate is cured by a combination of heating to a temperature up to at least 150° C. and by exposing the laminate overall to actinic radiation.
Claim 29
Dependent Claim
25 words
A process according to claim 2 wherein prior to exposing step (b) an intermediate elastomeric layer is laminated over the layer of tacky photosensitive composition.
Claim 30
Dependent Claim
54 words
A process according to claim 14 wherein the via image areas of the first photosensitive layer are removed with a solvent therefor in step (c) and prior to laminating a second layer of photosensitive composition in step (d), an intermediate elastomeric layer is laminated over the via image areas of the first photosensitive layer.
References Cited (Backward Citations)
US4157407A
Cited
US4469777A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-24 | 1989-08-26 | 1990-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-24 | 1993-08-26 | 1994-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-24 | 1997-08-26 | 1998-02-25 | $7700.00 | Window Closed / Lapsed |