US5486655A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multiple wire adhesive on a multiple wire wiring board
Assignee: Resonac Corp
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Filing: 1994-11-21
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Granted: 1996-01-23
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Expires: 2014-11-21
Abstract
Abstract An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.
Inventors
- 👤 Shigeharu Arike
- 👤 Yorio Iwasaki
- 👤 Eiichi Shinada
- 👤 Toshiro Okamura
- 👤 Kanji Murakami
- 👤 Yuichi Nakazato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:57
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/02; C08G59/027; C08G59/18; C08G59/20; C08G59/32; C08G59/38; C08G59/68; C09; C09J; C09J163/00; H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/0183; H05K2201/0195; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K3/10; H05K3/103; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4644; H05K3/4673; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49162
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
164 words
A multiple wire wiring board comprising a substrate having a conductor circuit thereon or insulating substrate, an adhesive layer formed on one or both surfaces of the substrate, said adhesive layer being formed of an adhesive comprising (a) an epoxy resin having a molecular weight of 5000 or more and being solid at room temperature, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photopolymerization initiator, and (e) a tin compound, wherein the weight ratio of (a+b+c) to (a) is 100:40 to 100:70, the weight ratio of (a+b+c) to (b) is larger than 100:10, the weight ratio of (a+b+c) to (c) is 100:10 to 100:40 and the weight ratio of (a+b+c) to (d) is 100:0.5 to 100:5 insulated encapsulated wires fixed on the adhesive layer through holes formed in necessary portions of the substrate, and conductor circuits formed on necessary portions of outmost surfaces of the substrate.
Claim 2
Dependent Claim
164 words
A multiple wire wiring board comprising a substrate having a conductor circuit thereon or insulating substrate, an adhesive layer formed on one or both surfaces of the substrate, said adhesive layer being formed of an adhesive comprising (a) an epoxy resin having a molecular weight of 5000 or more and being solid at room temperature, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photopolymerization initiator, and (e) a tin compound, wherein the weight ratio of (a+b+c) to (a) is 100:40 to 100:70, the weight ratio of (a+b+c) to (b) is larger than 100:10, the weight ratio of (a+b+c) to (c) is 100:10 to 100:40 and the weight ratio of (a+b+c) to (d) is 100:0.5 to 100:5 insulated encapsulated wires fixed on the adhesive layer through holes formed in necessary portions of the substrate, and conductor circuits formed on necessary portions of outmost surfaces of the substrate.
Claim 3
Dependent Claim
29 words
A wiring board according to claim 1, wherein the adhesive layer is formed by using an adhesive further comprising (g) an epoxy resin which is liquid at room temperature.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-01-22 | 1999-07-24 | 2000-01-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-01-22 | 2003-07-24 | 2004-01-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-01-22 | 2007-07-24 | 2008-01-23 | $7700.00 | Window Closed / Lapsed |