Apparatus for making wire scribed circuit boards
Abstract
Abstract A technique and apparatus for making wired interconnection boards for electrical components. The insulated wire pattern is formed by tacking the wire on an adhesive coated dielectric base using a tacking head having a bifurcated end arranged to heat and partially cure the adhesive and to mold the adhesive so it physically captures the wire. The tacking head is associated with a cutter and initial wire feed mechanism. The tacking head and associated apparatus can be orientated in any one of four directions while the dielectric base is moved on a table which has two degrees of freedom. After the conductor pattern is formed on the dielectric base, the conductor pattern is permanently secured by lamination encapsulation or the like so that the conductors are interior of the board. Holes are drilled so that the conductor ends form part of the hole walls and the holes are then metallized to bring the conductor terminations to the surface.
Inventors
- 👤 Raymond J Keogh
- 👤 Frank J Wilczek
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-04 | 1976-01-03 | 1976-07-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-04 | 1980-01-03 | 1980-07-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-04 | 1984-01-03 | 1984-07-04 | $7700.00 | Window Closed / Lapsed |