US5264325A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composition for photo imaging
Assignee: GlobalFoundries Inc
•
Filing: 1992-07-21
•
Granted: 1993-11-23
•
Expires: 2012-07-21
Abstract
Abstract An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which preferably is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60 DEG C. and about 110 DEG C. and a molecular weight of between about 600 and 2,500. A third resin, either an epoxy cresol novolak or a polyepoxy resin, is also added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.
Inventors
- 👤 Robert D. Allen
- 👤 Richard A. Day
- 👤 Donald H. Glatzel
- 👤 William D. Hinsberg
- 👤 John R. Mertz
- 👤 David J. Russell
- 👤 Gregory M. Wallraff
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 22:04
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/20; G03F7/2051; G03F7/2053; G03F7/004; G03F7/038; G03F7/0385; H; H05; H05K; H05K3/00; H05K3/0073; H05K3/0082; H05K3/22; H05K3/28; H05K3/285; H05K3/287
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
160 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: a. an epoxy based resin system having solids comprising: i. between about 10% and about 90% by weight of a polyol resin of a high molecular weight; ii. between about 10% and about 90% by weight of a brominated epoxy resin of a low molecular weight; iii. between about 3 pph and 80 pph, of an epoxy cresol novolak resin which increases the photospeed of the imaging system, or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask or mixtures thereof; b. from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2 mil thick film.
Claim 2
Dependent Claim
160 words
A photosensitive cationically polymerizable epoxy based imaging system comprising: a. an epoxy based resin system having solids comprising: i. between about 10% and about 90% by weight of a polyol resin of a high molecular weight; ii. between about 10% and about 90% by weight of a brominated epoxy resin of a low molecular weight; iii. between about 3 pph and 80 pph, of an epoxy cresol novolak resin which increases the photospeed of the imaging system, or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask or mixtures thereof; b. from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2 mil thick film.
Claim 3
Dependent Claim
80 words
The invention as defined in claim 1, wherein there is between about 28% and about 57% of the polyol resin; between about 43% and about 72% of the brominated epoxy resin; between about 3 ppH and 25 pph, of an epoxy cresol novolak resin, or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; and between about 2 and 5 parts by weight of the cationic photoinitiator.
Claim 4
Dependent Claim
38 words
The invention as defined in claim 1, wherein the molecular weight of the polyol resin is between about 60,000 and about 90,000; and the molecular weight of the brominated epoxy resin is between about 1,000 and about 1,700.
Claim 5
Dependent Claim
19 words
The invention as defined in claim 1, wherein an effective amount of up to 10% of photosensitizer is included.
Claim 6
Dependent Claim
14 words
The invention as defined in claim 1, wherein the photoinitiator is a sulfonium salt.
Claim 7
Dependent Claim
26 words
The invention as defined in claim 4, wherein the photosensitizer is selected from the group consisting of anthracene and its derivatives and perylene and its derivatives.
Claim 8
Dependent Claim
23 words
The invention as defined in claim 1, further characterized by an effective amount up to about 1 part by weight of a surfactant.
Claim 9
Dependent Claim
22 words
The invention as defined in claim 1, further characterized by an effective amount up to about 1 part by weight of dye.
Claim 10
Dependent Claim
63 words
The invention as defined in claim 1, wherein there is about 36% polyol resin; about 64% of the brominated epoxy resin; about 10 pph of an epoxy cresol novolak resin, or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; and about 5 parts by weight of sulfonium salt initiator.
Claim 11
Dependent Claim
31 words
The invention as defined in claim 1, wherein there is about 57% polyol resin; about 43% of the brominated epoxy resin; about 5 parts by weight of the sulfonium salt initiator.
Claim 12
Dependent Claim
54 words
The invention as defined in claim 1, wherein there is about 28% polyol resin; about 72% of the brominated epoxy resin; about 10 pph of an epoxy cresol novolak resin, or from an effective amount to less than about 25 pph polyepoxy resin; and about 5 parts by weight of the sulfonium salt initiator.
Claim 13
Dependent Claim
22 words
The invention as defined in claim 1, wherein the brominated epoxy resin is an epoxidized glycidyl of a tetrabromo bisphenol A resin.
Claim 14
Dependent Claim
23 words
The invention as defined in claim 1, wherein the brominated epoxy resin is an epoxidized glycidyl ether of a brominated bisphenol A resin.
Claim 15
Dependent Claim
20 words
The invention as defined in claim 1, further characterized by said resin system being dispersed in a moderately polar solvent.
Claim 16
Dependent Claim
16 words
The invention as defined in claim 14, wherein said solvent is propylene glycol monomethyl ether acetate.
Claim 17
Dependent Claim
19 words
The invention as defined in claim 14, wherein there is a concentration of about 40% solids in the solvent.
Claim 18
Dependent Claim
29 words
The invention as defined in claim 1, further characterized by from an effective amount up to about 40% by weight of a low molecular weight, liquid, difunctional epoxy resin.
Claim 19
Dependent Claim
54 words
The invention as defined in claim 1, wherein the resin system is comprised of about 28% polyol resin; about 43% of the brominated epoxy resin; and about 29 pph of a low molecular weight, difunctional epoxy resin; wherein the imaging system is comprised of about 5 parts by weight of the sulfonium salt initiator.
Claim 20
Dependent Claim
54 words
The invention as defined in claim 1, wherein the resin system is comprised of about 34% polyol resin; about 52% of the brominated epoxy resin; and about 14 pph of a low molecular weight difunctional epoxy resin; wherein the imaging system is comprised of about 5 parts by weight of the sulfonium salt initiator.
Claim 21
Dependent Claim
16 words
The invention as defined in claim 1, further characterized by an effective amount of a thixotrope.
Claim 22
Dependent Claim
24 words
The invention as defined in claim 1, further characterized by an effective amount of a low molecular weight polyol to act as a plasticizer.
Claim 23
Dependent Claim
182 words
An improved photosensitive cationically polymerizable epoxy base imaging system comprising: a. an epoxy resin system comprising: between about 28% and about 57% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and about 130,000; between about 43% and about 72% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A having a softening point of between about 60° and about 110° C. and a molecular weight of between about 600 and about 2,500; between about 3 pph and 25 pph, of an epoxy cresol novolak resin; or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; and said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2 mil thick film.
Claim 24
Dependent Claim
182 words
An improved photosensitive cationically polymerizable epoxy base imaging system comprising: a. an epoxy resin system comprising: between about 28% and about 57% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and about 130,000; between about 43% and about 72% by weight of an epoxidized glycidyl ether of tetrabromo bisphenol A having a softening point of between about 60° and about 110° C. and a molecular weight of between about 600 and about 2,500; between about 3 pph and 25 pph, of an epoxy cresol novolak resin; or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; and said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2 mil thick film.
Claim 25
Dependent Claim
165 words
A printed circuit board comprising: a. a printed circuit substrate; b. a photosensitive cationically polymerizable epoxy based imaging system disposed on said substrate and imaged, developed and cured to form a solder mask; said imaging system comprising: i. an epoxy resin system having solids comprising: (1) between about 10% and 90% by weight of a polyol resin; (2) between about 10% and about 90% by weight of a brominated epoxy resin; (3) between about 3 pph and 80 pph, of an epoxy cresol novolak resin; or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; ii. from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2 mil thick film.
Claim 26
Dependent Claim
165 words
A printed circuit board comprising: a. a printed circuit substrate; b. a photosensitive cationically polymerizable epoxy based imaging system disposed on said substrate and imaged, developed and cured to form a solder mask; said imaging system comprising: i. an epoxy resin system having solids comprising: (1) between about 10% and 90% by weight of a polyol resin; (2) between about 10% and about 90% by weight of a brominated epoxy resin; (3) between about 3 pph and 80 pph, of an epoxy cresol novolak resin; or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; ii. from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2 mil thick film.
Claim 27
Dependent Claim
37 words
The invention as defined in claim 22, wherein the molecular weight of the polyol resin is between about 40,000 and 130,000 and the molecular weight of the brominated epoxy resin is between about 600 and about 2500.
Claim 28
Dependent Claim
14 words
The invention as defined in claim 22, wherein the photoinitiator is a sulfonium salt.
Claim 29
Dependent Claim
24 words
The invention as defined in claim 22, further characterized by an effective amount of a low molecular weight polyol to act as a plasticizer.
Claim 30
Independent Claim
194 words
A method of producing a coated circuit board comprising the steps of: a. providing a photoimaging composition comprising: i. a photosensitive cationically polymerizable epoxy based imaging system comprising: (a) between about 10% and about 90% by weight of a polyol resin of a high molecular weight; (b) between about 10% and about 90% by weight of a brominated epoxy resin of a low molecular weight; (c) between about 3 pph and 80 pph, of an epoxy cresol novolak resin; or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; ii. from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2 mil thick film; b. providing a printed circuit substrate; c. coating the composition onto the printed circuit substrate; d. drying the composition; e. exposing the composition to actinic radiation; f. developing the composition; and, g. curing the composition.
Claim 31
Independent Claim
194 words
A method of producing a coated circuit board comprising the steps of: a. providing a photoimaging composition comprising: i. a photosensitive cationically polymerizable epoxy based imaging system comprising: (a) between about 10% and about 90% by weight of a polyol resin of a high molecular weight; (b) between about 10% and about 90% by weight of a brominated epoxy resin of a low molecular weight; (c) between about 3 pph and 80 pph, of an epoxy cresol novolak resin; or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; ii. from about 0.1 to about 15 parts by weight of a cationic photoinitiator capable of initiating polymerization in said epoxidized resin system upon exposure to actinic radiation; said resin system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2 mil thick film; b. providing a printed circuit substrate; c. coating the composition onto the printed circuit substrate; d. drying the composition; e. exposing the composition to actinic radiation; f. developing the composition; and, g. curing the composition.
Claim 32
Dependent Claim
81 words
The invention as defined in claim 27, wherein there is between about 28% and about 57% of the polyol resin; between about 43% and about 72% of the brominated epoxy resin; between about 3 pph to about 25 pph, of an epoxy cresol novolak resin; or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; and between about 2 and 5 parts by weight of the cationic photoinitiator.
Claim 33
Dependent Claim
37 words
The invention as defined in claim 27, wherein the molecular weight of the polyol resin is between about 60,000 and about 90,000; the molecular weight of the brominated epoxy resin is between about 1,000 and about 1,700.
Claim 34
Dependent Claim
19 words
The invention as defined in claim 27, wherein an effective amount of up to 10% of photosensitizer is included.
Claim 35
Dependent Claim
14 words
The invention as defined in claim 27, wherein the photoinitiator is a sulfonium salt.
Claim 36
Dependent Claim
26 words
The invention as defined in claim 27, wherein the photosensitizer is selected from the group consisting of anthracene and its derivatives and perylene and its derivatives.
Claim 37
Dependent Claim
62 words
The invention as defined in claim 27, wherein there is about 36% polyol resin; about 64% of the brominated epoxy resin; about 10 pph, of an epoxy cresol novolak resin; or from an effective amount to less than about 25 pph polyepoxy resin to increase the crosslinked density of the polymerized solder mask; about 5 parts by weight of sulfonium salt initiator.
Claim 38
Dependent Claim
31 words
The invention as defined in claim 27, wherein there is about 57% polyol resin; about 43% of the brominated epoxy resin; about 5 parts by weight of the sulfonium salt initiator.
Claim 39
Dependent Claim
31 words
The invention as defined in claim 27, wherein there is about 28% polyol resin; about 72% of the brominated epoxy resin; about 5 parts by weight of the sulfonium salt initiator.
Claim 40
Dependent Claim
23 words
The invention as defined in claim 27, wherein the brominated epoxy resin is an epoxidized glycidyl ether of a tetrabromo bisphenol A resin.
Claim 41
Dependent Claim
23 words
The invention as defined in claim 27, wherein the brominated epoxy resin is an epoxidized glycidyl ether of a brominated bisphenol A resin.
Claim 42
Dependent Claim
20 words
The invention as defined in claim 27, further characterized by said resin system being dispersed in a moderately polar solvent.
Claim 43
Dependent Claim
16 words
The invention as defined in claim 38, wherein said solvent is propylene glycol monomethyl ether acetate.
Claim 44
Dependent Claim
19 words
The invention as defined in claim 38, wherein there is a concentration of about 40% solids in the solvent.
Claim 45
Dependent Claim
27 words
The invention as defined in claim 27, further characterized by an effective amount up to about 40% by weight of a low molecular weight difunctional epoxy resin.
Claim 46
Dependent Claim
16 words
The invention as defined in claim 27, further characterized by an effective amount of a thixotrope.
Claim 47
Dependent Claim
24 words
The invention as defined in claim 27, further characterized by an effective amount of a low molecular weight polyol to act as a plasticizer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1996-11-22 | 1997-05-24 | 1997-11-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-22 | 2001-05-24 | 2001-11-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-22 | 2005-05-24 | 2005-11-23 | $7700.00 | Window Closed / Lapsed |