Patent US5918364A successfully refreshed from Google Patents.
US5918364A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming electrically conductive polymer interconnects on electrical substrates
Assignee: Adeia Semiconductor Technologies LLC
•
Filing: 1997-03-14
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Granted: 1999-07-06
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Expires: 2017-03-14
Abstract
Abstract A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
Inventors
- 👤 Frank W. Kulesza
- 👤 Richard H. Estes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1216; H05K3/30; H05K3/32; H05K3/321; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/44; H10W20/4473; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/099; H10W72/00; H10W72/01; H10W72/012; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10954; H05K2201/10977; H05K2201/10984; H05K2203/00; H05K2203/11; H05K2203/1189; H05K2203/14; H05K2203/1476; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0035; H05K3/22; H05K3/28; H05K3/303; H05K3/305; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07237; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/20; H10W72/221; H10W72/225; H10W72/241; H10W72/251; H10W72/252; H10W72/253; H10W72/30; H10W72/331; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/1092; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
125 words
A method of electrically connecting conductive contact pads of a first substrate to conductive contact pads of a second substrate, comprising the steps of: selectively forming an organic protective layer over a surface of one of the substrates where the contact pads of that one substrate are located, leaving the contact pads of that one substrate exposed; stenciling electrically conductive polymer bumps onto the contact pads of one of the substrates; positioning the contact pads of the first substrate in alignment with the contact pads of the second substrate and with the electrically conductive bumps being disposed between the aligned contact pads; and electrically connecting the contact pads of the first substrate to the contact pads of the second substrate through the electrically conductive bumps.
Claim 2
Independent Claim
125 words
A method of electrically connecting conductive contact pads of a first substrate to conductive contact pads of a second substrate, comprising the steps of: selectively forming an organic protective layer over a surface of one of the substrates where the contact pads of that one substrate are located, leaving the contact pads of that one substrate exposed; stenciling electrically conductive polymer bumps onto the contact pads of one of the substrates; positioning the contact pads of the first substrate in alignment with the contact pads of the second substrate and with the electrically conductive bumps being disposed between the aligned contact pads; and electrically connecting the contact pads of the first substrate to the contact pads of the second substrate through the electrically conductive bumps.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein the step of stenciling electrically conductive polymer bumps comprises stenciling polymer bumps filled with silver.
Claim 4
Dependent Claim
23 words
The method of claim 1 wherein the first substrate comprises a flip chip substrate and wherein the second substrate comprises a circuit substrate.
Claim 5
Dependent Claim
39 words
The method of claim 3 wherein the organic protective layer is selectively formed over a surface of the flip chip substrate and wherein the electrically conductive polymer bumps are stenciled onto the contact pads of the flip chip substrate.
Claim 6
Independent Claim
138 words
A method of electrically connecting conductive contact pads of a first substrate to conductive contact pads of a second substrate, comprising the steps of: selectively forming an organic protective layer over a surface of one of the substrates where the contact pads of that one substrate are located, leaving the contact pads of that one substrate exposed; stenciling electrically conductive polymer bumps onto the contact pads of the first substrate; screen printing electrically conductive polymer bumps onto the contact pads of the second substrate; positioning the contact pads of the first substrate in alignment with the contact pads of the second substrate and with the electrically conductive bumps being disposed between the aligned contact pads; and electrically connecting the contact pads of the first substrate to the contact pads of the second substrate through the electrically conductive bumps.
Claim 7
Independent Claim
138 words
A method of electrically connecting conductive contact pads of a first substrate to conductive contact pads of a second substrate, comprising the steps of: selectively forming an organic protective layer over a surface of one of the substrates where the contact pads of that one substrate are located, leaving the contact pads of that one substrate exposed; stenciling electrically conductive polymer bumps onto the contact pads of the first substrate; screen printing electrically conductive polymer bumps onto the contact pads of the second substrate; positioning the contact pads of the first substrate in alignment with the contact pads of the second substrate and with the electrically conductive bumps being disposed between the aligned contact pads; and electrically connecting the contact pads of the first substrate to the contact pads of the second substrate through the electrically conductive bumps.
Claim 8
Dependent Claim
22 words
The method of claim 5 wherein the first substrate comprises a flip chip substrate and the second substrate comprises a circuit substrate.
Claim 9
Independent Claim
137 words
A method of electrically connecting conductive contact pads of a first substrate to conductive contact pads of a second substrate, comprising the steps of: stenciling electrically conductive polymer bumps onto the contact pads of the first substrate; selectively forming an organic protective layer over a surface of the second substrate where the contact pads of the second substrate are located, leaving the contact pads of the second substrate exposed; screen printing electrically conductive polymer bumps onto the contact pads of the second substrate; positioning the contact pads of the first substrate in alignment with the contact pads of the second substrate and with the electrically conductive bumps being disposed between the aligned contact pads; and electrically connecting the contact pads of the first substrate to the contact pads of the second substrate through the electrically conductive bumps.
Claim 10
Independent Claim
137 words
A method of electrically connecting conductive contact pads of a first substrate to conductive contact pads of a second substrate, comprising the steps of: stenciling electrically conductive polymer bumps onto the contact pads of the first substrate; selectively forming an organic protective layer over a surface of the second substrate where the contact pads of the second substrate are located, leaving the contact pads of the second substrate exposed; screen printing electrically conductive polymer bumps onto the contact pads of the second substrate; positioning the contact pads of the first substrate in alignment with the contact pads of the second substrate and with the electrically conductive bumps being disposed between the aligned contact pads; and electrically connecting the contact pads of the first substrate to the contact pads of the second substrate through the electrically conductive bumps.
Claim 11
Dependent Claim
23 words
The method of claim 7 wherein the first substrate comprises a flip chip substrate and wherein the second substrate comprises a circuit substrate.
Claim 12
Independent Claim
32 words
The method of any of claims 1, 5, or 7 wherein the step of selectively forming an organic protective layer leaving the contact pads exposed comprises screen printing the organic protective layer.
Claim 13
Independent Claim
19 words
The method of any of claims 1, 5, or 7 wherein the organic protective layer comprises a dielectric polymer.
Claim 14
Dependent Claim
12 words
The method of claim 10 wherein the organic protective layer comprises. polyimide.
Claim 15
Independent Claim
19 words
The method of any of claims 1, 5, or 7 wherein the electrically conductive polymer bumps comprise thermoset bumps.
Claim 16
Independent Claim
19 words
The method of any of claims 1, 5, or 7 wherein the electrically conductive polymer bumps comprise thermoplastic bumps.
Claim 17
Independent Claim
20 words
The method of any of claims 1, 5, or 7 wherein the electrically conductive polymer bumps comprise B-stage polymer bumps.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-05 | 2003-01-04 | 2003-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-05 | 2007-01-04 | 2007-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-05 | 2011-01-04 | 2011-07-06 | $7700.00 | Window Closed / Lapsed |