US3757075A
Expired / Lapsed
US
⏱️ 0.0 years remaining
7m circuit method for producing small contacts of uniform thickness for tick fil
Assignee: Siemens AG
•
Filing: 1971-02-01
•
Granted: 1973-09-04
•
Expires: 1991-02-01
Abstract
Abstract A method of producing small contacts of uniform thickness for thick film circuits has the steps of applying interconnected contacts to a substrate of nonconductive material, firing the contacts to secure the later to the substrate, and subdividing the interconnected contacts to form mutually separated individual contacts.
Inventors
- 👤 H Munt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 14:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/027; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
81 words
A method of producing small contact surfaces of uniform thickness in semiconductor substrates for disposition in circuit relationship with thick-film circuits of semiconductor components by flip chip means, including the steps of: stencil screening a cohesive metal layer onto said substrate of electrically nonconductive material, firing said metal layer to secure the same to said substrate, and subdividing said metal layer with a pencil beam of electromagnetic energy, thereby forming mutually separated individual contacts having substantially flat surfaces of uniform thickness.
Claim 2
Independent Claim
81 words
A method of producing small contact surfaces of uniform thickness in semiconductor substrates for disposition in circuit relationship with thick-film circuits of semiconductor components by flip chip means, including the steps of: stencil screening a cohesive metal layer onto said substrate of electrically nonconductive material, firing said metal layer to secure the same to said substrate, and subdividing said metal layer with a pencil beam of electromagnetic energy, thereby forming mutually separated individual contacts having substantially flat surfaces of uniform thickness.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-09-03 | 1977-03-05 | 1977-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-09-03 | 1981-03-05 | 1981-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-09-03 | 1985-03-05 | 1985-09-04 | $7700.00 | Window Closed / Lapsed |