US4840302A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chromium-titanium alloy
Assignee: International Business Machines Corp
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Filing: 1988-04-15
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Granted: 1989-06-20
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Expires: 2008-04-15
Abstract
Abstract An alloy for contacting portions of a conductive interconnect layer exposed by an overlying organic insulating layer having apertures therethrough. The alloy contains chromium and titanium, and is formed such that at least 50 atm % of the total content of the alloy is titanium at the alloy-insulating layer interface.
Inventors
- 👤 David A. Gardner
- 👤 James G. Ryan
- 👤 Joseph G. Schaefer
- 👤 Erick G. Walton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 19:50
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10W72/90; H10W72/012; H10W72/20; H10W72/251; H10W72/29; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12458; Y10T428/12493; Y10T428/12528; Y10T428/12535; Y10T428/12583
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
43 words
An alloy layer for contacting portions of a conductive layer exposed through an overlying organic insulator layer disposed on a substrate, consisting of chromium and titanium, wherein at least 50 atm % of the alloy content at a lower surface thereof is titanium.
Claim 2
Dependent Claim
43 words
An alloy layer for contacting portions of a conductive layer exposed through an overlying organic insulator layer disposed on a substrate, consisting of chromium and titanium, wherein at least 50 atm % of the alloy content at a lower surface thereof is titanium.
Claim 3
Dependent Claim
24 words
The alloy layer according to claim 1, wherein approximately 60-70 atm % of the total alloy content at a lower surface thereof is titanium.
Claim 4
Dependent Claim
35 words
The alloy layer according to claim 1, wherein said conductive structure comprises a material selected from the group consisting of aluminum, aluminum-based alloys, refractory metals, refractory metal silicides, silver, copper, gold, and intermetallic compounds thereof.
Claim 5
Dependent Claim
25 words
The alloy layer according to claim 1, wherein said organic insulating material comprises a material selected from the group consisting of polyimide, polysilioxane, and polyethylene.
Claim 6
Dependent Claim
77 words
In a metallurgy structure disposed on a substrate for establishing electrical contact to portions of a conductive layer exposed, by an overlaying organic insulating layer, the metallurgy structure having a barrier layer and at least one other metal layer disposed on the barrier layer, the improvement wherein the barrier layer comprises a chromium-titanium alloy having at least 50 atm % titanium at a lower surface thereof in contact with the organic insulating layer and the conductive layer.
Claim 7
Dependent Claim
77 words
In a metallurgy structure disposed on a substrate for establishing electrical contact to portions of a conductive layer exposed, by an overlaying organic insulating layer, the metallurgy structure having a barrier layer and at least one other metal layer disposed on the barrier layer, the improvement wherein the barrier layer comprises a chromium-titanium alloy having at least 50 atm % titanium at a lower surface thereof in contact with the organic insulating layer and the conductive layer.
Claim 8
Dependent Claim
18 words
The metallurgy structure according to claim 5, wherein said at least one other metal layer consists of copper.
Claim 9
Dependent Claim
13 words
The metallurgy structure according to claim 5, further comprising a second metal layer.
Claim 10
Dependent Claim
15 words
The metallurgy structure according to claim 7, wherein said second metal layer consists of gold.
Claim 11
Dependent Claim
18 words
The metallurgy structure according to claim 7, further comprising a solder ball disposed on said second metal layer.
Claim 12
Dependent Claim
19 words
The metallurgy structure according to claim 9, wherein said solder ball is an alloy consisting of tin and lead.
Claim 13
Independent Claim
72 words
A method of producing a chromium-titanium alloy layer for contacting portions of a conductive layer exposed by an organic insulator layer having apertures therethrough, comprising the steps of: cleaning exposed portions of the conductive layer by exposure to a wet etchant solution; and depositing the alloy layer over the organic insulating layer so that at least 50 atom % of the total alloy content at the layer-organic insulating layer interface is titanium.
Claim 14
Independent Claim
72 words
A method of producing a chromium-titanium alloy layer for contacting portions of a conductive layer exposed by an organic insulator layer having apertures therethrough, comprising the steps of: cleaning exposed portions of the conductive layer by exposure to a wet etchant solution; and depositing the alloy layer over the organic insulating layer so that at least 50 atom % of the total alloy content at the layer-organic insulating layer interface is titanium.
Claim 15
Dependent Claim
37 words
The method according to claim 11, wherein said alloy is deposited by evaporation from a source material comprising at least approximately 87 atom %-88 atom % titanium and at most approximately 13 atom %-12 atom % chromium.
Claim 16
Dependent Claim
34 words
The method according to claim 12, wherein said evaporation comprises the steps of: placing said source material on a tungsten boat; and resistively heating the boat, thereby causing co-evaporation of the chromium and titanium.
Claim 17
Independent Claim
129 words
A method of providing an interconnect structure for contacting portions of a conductive layer exposed by an organic layer having apertures therethrough, comprising the steps of: producing a chromium-titanium alloy layer for contacting portions of a conductive layer exposed by an organic insulator having apertures therethrough, at least 50 atm. % of the alloy content at a lower surface of said produced alloy layer being titanium; cleaning exposed portions of the conductive layer by exposure to a wet etchant solution; depositing at least one additional conductive layer on said alloy layer; forming a solder ball on said at least one additional conductive layer; heating the solder ball to a temperature sufficient to melt said solder ball; and cooling said solder ball, thereby connecting said solder ball to the substrate.
Claim 18
Independent Claim
129 words
A method of providing an interconnect structure for contacting portions of a conductive layer exposed by an organic layer having apertures therethrough, comprising the steps of: producing a chromium-titanium alloy layer for contacting portions of a conductive layer exposed by an organic insulator having apertures therethrough, at least 50 atm. % of the alloy content at a lower surface of said produced alloy layer being titanium; cleaning exposed portions of the conductive layer by exposure to a wet etchant solution; depositing at least one additional conductive layer on said alloy layer; forming a solder ball on said at least one additional conductive layer; heating the solder ball to a temperature sufficient to melt said solder ball; and cooling said solder ball, thereby connecting said solder ball to the substrate.
Claim 19
Dependent Claim
45 words
An alloy layer for contacting portions of a conductive layer exposed through an overlying organic layer disposed on a substrate, said alloy layer comprising: chromium and titanium, wherein at least 50 atm. % of the alloy content at only a lower surface thereof is titanium.
Claim 20
Dependent Claim
45 words
An alloy layer for contacting portions of a conductive layer exposed through an overlying organic layer disposed on a substrate, said alloy layer comprising: chromium and titanium, wherein at least 50 atm. % of the alloy content at only a lower surface thereof is titanium.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-19 | 1992-12-19 | 1993-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-19 | 1996-12-19 | 1997-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-19 | 2000-12-19 | 2001-06-20 | $7700.00 | Window Closed / Lapsed |