Method and apparatus to bond a semiconductor chip to a carrier

Abstract

Abstract A method and an apparatus for bonding a semiconductor chip (1) to a carrier system (3), in which the already separated semiconductor chip (1) which is still in the wafer array and is mounted on a self-adhesive film (2) is peeled off the latter and mounted on a specified bonding point on the carrier system (3) and bonded to the latter, are intended to make it possible to mount the semiconductor chip (1) on a carrier system (3) with substantially less time expenditure and investment cost. The carrier system (3) is provided with a bonding material (4) at the specified bonding points. The wafer array on the self-adhesive film (2) is aligned in such a way that the face of a semiconductor chip (1) to be bonded is opposite a point, provided with bonding material (4), on the carrier system (3). The semiconductor chip (1) in the wafer array is positioned at a distance of </= 0.2 mm above the carrier system (3), pushed onto the bonding point, provided with bonding material (4), of the carrier system (3) by means of a pushing device (5) and bonded to said carrier system. The method and the apparatus according to the invention find application, in particular, in SMD chip mounting. <IMAGE>

Inventors

• 👤 Richard Scheuenpflug

Bibliographic Details