iconductor loading apparatus for bonding

Claim 1

An apparatus for transferring and positioning integrally leaded semiconductor chips onto a probe for bonding to lead frame structures, said apparatus comprising: a base member having a flat major surface; an elongated groove in said surface of the base member; an elongated slide member slidably disposed in said groove, said slide member having at least one aperture therethrough providing a cavity into which a semiconductor chip can be inserted; means on said base member surface for retaining said slide member in the groove; a flexible carrier having at least one integrally leaded semiconductor chip affixed thereto wherein the integral chip leads are contiguous said carrier; means for supporting said flexible carrier so that said chip is positioned over said aperture in the slide member, said carrier being responsive to a downward pressure so as to insert said chip into said aperture; an opening in said groove extending orthogonally from the groove through the base member so that a bonding probe may extend therethrough; and means for stopping translational movement of said slide member after it has stripped said chip from said carrier so that said chip is automatically positioned over said opening whereby said probe may engage the back side of the chip and raise it into aligned engagement with an overlying lead frame structure for bonding.

Claim 2

An apparatus for transferring and positioning integrally leaded semiconductor chips onto a probe for bonding to lead frame structures, said apparatus comprising: a base member having a flat major surface; an elongated groove in said surface of the base member; an elongated slide member slidably disposed in said groove, said slide member having at least one aperture therethrough providing a cavity into which a semiconductor chip can be inserted; means on said base member surface for retaining said slide member in the groove; a flexible carrier having at least one integrally leaded semiconductor chip affixed thereto wherein the integral chip leads are contiguous said carrier; means for supporting said flexible carrier so that said chip is positioned over said aperture in the slide member, said carrier being responsive to a downward pressure so as to insert said chip into said aperture; an opening in said groove extending orthogonally from the groove through the base member so that a bonding probe may extend therethrough; and means for stopping translational movement of said slide member after it has stripped said chip from said carrier so that said chip is automatically positioned over said opening whereby said probe may engage the back side of the chip and raise it into aligned engagement with an overlying lead frame structure for bonding.

Claim 3

An apparatus for automatically rapidly transferring and positioning integrally leaded semiconductor chips onto a magnetic probe for bonding to lead frame structures, said apparatus comprising: a non-ferromagnetic base member having two major parallel surfaces; an elongated groove in one surface of the base member; a non-ferromagnetic elongated slide member slidably disposed in said groove, said slide member having an aperture therethrough spaced a given distance from one end of said slide member, said aperture having a geometry similar and slightly larger than that of integrally leaded semiconductor chip thereby providing a cavity into which the chip can be inserted; means on said one base member surface for retaining said slide member in the groove; at least two rods slidably mounted in said base member underneath and perpendicular to said groove; two distally spaced support members being connected to one another by said rods; a transparent, flexible carrier strip having a plurality of spaced integrally leaded semiconductor chips affixed thereto wherein the integral chip leads are contiguous said carrier strip; means for securing said flexible carrier strip onto said support members whereby each chip can be individually positioned over the aperture in the slide member by laterally moving the support members, said carrier strip being responsive to a downward pressure so as to insert one of said chips into said aperture; a protrusion extending transversely across one end of said groove providing the surface for abutment of said one end of said slide member; an opening in said groove at said given distance from the protrusion and being slightly smaller than said aperture, said opening extending orthogonally from the groove through the base member so that a bonding probe may extend through the opening to engage the back side of a semiconductor chip after the slide member has stripped the chip from said carrier strip and automatically transferred and positioned the chip over the opening by abutting said protrusion.

Claim 4

An apparatus for automatically rapidly transferring and positioning integrally leaded semiconductor chips onto a magnetic probe for bonding to lead frame structures, said apparatus comprising: a non-ferromagnetic base member having two major parallel surfaces; an elongated groove in one surface of the base member; a non-ferromagnetic elongated slide member slidably disposed in said groove, said slide member having an aperture therethrough spaced a given distance from one end of said slide member, said aperture having a geometry similar and slightly larger than that of integrally leaded semiconductor chip thereby providing a cavity into which the chip can be inserted; means on said one base member surface for retaining said slide member in the groove; at least two rods slidably mounted in said base member underneath and perpendicular to said groove; two distally spaced support members being connected to one another by said rods; a transparent, flexible carrier strip having a plurality of spaced integrally leaded semiconductor chips affixed thereto wherein the integral chip leads are contiguous said carrier strip; means for securing said flexible carrier strip onto said support members whereby each chip can be individually positioned over the aperture in the slide member by laterally moving the support members, said carrier strip being responsive to a downward pressure so as to insert one of said chips into said aperture; a protrusion extending transversely across one end of said groove providing the surface for abutment of said one end of said slide member; an opening in said groove at said given distance from the protrusion and being slightly smaller than said aperture, said opening extending orthogonally from the groove through the base member so that a bonding probe may extend through the opening to engage the back side of a semiconductor chip after the slide member has stripped the chip from said carrier strip and automatically transferred and positioned the chip over the opening by abutting said protrusion.

Claim 5

A system for automatically transferring and bonding integrally leaded semiconductor chips to conductive lead frame structures, said system comprising: means for horizontally supporting a conductive lead frame having a plurality of sets of soft ferromagnetic spaced convergent cantilevered fingers; means for magnetically transferring semiconductor chips having soft ferromagnetic integral leads on one face thereof to an overlying set of lead frame fingers for bonding thereto, said transfer means having a soft ferromagnetic probe extending vertically therefrom; means for applying a magnetic field to said probe so that magnetic lines of flux are transmitted longitudinally therethrough, said magnetic field having a strength sufficient to raise a chip up from said probe into precisely aligned engagement with said lead frame fingers; a device for automatically successively positioning a chip onto one end of said probe, said device having a base member with an elongated groove in one surface thereof, a slide member slidably disposed in said groove, said slide member having an aperture therein for receiving a semiconductor chip, an opening disposed at one end of said groove extending perpendicularly through said base member whereby said probe can extend therethrough, and means for stopping translational movement of said slide member so that said aperture is aligned with said opening thereby automatically positioning a chip for engagement by said probe; a transparent flexible carrier strip having a plurality of spaced integrally leaded semiconductor chips affixed thereto; means for supporting said carrier strip over said slide member so that said chips are located between the slide member and the carrier strip; means for aligning one of said chips with said aperture in the slide member; means for pushing said chip into the aperture wherein translation of said slide member strips the chip from the carrier strip and automatically transfers it over the opening so that said probe can engage the chip and carry it into close proximity with an overlying set of lead frame fingers; and means for bonding said chip to the lead frame fingers after the magnetic field has raised the chip up from said probe to automatically align and engage the integral chip leads with their corresponding fingers.

Claim 6

A system for automatically transferring and bonding integrally leaded semiconductor chips to conductive lead frame structures, said system comprising: means for horizontally supporting a conductive lead frame having a plurality of sets of soft ferromagnetic spaced convergent cantilevered fingers; means for magnetically transferring semiconductor chips having soft ferromagnetic integral leads on one face thereof to an overlying set of lead frame fingers for bonding thereto, said transfer means having a soft ferromagnetic probe extending vertically therefrom; means for applying a magnetic field to said probe so that magnetic lines of flux are transmitted longitudinally therethrough, said magnetic field having a strength sufficient to raise a chip up from said probe into precisely aligned engagement with said lead frame fingers; a device for automatically successively positioning a chip onto one end of said probe, said device having a base member with an elongated groove in one surface thereof, a slide member slidably disposed in said groove, said slide member having an aperture therein for receiving a semiconductor chip, an opening disposed at one end of said groove extending perpendicularly through said base member whereby said probe can extend therethrough, and means for stopping translational movement of said slide member so that said aperture is aligned with said opening thereby automatically positioning a chip for engagement by said probe; a transparent flexible carrier strip having a plurality of spaced integrally leaded semiconductor chips affixed thereto; means for supporting said carrier strip over said slide member so that said chips are located between the slide member and the carrier strip; means for aligning one of said chips with said aperture in the slide member; means for pushing said chip into the aperture wherein translation of said slide member strips the chip from the carrier strip and automatically transfers it over the opening so that said probe can engage the chip and carry it into close proximity with an overlying set of lead frame fingers; and means for bonding said chip to the lead frame fingers after the magnetic field has raised the chip up from said probe to automatically align and engage the integral chip leads with their corresponding fingers.

Claim 7

A method of automatically transferring and bonding integrally leaded semiconductor chips to conductive lead frame structures, said method comprising: affixing an integrally leaded semiconductor device chip onto one surface of a flexible carrier strip so that the integral chip leads adhere to the strip; positioning the carrier strip over an elongated slide member slidably disposed in a groove on one surface of a positioning device so that said chip is located between the slide member and the carrier strip; aligning said chip with an aperture in the slide member; pushing said chip into said aperture; moving said slide member in the groove to strip the chip from the carrier strip and to transfer said chip over an opening extending perpendicularly from the groove through the base member of the positioning device; extending an alignment probe through the opening to engage the back side of the chip thereover; lifting said chip out of the slide member with the probe; aligning the integral chip leads with overlying corresponding fingers of a lead frame structure; and bonding said chip to the lead frame structure.

Claim 8

A method of automatically transferring and bonding integrally leaded semiconductor chips to conductive lead frame structures, said method comprising: affixing an integrally leaded semiconductor device chip onto one surface of a flexible carrier strip so that the integral chip leads adhere to the strip; positioning the carrier strip over an elongated slide member slidably disposed in a groove on one surface of a positioning device so that said chip is located between the slide member and the carrier strip; aligning said chip with an aperture in the slide member; pushing said chip into said aperture; moving said slide member in the groove to strip the chip from the carrier strip and to transfer said chip over an opening extending perpendicularly from the groove through the base member of the positioning device; extending an alignment probe through the opening to engage the back side of the chip thereover; lifting said chip out of the slide member with the probe; aligning the integral chip leads with overlying corresponding fingers of a lead frame structure; and bonding said chip to the lead frame structure.

Claim 9

A method of automatically transferring and bonding integrally leaded semiconductor chips to conductive lead frame structures, said method comprising: affixing a semiconductor wafer having a plurality of integrally leaded chips therein onto a flexible carrier strip so that the integrally chip leads adhere to the strip; dicing the wafer to separate each discrete chip; holding said carrier strip above an elongated slide member slidably disposed in a groove on one surface of a positioning device so that said chips are located between said carrier strip and said slide member; aligning one of said chips with an aperture in the slide member which is spaced a given distance from one end thereof; pushing said chip into the aperture; moving said slide member in the groove to strip said chip from the carrier strip; abutting said one end of the slide member against a protrusion extending transversely across the groove thereby automatically transferring and aligning said chip with an opening extending perpendicularly from the groove through the positioning device; extending an alignment probe through the opening in the positioning device to engage the back side of the chip thereover; lifting said chip out of the slide member; aligning the integral chip leads with overlying corresponding fingers of a lead frame structure; and flowing a hot gas onto the integral chip leads in engagement with the lead frame fingers to permanently bond the chip to the lead frame structure.

Claim 10

A method of automatically transferring and bonding integrally leaded semiconductor chips to conductive lead frame structures, said method comprising: affixing a semiconductor wafer having a plurality of integrally leaded chips therein onto a flexible carrier strip so that the integrally chip leads adhere to the strip; dicing the wafer to separate each discrete chip; holding said carrier strip above an elongated slide member slidably disposed in a groove on one surface of a positioning device so that said chips are located between said carrier strip and said slide member; aligning one of said chips with an aperture in the slide member which is spaced a given distance from one end thereof; pushing said chip into the aperture; moving said slide member in the groove to strip said chip from the carrier strip; abutting said one end of the slide member against a protrusion extending transversely across the groove thereby automatically transferring and aligning said chip with an opening extending perpendicularly from the groove through the positioning device; extending an alignment probe through the opening in the positioning device to engage the back side of the chip thereover; lifting said chip out of the slide member; aligning the integral chip leads with overlying corresponding fingers of a lead frame structure; and flowing a hot gas onto the integral chip leads in engagement with the lead frame fingers to permanently bond the chip to the lead frame structure.

Claim 11

A method of automatically transferring and magnetically aligning integrally leaded semiconductor chips to conductive lead frame structures for bonding, said method comprising: affixing a semiconductor wafer having a plurality of chips with soft ferromagnetic integral leads thereon onto a flexible carrier strip so that the integrally chip leads adhere to the strip; dicing the wafer to separate each discrete chip; expanding the flexible carrier strip to further separate each discrete chip from one another; securing opposite ends of the carrier strip to support members translationally connected to a positioning device having a slide member slidably mounted in a groove on one surface thereof, thereby locating said chips between said slide member and said carrier strip; aligning one of said chips with an aperture in the slide member which is spaced a given distance from one end thereof; pushing said chip with a vertically extending rod into said aperture in the slide member; moving said slide member in the groove to strip the one semiconductor chip from the carrier strip; abutting said one end of the slide member against a protrusion extending transversely across the groove thereby automatically transferring and aligning said chip with an opening extending perpendicularly from the groove through the positioning device; positioning a conductive lead frame structure having sets of soft ferromagnetIc spaced fingers corresponding to said integral chip leads so that a finger set overlies the opening in the positioning device; applying a magnetic field to a soft ferromagnetic probe so that magnetic lines of flux are transmitted longitudinally therethrough; extending said probe through said opening to engage said back side of the chip thereover; raising the chip with said probe to within close proximity of said lead frame fingers whereby the magnetic force from said probe raises said chip the rest of the way to the fingers and concurrently automatically orients the chip while in transit thereto so that the integral chip leads are in precise aligned engagement with their corresponding lead frame fingers; and heating said integral chip lead-finger engagement to permanently bond said chip to said lead frame.

Claim 12

A method of automatically transferring and magnetically aligning integrally leaded semiconductor chips to conductive lead frame structures for bonding, said method comprising: affixing a semiconductor wafer having a plurality of chips with soft ferromagnetic integral leads thereon onto a flexible carrier strip so that the integrally chip leads adhere to the strip; dicing the wafer to separate each discrete chip; expanding the flexible carrier strip to further separate each discrete chip from one another; securing opposite ends of the carrier strip to support members translationally connected to a positioning device having a slide member slidably mounted in a groove on one surface thereof, thereby locating said chips between said slide member and said carrier strip; aligning one of said chips with an aperture in the slide member which is spaced a given distance from one end thereof; pushing said chip with a vertically extending rod into said aperture in the slide member; moving said slide member in the groove to strip the one semiconductor chip from the carrier strip; abutting said one end of the slide member against a protrusion extending transversely across the groove thereby automatically transferring and aligning said chip with an opening extending perpendicularly from the groove through the positioning device; positioning a conductive lead frame structure having sets of soft ferromagnetIc spaced fingers corresponding to said integral chip leads so that a finger set overlies the opening in the positioning device; applying a magnetic field to a soft ferromagnetic probe so that magnetic lines of flux are transmitted longitudinally therethrough; extending said probe through said opening to engage said back side of the chip thereover; raising the chip with said probe to within close proximity of said lead frame fingers whereby the magnetic force from said probe raises said chip the rest of the way to the fingers and concurrently automatically orients the chip while in transit thereto so that the integral chip leads are in precise aligned engagement with their corresponding lead frame fingers; and heating said integral chip lead-finger engagement to permanently bond said chip to said lead frame.