Connecting method of electronic part

Abstract

Abstract PURPOSE:To enable to connect at low temperature and to obtain suitable connection irrespective of the quality of a substrate wiring material by interposing an insulating layer formed with through holes at the parts corresponding to pads between a pad forming surface and a substrate, and interposing a conductive adhesive in the holes of the layer. CONSTITUTION:An acrylic photocurable resin tape 8 is coated on the pad forming surface of an LSI wafer 1 having aluminum pads 2. Then, through holes 9 are formed at the parts opposed to the pads 2 of the tape 8, and conductive adhesive 7 is filled and coated by printing means in the holes 9. It is cut at the part designated by an arrow, a photocurable resin tape 8 is formed on the pad forming surface, thereby obtaining an LSI chip filled and coated with the adhesive 7 in the holes 9 of the tape 8. The tape surface of the chip 1 thus obtained is matched to the wiring forming surface of a substrate 6, the adhesive 7 and the wirings 5 are further positioned, pressed, and heated to be cured.

Inventors

• 👤 Yukihiro Inoue
• 👤 幸弘 井上

Bibliographic Details