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US5793076A Expired / Lapsed US ⏱️ 0.0 years remaining

Scalable high dielectric constant capacitor

Assignee: Round Rock Research LLC
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Filing: 1995-09-21
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Granted: 1998-08-11
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Expires: 2015-09-21
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Abstract

Abstract A capacitor for high density DRAM applications comprises a high-ε capacitor dielectric such as BST or PZT in an arrangement which obviates the need for barrier layers during fabrication. The fabrication process allows for electrode placement by simple sputter deposition and further provides for the possibility of capacitor spacing below that of conventional lithographic techniques.

Inventors

  • 👤 Pierre C. Fazan
  • 👤 Paul Schuele

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 11:50
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/01; H10B12/02; H10B12/03; H10B12/033; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/682; H10D1/692

Claims Analysis

Total Claims: 18
Claim 1
Independent Claim 62 words
A thin film capacitor in an integrated circuit comprising: an inner electrode having an outer side wall and a top surface, said inner electrode electrically connected to a silicon substrate; a dielectric layer surrounding the outer side wall without overlying the inner electrode top surface; and an outer electrode adjacent to the dielectric layer, wherein the outer electrode comprises a conductive oxide.
Claim 2
Dependent Claim 62 words
A thin film capacitor in an integrated circuit comprising: an inner electrode having an outer side wall and a top surface, said inner electrode electrically connected to a silicon substrate; a dielectric layer surrounding the outer side wall without overlying the inner electrode top surface; and an outer electrode adjacent to the dielectric layer, wherein the outer electrode comprises a conductive oxide.
Claim 3
Dependent Claim 15 words
The thin film capacitor of claim 1, wherein the conductive oxide comprises RuO 2 .
Claim 4
Dependent Claim 65 words
A thin film capacitor in an integrated circuit comprising: an inner electrode having an outer side wall and a top surface, said inner electrode electrically connected to a silicon substrate; a dielectric layer surrounding the outer side wall without overlying the inner electrode top surface; and an outer electrode adjacent to the dielectric layer, wherein the dielectric layer has a dielectric constant greater than 100.
Claim 5
Dependent Claim 65 words
A thin film capacitor in an integrated circuit comprising: an inner electrode having an outer side wall and a top surface, said inner electrode electrically connected to a silicon substrate; a dielectric layer surrounding the outer side wall without overlying the inner electrode top surface; and an outer electrode adjacent to the dielectric layer, wherein the dielectric layer has a dielectric constant greater than 100.
Claim 6
Dependent Claim 31 words
The thin film capacitor of claim 3, wherein the dielectric layer comprises a material selected from the group consisting of barium titanate, strontium titanate, barium strontium titanate and lead zirconate titanate.
Claim 7
Dependent Claim 64 words
A thin film capacitor in an integrated circuit comprising: an inner electrode having an outer side wall and a top surface, said inner electrode electrically connected to a silicon substrate; a dielectric layer surrounding the outer side wall without overlying the inner electrode top surface; and an outer electrode adjacent to the dielectric layer, wherein the outer electrode is comprised of a single metal.
Claim 8
Dependent Claim 64 words
A thin film capacitor in an integrated circuit comprising: an inner electrode having an outer side wall and a top surface, said inner electrode electrically connected to a silicon substrate; a dielectric layer surrounding the outer side wall without overlying the inner electrode top surface; and an outer electrode adjacent to the dielectric layer, wherein the outer electrode is comprised of a single metal.
Claim 9
Dependent Claim 62 words
A thin film capacitor in an integrated circuit comprising: an inner electrode having an outer side wall and a top surface, said inner electrode electrically connected to a silicon substrate; a dielectric layer surrounding the outer side wall without overlying the inner electrode top surface; and an outer electrode adjacent to the dielectric layer, wherein the outer electrode is comprised of platinum.
Claim 10
Dependent Claim 62 words
A thin film capacitor in an integrated circuit comprising: an inner electrode having an outer side wall and a top surface, said inner electrode electrically connected to a silicon substrate; a dielectric layer surrounding the outer side wall without overlying the inner electrode top surface; and an outer electrode adjacent to the dielectric layer, wherein the outer electrode is comprised of platinum.
Claim 11
Dependent Claim 83 words
A capacitor in an integrated circuit, comprising: a reference electrode layer having a via therein, the via defining a conductive container; a dielectric layer lining the conductive container, the dielectric layer defining a dielectric container; and a storage electrode layer lining the dielectric container and extending through a bottom of the dielectric container to electrically communicate with a semiconductor substrate, wherein the storage electrode fills the dielectric container, wherein the dielectric layer comprises a material having a dielectric constant greater than about 100.
Claim 12
Dependent Claim 83 words
A capacitor in an integrated circuit, comprising: a reference electrode layer having a via therein, the via defining a conductive container; a dielectric layer lining the conductive container, the dielectric layer defining a dielectric container; and a storage electrode layer lining the dielectric container and extending through a bottom of the dielectric container to electrically communicate with a semiconductor substrate, wherein the storage electrode fills the dielectric container, wherein the dielectric layer comprises a material having a dielectric constant greater than about 100.
Claim 13
Dependent Claim 74 words
An integrated circuit comprising: a conductive layer having a plurality of vias formed therethrough; a plurality of dielectric layers, each of the dielectric layers lining one of the vias and having an opening at the bottom thereof; and a plurality of storage electrodes, each of the storage electrodes directly contacting one of the dielectric layers within the vias and extending through the opening at the bottom thereof to electrically contact a semiconductor active area.
Claim 14
Dependent Claim 74 words
An integrated circuit comprising: a conductive layer having a plurality of vias formed therethrough; a plurality of dielectric layers, each of the dielectric layers lining one of the vias and having an opening at the bottom thereof; and a plurality of storage electrodes, each of the storage electrodes directly contacting one of the dielectric layers within the vias and extending through the opening at the bottom thereof to electrically contact a semiconductor active area.
Claim 15
Dependent Claim 25 words
The integrated circuit of claim 8, wherein each of the vias is filled by one of the dielectric layers and one of the storage electrodes.
Claim 16
Dependent Claim 19 words
The integrated circuit of claim 8, wherein each of the dielectric layers has a dielectric constant greater than 100.
Claim 17
Dependent Claim 14 words
The integrated circuit of claim 8, wherein the conductive layer comprises a conductive oxide.
Claim 18
Dependent Claim 12 words
The integrated circuit of claim 8, wherein the conductive layer comprises titanium.

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Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-08-10 2002-02-09 2002-08-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-08-10 2006-02-09 2006-08-11 $3760.00 Window Closed / Lapsed
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