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US4890191A Expired / Lapsed US ⏱️ 0.0 years remaining

Integrated circuits

Assignee: STC PLC
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Filing: 1989-01-31
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Granted: 1989-12-26
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Expires: 2009-01-31
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Abstract

Abstract In a semi-custom integrated circuit, e.g. a bipolar analogue array, underpass areas are so configured as to permit operation as capacitors by suitable configuration of a user determined interconnection pattern. Typically each underpass comprises a highly doped region disposed over a buried layer. A thin oxide layer is applied to the surface of the underpass. Suitable configuration of polysilicon and metal masks provides either a cross-over or a capacitor.

Inventors

  • 👤 George H. S. Rokos

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 13:46
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/20; H10D; H10D84/00; H10D84/90; H10D84/901

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 187 words
In an integrated circuitg a conductor cross-over structure including: (a) a p - -type silicon substrate; (b) an n - -type epitaxial layer disposed on the substrate; (c) a buried n - -type region extending through the epitaxial layer and the substrate; (d) an n + -type region extending through the epitaxial layer and providing electrical contact to the buried layer; (e) an oxide layer disposed on the epitaxial layer having spaced openings each exposing a portion of the n + -type region; (f) a polysilicon layer applied to the oxide layer and contacting the n + -type region via the windows; (g) an insulator layer applied to a polysilicon layer and having spaced openings each exposing a portion of the polysilicon layer; and (h) a patterned metallisation layer providing a conductor track and contacts to the polysilicon layer via said openings in the insulator layer; wherein said conductor track provides a first current path of the cross-over, and wherein the parallel combination of the polysilicon layer, the n + -type region and the n + -type buried layer provides a second current path of the cross-over.
Claim 2
Dependent Claim 187 words
In an integrated circuitg a conductor cross-over structure including: (a) a p - -type silicon substrate; (b) an n - -type epitaxial layer disposed on the substrate; (c) a buried n - -type region extending through the epitaxial layer and the substrate; (d) an n + -type region extending through the epitaxial layer and providing electrical contact to the buried layer; (e) an oxide layer disposed on the epitaxial layer having spaced openings each exposing a portion of the n + -type region; (f) a polysilicon layer applied to the oxide layer and contacting the n + -type region via the windows; (g) an insulator layer applied to a polysilicon layer and having spaced openings each exposing a portion of the polysilicon layer; and (h) a patterned metallisation layer providing a conductor track and contacts to the polysilicon layer via said openings in the insulator layer; wherein said conductor track provides a first current path of the cross-over, and wherein the parallel combination of the polysilicon layer, the n + -type region and the n + -type buried layer provides a second current path of the cross-over.

References Cited (Backward Citations)

US3547716A Cited
US3764409A Cited
US3860836A Cited
US4167018A Cited
US4758873A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-12-25 1993-06-26 1993-12-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-12-25 1997-06-26 1997-12-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-12-25 2001-06-26 2001-12-26 $7700.00 Window Closed / Lapsed

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