Patent US5572065A successfully refreshed from Google Patents.
US5572065A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetically sealed ceramic integrated circuit heat dissipating package
Assignee: Tamiras Per Pte Ltd LLC
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Filing: 1994-10-24
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Granted: 1996-11-05
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Expires: 2014-10-24
Abstract
Abstract A method and apparatus for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and external lead frame allow an ultra-thin overall package that may be used singularly or further densely packaged into a three dimensional multi-package array and still meet the critical performance and reliability requirements for both military and aerospace applications.
Inventors
- 👤 Carmen D. Burns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:32
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W40/00; H10W40/10; H10W42/00; H10W42/20; H10W42/25; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/60; H10W70/62; H10W70/65; H10W70/67; H10W70/68; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60; H10W95/00; H10W70/682; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5524; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 78
Claim 1
Independent Claim
176 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising three thin layers, including a ceramic base, metal on ceramic wire bond pads and metal on ceramic seal ring, respectively, fused together to form a hermetically sealable ceramic housing, said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; and said lead frame conductors are connected to said housing wire bond pads.
Claim 2
Dependent Claim
176 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising three thin layers, including a ceramic base, metal on ceramic wire bond pads and metal on ceramic seal ring, respectively, fused together to form a hermetically sealable ceramic housing, said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; and said lead frame conductors are connected to said housing wire bond pads.
Claim 3
Dependent Claim
18 words
The hermetically sealed package of claim 1, wherein the ceramic base layer is at least 8 mils thick.
Claim 4
Dependent Claim
19 words
The hermetically sealed package of claim 1, wherein the wire bond pads layer is at least 7 mils thick.
Claim 5
Dependent Claim
190 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprised of three thin layers: a ceramic base, metal on ceramic wire bond pads and metal on ceramic seal ring, respectively, fused together to form a hermetically sealable ceramic housing; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; wherein said lead frame conductors are connected to said housing wire bond pads; and wherein the ceramic housing seal ring layer is at least 7 mils thick.
Claim 6
Dependent Claim
190 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprised of three thin layers: a ceramic base, metal on ceramic wire bond pads and metal on ceramic seal ring, respectively, fused together to form a hermetically sealable ceramic housing; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; wherein said lead frame conductors are connected to said housing wire bond pads; and wherein the ceramic housing seal ring layer is at least 7 mils thick.
Claim 7
Dependent Claim
177 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; wherein said lead frame conductors are connected to said housing wire bond pads; said package further comprising an adhesive layer comprised of silver loaded glass disposed between said integrated circuit chip and said ceramic housing.
Claim 8
Dependent Claim
177 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; wherein said lead frame conductors are connected to said housing wire bond pads; said package further comprising an adhesive layer comprised of silver loaded glass disposed between said integrated circuit chip and said ceramic housing.
Claim 9
Dependent Claim
176 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; wherein said lead frame conductors are connected to said housing wire bond pads; and wherein said integrated circuit chip connection pads and said housing wire bond pads are connected together by aluminum bonding wires.
Claim 10
Dependent Claim
176 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; wherein said lead frame conductors are connected to said housing wire bond pads; and wherein said integrated circuit chip connection pads and said housing wire bond pads are connected together by aluminum bonding wires.
Claim 11
Dependent Claim
166 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; and said lead frame conductors are connected to said housing wire bond pads; wherein said housing seal ring is comprised of a solder ring.
Claim 12
Dependent Claim
166 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; and said lead frame conductors are connected to said housing wire bond pads; wherein said housing seal ring is comprised of a solder ring.
Claim 13
Dependent Claim
165 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; said lead frame conductors are connected to said housing wire bond pads; and a thin insulating layer over said cover and hermetic seal.
Claim 14
Dependent Claim
165 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; said lead frame conductors are connected to said housing wire bond pads; and a thin insulating layer over said cover and hermetic seal.
Claim 15
Dependent Claim
13 words
The hermetically sealed package of claim 8, wherein the insulating layer is polymer.
Claim 16
Dependent Claim
203 words
A hermetically sealed ceramic integrated circuit package having a standard size and housing various sizes of integrated circuit chip dies with connections thereto made by means of a first lead frame laminated onto the face of the chip, the package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a first lead frame laminated thereto, said first lead frame having a plurality of conductors connected to connection pads of said integrated circuit chip; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said first lead frame is accessible from within said ceramic housing; said first lead frame conductors connected to said housing bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a second lead frame having a plurality of electrical conductors; said second lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said second lead frame are fixedly aligned with said housing bond pads; and said second lead frame conductors are connected to said housing bond pads.
Claim 17
Dependent Claim
203 words
A hermetically sealed ceramic integrated circuit package having a standard size and housing various sizes of integrated circuit chip dies with connections thereto made by means of a first lead frame laminated onto the face of the chip, the package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a first lead frame laminated thereto, said first lead frame having a plurality of conductors connected to connection pads of said integrated circuit chip; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said first lead frame is accessible from within said ceramic housing; said first lead frame conductors connected to said housing bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a second lead frame having a plurality of electrical conductors; said second lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said second lead frame are fixedly aligned with said housing bond pads; and said second lead frame conductors are connected to said housing bond pads.
Claim 18
Dependent Claim
173 words
A hermetically sealed ceramic integrated circuit package having good thermal, conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; and said lead frame conductors are connected to said housing wire bond pads; wherein said integrated circuit chip and ceramic housing are attached together by laminating a thermally filled polymer therebetween.
Claim 19
Dependent Claim
173 words
A hermetically sealed ceramic integrated circuit package having good thermal, conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; and said lead frame conductors are connected to said housing wire bond pads; wherein said integrated circuit chip and ceramic housing are attached together by laminating a thermally filled polymer therebetween.
Claim 20
Dependent Claim
206 words
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip the package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed; a metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said ground plane laminated to said first layer of adhesive; a second layer of adhesive on said ground plane wherein the circuit connection pads are exposed; a lead frame having a plurality of electrical conductors, said lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame is accessible from within said ceramic housing; said lead frame conductors and said metal ground plane connected to said housing bond pads; and a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
Claim 21
Dependent Claim
206 words
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip the package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed; a metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said ground plane laminated to said first layer of adhesive; a second layer of adhesive on said ground plane wherein the circuit connection pads are exposed; a lead frame having a plurality of electrical conductors, said lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame is accessible from within said ceramic housing; said lead frame conductors and said metal ground plane connected to said housing bond pads; and a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
Claim 22
Dependent Claim
17 words
The hermetically sealed package of claim 12, wherein the adhesive is thermally conductive and electrically insulating material.
Claim 23
Dependent Claim
21 words
The hermetically sealed package of claim 12 wherein said lead frame and said ground plane comprise a constant impedance stripline system.
Claim 24
Dependent Claim
172 words
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed; a lead frame having a plurality of electrical conductors, said lead frame laminated to said first layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto; a second layer of adhesive on said lead frame; a metal ground plane, said ground plane laminated to said second layer of adhesive; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame and said ground plane are accessible from within said ceramic housing; said lead frame conductors and said metal ground plane connected to said housing bond pads; and a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
Claim 25
Dependent Claim
172 words
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed; a lead frame having a plurality of electrical conductors, said lead frame laminated to said first layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto; a second layer of adhesive on said lead frame; a metal ground plane, said ground plane laminated to said second layer of adhesive; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame and said ground plane are accessible from within said ceramic housing; said lead frame conductors and said metal ground plane connected to said housing bond pads; and a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
Claim 26
Dependent Claim
222 words
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed; a first metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said first ground plane laminated to said first layer of adhesive; a second layer of adhesive on said first ground plane wherein the circuit connection pads are exposed; a lead frame having a plurality of electrical conductors, said lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto; a third layer of adhesive on said lead frame; a second metal ground plane, said ground plane laminated to said third layer of adhesive; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame and said ground planes are accessible from within said ceramic housing; said lead frame conductors and said first and second metal ground planes connected to said housing bond pads; and a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
Claim 27
Dependent Claim
222 words
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed; a first metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said first ground plane laminated to said first layer of adhesive; a second layer of adhesive on said first ground plane wherein the circuit connection pads are exposed; a lead frame having a plurality of electrical conductors, said lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto; a third layer of adhesive on said lead frame; a second metal ground plane, said ground plane laminated to said third layer of adhesive; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said lead frame and said ground planes are accessible from within said ceramic housing; said lead frame conductors and said first and second metal ground planes connected to said housing bond pads; and a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together.
Claim 28
Dependent Claim
24 words
The hermetically sealed package of claim 16 wherein said lead frame, and said first and second ground planes comprise a constant impedance microstrip system.
Claim 29
Dependent Claim
273 words
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed; a first metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said first ground plane laminated to said first layer of adhesive; a second layer of adhesive on said first ground plane wherein the circuit connection pads are exposed; a first lead frame having a plurality of electrical conductors, said first lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said first lead frame is accessible from within said ceramic housing; said first lead frame conductors and said first metal ground plane connected to said housing bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a second metal ground plane, said second metal ground plane laminated to said ceramic housing; a third layer of adhesive on said second ground plane; a second lead frame having a plurality of electrical conductors, said second lead frame attached to said third layer of adhesive, wherein the plurality of electrical conductors of said second lead frame are fixedly aligned with said housing bond pads; and said second lead frame conductors are connected to said housing bond pads.
Claim 30
Dependent Claim
273 words
A hermetically sealed ceramic integrated circuit package housing an integrated circuit chip, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on the face of said integrated circuit chip wherein the circuit connection pads are exposed; a first metal ground plane having openings corresponding to said integrated circuit connection pads for allowing connection therethrough, said first ground plane laminated to said first layer of adhesive; a second layer of adhesive on said first ground plane wherein the circuit connection pads are exposed; a first lead frame having a plurality of electrical conductors, said first lead frame laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads with connection thereto; a ceramic housing comprising a base, bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein said first lead frame is accessible from within said ceramic housing; said first lead frame conductors and said first metal ground plane connected to said housing bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a second metal ground plane, said second metal ground plane laminated to said ceramic housing; a third layer of adhesive on said second ground plane; a second lead frame having a plurality of electrical conductors, said second lead frame attached to said third layer of adhesive, wherein the plurality of electrical conductors of said second lead frame are fixedly aligned with said housing bond pads; and said second lead frame conductors are connected to said housing bond pads.
Claim 31
Dependent Claim
21 words
The hermetically sealed package of claim 18, wherein the second ground plane is adapted for connection to a system heat sink.
Claim 32
Dependent Claim
23 words
The hermetically sealed package of claim 18, wherein the second ground plane is adapted for connection to an electrically low noise system ground.
Claim 33
Dependent Claim
163 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; and said lead frame conductors are connected to said housing wire bond pads; wherein connections are made by thermal compression bonding.
Claim 34
Dependent Claim
163 words
A hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein, comprising: an integrated circuit chip having a face with circuit connection pads thereon; a ceramic housing comprising a base, wire bond pads and seal ring; said integrated circuit chip attached in said ceramic housing and positioned wherein the integrated circuit chip face is accessible from within said ceramic housing; said integrated circuit chip connection pads connected to said housing wire bond pads; a cover, said cover attached to said ceramic housing seal ring wherein said cover and housing are hermetically sealed together; a lead frame having a plurality of electrical conductors; said lead frame attached to said ceramic housing base wherein the plurality of electrical conductors of said lead frame are fixedly aligned with said housing wire bond pads; and said lead frame conductors are connected to said housing wire bond pads; wherein connections are made by thermal compression bonding.
Claim 35
Dependent Claim
130 words
A lead frame on integrated circuit package of the type having upper and lower substantially planar exterior major surfaces, said package comprising: an integrated circuit package having upper and lower major surfaces, a plurality of sides and having circuit conductors passing through at least one of said sides; a first lead frame formed having a plurality of electrical conductors arranged in a substantially planar element; wherein said first lead frame is affixed in heat exchange relationship to said upper or lower major surface of said integrated circuit package and selected ones of said package circuit conductors are electrically connected to selected ones of said lead frame conductors; and wherein said lead frame is affixed to said upper or lower major surface of said integrated circuit package with thermally conductive adhesive.
Claim 36
Dependent Claim
130 words
A lead frame on integrated circuit package of the type having upper and lower substantially planar exterior major surfaces, said package comprising: an integrated circuit package having upper and lower major surfaces, a plurality of sides and having circuit conductors passing through at least one of said sides; a first lead frame formed having a plurality of electrical conductors arranged in a substantially planar element; wherein said first lead frame is affixed in heat exchange relationship to said upper or lower major surface of said integrated circuit package and selected ones of said package circuit conductors are electrically connected to selected ones of said lead frame conductors; and wherein said lead frame is affixed to said upper or lower major surface of said integrated circuit package with thermally conductive adhesive.
Claim 37
Dependent Claim
18 words
The package of claim 22, wherein said surfaces of said integrated circuit package are covered with polymeric film.
Claim 38
Dependent Claim
20 words
The package of claim 22, further comprising: a heat spreader affixed in heat exchange relationship to said first lead frame.
Claim 39
Dependent Claim
26 words
The package of claim 24, further comprising: a second heat spreader affixed in heat exchange relationship to said lower major surface of said integrated circuit package.
Claim 40
Dependent Claim
65 words
The package of claim 25, further comprising: a second lead frame having a plurality of electrical conductors arranged in a substantially planar element; and wherein said second lead frame is affixed in heat exchange relationship to the lower major surface of said second heat spreader; and selected ones of said package circuit conductors are electrically connected to selected ones of said second lead frame conductors.
Claim 41
Dependent Claim
21 words
The package of claim 26, further comprising: a third heat spreader affixed in heat exchange relationship to said second lead frame.
Claim 42
Dependent Claim
23 words
The package of claim 24, wherein said heat spreader comprises an electrically conductive ground plane adapted for connection to an electrical signal ground.
Claim 43
Dependent Claim
23 words
The package of claim 28, wherein said ground plane has holes to facilitate connection to selected ones of said first lead frame conductors.
Claim 44
Dependent Claim
22 words
The package of claim 28, wherein said ground plane and said first lead frame comprise a stripline high frequency signal transmission system.
Claim 45
Dependent Claim
24 words
The package of claim 22, further comprising: a heat spreader affixed in heat exchange relationship to a major surface of said integrated circuit package.
Claim 46
Dependent Claim
34 words
The package of claim 31, further comprising: a second lead frame having a plurality of conductive elements formed in a substantially planar thermally conductive element affixed in heat exchange relationship to said heat spreader.
Claim 47
Dependent Claim
64 words
The package of claim 22, further comprising: a second lead frame having a plurality of electrical conductors arranged in a substantially planar element; and wherein said second lead frame is affixed in heat exchange relationship to said lower major surface of said integrated circuit package and selected ones of said package circuit conductors are electrically connected to selected ones of said lead frame conductors.
Claim 48
Dependent Claim
19 words
The package of claim 33, wherein said lead frames are affixed to said major surfaces with thermally conductive adhesive.
Claim 49
Dependent Claim
20 words
The package of claim 33, further comprising: a heat spreader affixed in heat exchange relationship to said first lead frame.
Claim 50
Dependent Claim
23 words
The package of claim 35, wherein said heat spreader comprises an electrically conductive ground plane adapted for connection to an electrical signal ground.
Claim 51
Dependent Claim
23 words
The package of claim 36, wherein said ground plane has holes to facilitate connection to selected ones of said first lead frame conductors.
Claim 52
Dependent Claim
23 words
The package of claim 36, wherein said first ground plane and said first lead frame comprise a stripline high frequency signal transmission system.
Claim 53
Dependent Claim
20 words
The package of claim 33, further comprising: a heat spreader affixed in heat exchange relationship to said second lead frame.
Claim 54
Dependent Claim
23 words
The package of claim 39, wherein said heat spreader comprises an electrically conductive ground plane adapted for connection to an electrical signal ground.
Claim 55
Dependent Claim
23 words
The package of claim 40, wherein said ground plane has holes to facilitate connection to selected ones of said second lead frame conductors.
Claim 56
Dependent Claim
23 words
The package of claim 40, wherein said first ground plane and said second lead frame comprise a stripline high frequency signal transmission system.
Claim 57
Dependent Claim
26 words
The package of claim 39, wherein said first and second heat spreaders comprise an electrically conductive ground plane adapted for connection to an electrical signal ground.
Claim 58
Dependent Claim
27 words
The package of claim 43, wherein said ground plane has holes to facilitate connection to selected ones of said first or second, or both, lead frame conductors.
Claim 59
Dependent Claim
41 words
The package of claim 43, wherein said first ground plane and said first lead frame comprise a stripline high frequency signal transmission system and said second ground plane and said second lead frame comprise a stripline high frequency signal transmission system.
Claim 60
Dependent Claim
36 words
The package of claim 33, further comprising: a first heat spreader affixed in heat exchange relationship to said first lead frame and a second heat spreader affixed in heat exchange relationship to said second lead frame.
Claim 61
Dependent Claim
120 words
A lead frame on integrated circuit package of the type having upper and lower substantially planar exterior major surfaces, said package comprising: an integrated circuit package having upper and lower major surfaces, a plurality of sides and having circuit conductors passing through at least one of said sides; a first heat spreader affixed in heat exchange relationship to the upper major surface of said integrated circuit package; a first lead frame formed having a plurality of electrical conductors arranged in a substantially planar element; and wherein said first lead frame is affixed in heat exchange relationship to said first heat spreader and selected ones of said package circuit conductors are electrically connected to selected ones of said lead frame conductors.
Claim 62
Dependent Claim
120 words
A lead frame on integrated circuit package of the type having upper and lower substantially planar exterior major surfaces, said package comprising: an integrated circuit package having upper and lower major surfaces, a plurality of sides and having circuit conductors passing through at least one of said sides; a first heat spreader affixed in heat exchange relationship to the upper major surface of said integrated circuit package; a first lead frame formed having a plurality of electrical conductors arranged in a substantially planar element; and wherein said first lead frame is affixed in heat exchange relationship to said first heat spreader and selected ones of said package circuit conductors are electrically connected to selected ones of said lead frame conductors.
Claim 63
Dependent Claim
18 words
The package of claim 47, wherein said surfaces of said integrated circuit package are covered with polymeric film.
Claim 64
Dependent Claim
26 words
The package of claim 47, further comprising: a second heat spreader affixed in heat exchange relationship to said lower major surface of said integrated circuit package.
Claim 65
Dependent Claim
24 words
The package of claim 49, wherein said second heat spreader comprises an electrically conductive ground plane adapted for connection to an electrical signal ground.
Claim 66
Dependent Claim
22 words
The package of claim 50, wherein said ground plane has holes to facilitate connection to selected ones of said lead frame conductors.
Claim 67
Dependent Claim
24 words
The package of claim 47, further comprising: second heat spreader affixed in heat exchange relationship to said upper major surface of said lead frame.
Claim 68
Dependent Claim
24 words
The package of claim 52, wherein said second heat spreader comprises an electrically conductive ground plane adapted for connection to an electrical signal ground.
Claim 69
Dependent Claim
22 words
The package of claim 53, wherein said ground plane has holes to facilitate connection to selected ones of said lead frame conductors.
Claim 70
Dependent Claim
20 words
The package of claim 53, wherein said first and second ground planes comprise a microstrip high frequency signal transmission system.
Claim 71
Dependent Claim
26 words
The package of claim 52, further comprising: a third heat spreader affixed in heat exchange relationship to said lower major surface of said integrated circuit package.
Claim 72
Dependent Claim
64 words
The package of claim 56, further comprising: a second lead frame having a plurality of electrical conductors arranged in a substantially planar element; and wherein said second lead frame is affixed in heat exchange relationship to said lower major surface of said third heat spreader; selected ones of said package circuit conductors are electrically connected to selected ones of said second lead frame conductors.
Claim 73
Dependent Claim
26 words
The package of claim 57, further comprising: a fourth heat spreader affixed in heat exchange relationship to said lower major surface of said second lead frame.
Claim 74
Dependent Claim
41 words
The package of claim 52, further comprising: a second lead frame comprised of a plurality of conductive elements formed in a substantially planar thermally conductive element affixed in heat exchange relationship to said lower major surface of said integrated circuit package.
Claim 75
Dependent Claim
25 words
The package of claim 59, further comprising: a third heat spreader affixed in heat exchange relationship to said lower surface of said second lead frame.
Claim 76
Dependent Claim
24 words
The package of claim 47, wherein said first heat spreader comprises an electrically conductive ground plane adapted for connection to an electrical signal ground.
Claim 77
Dependent Claim
23 words
The package of claim 61, wherein said ground plane has holes to facilitate connection to selected ones of said first lead frame conductors.
Claim 78
Dependent Claim
22 words
The package of claim 61, wherein said first ground plane and first lead frame comprise a stripline high frequency signal transmission system.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-11-05 | 2000-05-06 | 2000-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-11-05 | 2004-05-06 | 2004-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-11-05 | 2008-05-06 | 2008-11-05 | $7700.00 | Window Closed / Lapsed |