US4758875A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin encapsulated semiconductor device
Assignee: Hitachi Ltd
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Filing: 1981-05-22
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Granted: 1988-07-19
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Expires: 2001-05-22
Abstract
Abstract Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an alpha -rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the aromatic polyimide polymer having a saturated water absorption rate of 1% or less. The polyimide polymer is exemplified as the polymer having the following recurring units: <IMAGE> wherein R is an aliphatic or aromatic group; R1 and R2 are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or CF3; and R3 to R6 are independently a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. The disclosure is also concerned with resin encapsulated semiconductor devices in which the aromatic polyimide polymer of low water absorption is used as an insulating layer or passivation film.
Inventors
- 👤 Koji Fujisaki
- 👤 Akio Nishikawa
- 👤 Shunichi Numata
- 👤 Hiroshi Suzuki
- 👤 Takeshi Komaru
- 👤 Daisuke Makino
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 21:40
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H10P14/63; H10P14/6326; H10P14/6342; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W74/00
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
192 words
A resin encapsulated semiconductor device which comprises: a functioning element comprising a semiconductor substrate having at least one pn-junction exposed to the surface thereof, an electrically insulating film formed on the main surface of said substrate, a conductor formed on said insulating film, and an insulating layer of polyimide resin in contact with said conductor; a resin encapsulation for mechanically protecting and hermetically sealing said functioning element, said encapsulation being closely adhered to an outer surfae of said functioning element; and at least one outer lead extending from the encapsulation, wherein said polyimide resin is an aromatic polyimide resin having a saturated water absorption rate of 1% by weight or less at 25° C./75% RH, said aromatic polyimide polymer having recurring units represented by the formula: ##STR4## wherein R is an aliphatic group or an aromatic group; R 1 and R 2 , which are the same or different, are a hydrogen atom, an alkyl group having 1-4 carbon atoms, or CF 3 ; and R 3 to R 6 , which are the same or different, are a hydrogen atom, a halogen atom or an alkyl group having 1-4 carbon atoms.
Claim 2
Dependent Claim
192 words
A resin encapsulated semiconductor device which comprises: a functioning element comprising a semiconductor substrate having at least one pn-junction exposed to the surface thereof, an electrically insulating film formed on the main surface of said substrate, a conductor formed on said insulating film, and an insulating layer of polyimide resin in contact with said conductor; a resin encapsulation for mechanically protecting and hermetically sealing said functioning element, said encapsulation being closely adhered to an outer surfae of said functioning element; and at least one outer lead extending from the encapsulation, wherein said polyimide resin is an aromatic polyimide resin having a saturated water absorption rate of 1% by weight or less at 25° C./75% RH, said aromatic polyimide polymer having recurring units represented by the formula: ##STR4## wherein R is an aliphatic group or an aromatic group; R 1 and R 2 , which are the same or different, are a hydrogen atom, an alkyl group having 1-4 carbon atoms, or CF 3 ; and R 3 to R 6 , which are the same or different, are a hydrogen atom, a halogen atom or an alkyl group having 1-4 carbon atoms.
Claim 3
Dependent Claim
15 words
A semiconductor memory device according to claim 1, wherein >R< is a group of ##STR5##
Claim 4
Dependent Claim
26 words
A semiconductor memory device according to claim 1, wherein said aromatic polyimide is a dehydrated polymer of a reaction product of pyromellitic acid dianhydride and 2,2'-[4-(4-aminophenoxy)phenyl]propane.
Claim 5
Dependent Claim
27 words
A semiconductor memory device according to claim 1, wherein said aromatic polyimide is a dehydrated polymer of a reaction product of benzophenone tetracarboxylic acid dianhydride and 2,2'-[4-(4-aminophenoxy)phenyl]propane.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-07-19 | 1992-01-18 | 1992-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-07-19 | 1996-01-18 | 1996-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-07-19 | 2000-01-18 | 2000-07-19 | $7700.00 | Window Closed / Lapsed |