Polyimide coating process and material

Claim 2

A process for forming a seal coating on electronic circuitry comprising: applying to said circuitry a filler free coating material which includes: an aromatic polymer which, when cured, forms a polyimide, an organic solvent for said polymer, and a non-ionic fluorocarbon surfactant, and curing the material to form a polyimide seal coating on said circuitry.

Claim 3

The process of claim 1 wherein the aromatic polymer is selected from the group consisting of a polyamic acid and a polyamic acid-imide.

Claim 4

The process of claim 1 wherein the layer includes from about 0 to 1% by weight of a silane adhesion promoter.

Claim 5

The process of claim 1 wherein the coating material includes by weight: about 2 to 20% polymer, about 0.001 to 1.0% surfactant and about 80 to 90% solvent.

Claim 6

The process of claim 4 wherein the coating material includes by weight about 4 to 8% polymer, about 0.001 to 1% surfactant and about 92 to 96% solvent.

Claim 7

The process of claim 1 wherein the fluorocarbon surfactant is selected from the group consisting of non-ionic fluoroinated alkyl-ester surfactants represented by the formula: ##STR8## where R f is a perfluoroalkyl group having from 3 to 12 carbon atoms and m is integer from 2 to 12, and R' is a low molecular weight polyoxethylene, a polyoxypropylene or a polyoxyethylenepolyoxypropylene copolymer group, N-polyoxyethylene substituted perfluorosulfonamides represented by the formula: ##STR9## in which R is a lower alkyl group having from 1 to 6 carbon atoms such as methyl, ethyl propyl, butyl, etc. and n is an integer from 2-30, and N-alkanol perfluoroalkanesulfonamides represented by the formula: R.sub.f SO.sub.2 N(R')RCH.sub.2 OH where R f is a perfluoroalkyl group containing 4 to 12 carbon atoms, R is an alkylene bridging group containing 1 to 12 carbon atoms, and R' is a hydrogen atom or an alkyl group containing 1 to 6 carbon atoms; and the corresponding esters.

Claim 8

A process for forming an aromatic seal coating on metal conductor lines on the surface of a substrate and the solder joints and pads forming the connection between the substrate and an integrated circuit chip which is electrically bonded thereto comprising applying to said surface a filler free coating material which comprises 2 to 20% by weight of an aromatic polymer which, when cured, forms a polyimide about 80 to 90% by weight of an organic solvent for said polymer, about 0.001 to 1% by weight of a non-ionic fluorocarbon surfactant, and about 0 to 1% by weight of silane adhesion promoter, and curing material to form a polyimide seal coating.

Claim 9

A process for forming an aromatic seal coating on metal conductor lines on the surface of a substrate and the solder joints and pads forming the connection between the substrate and an integrated circuit chip which is electrically bonded thereto comprising applying to said surface a filler free coating material which comprises 2 to 20% by weight of an aromatic polymer which, when cured, forms a polyimide about 80 to 90% by weight of an organic solvent for said polymer, about 0.001 to 1% by weight of a non-ionic fluorocarbon surfactant, and about 0 to 1% by weight of silane adhesion promoter, and curing material to form a polyimide seal coating.