Method of manufacturing thick-film hybrid integrated circuits
Abstract
Abstract METHOD COMPRISES: (1) SCREEN PRINTING ON A CERAMIC SUBSTRATE A PATTERN OF CONDUCTORS, RESISTORS AND SOMETIMES CAPACITORS AND INDUCTORS; (2) FIRING TO CURE THESE COMPONENTS; (3) COVERING THE FIRED COMPONENTS AND SUBSTRATE WITH A THIN LAYER OF A RESIN COMPOSITION WHICH IS RELATIVELY PURE, SOFT, ELASTIC, AND NON-BRITTLE, LEAVING OPENINGS IN THE LAYER WHERE DISCRETE ACTIVE COMPONENTS ARE TO BE MOUNTED AND WHERE JUMPER CONNECTIONS ARE TO BE MADE; (4) MOUNTING THE ACTIVE COMPONENTS WITHIN SOME OF THESE OPENINGS AND MAKING SCREEN-PRINTED JUMPER CONNECTIONS BETWEEN OTHER OPENINGS; AND (5) ENCAPSULATIN IN AN OUTER LAYER OF A TOUGH, GOOD THERMAL CONDUCTING, MOISTURE RESISTANT, THIGHLY ABHERENT TYPE RESIN COMPOSITION.
Inventors
- 👤 W Liederbach
Bibliographic Details
Claims Analysis
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1976-02-06 | 1976-08-07 | 1977-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-02-06 | 1980-08-07 | 1981-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-02-06 | 1984-08-07 | 1985-02-06 | $7700.00 | Window Closed / Lapsed |