Method of fabricating integrated resistors in high density substrates

Claim 1

A method of making an integrated resistor in a substrate, comprising: applying a resistive layer over an underlying substrate; applying a first mask over selected portions of the resistive layer but leaving a portion of resistive layer uncovered; etching away the uncovered portion of the resistive layer and removing the first mask; applying in series upwardly a first electrically conductive layer, an upper adhesive layer, and an electrically nonconductive layer on the resistive layer; applying a second mask over selected portions of the resistive layer leaving exposed portions for electrical connections; etching the nonconductive layer and the upper adhesive layer from the exposed portions; depositing conductive electrical connections in the exposed portions to the first conductive layer; removing the second mask; and removing the first electrically conductive, upper adhesive, and the nonconductive layers outside the electrical connections, thereby leaving the electrical connections connected to the unetched portions of the resistive layer on the substrate.

Claim 2

A method of making an integrated resistor in a substrate, comprising: applying a resistive layer over an underlying substrate; applying a first mask over selected portions of the resistive layer but leaving a portion of resistive layer uncovered; etching away the uncovered portion of the resistive layer and removing the first mask; applying in series upwardly a first electrically conductive layer, an upper adhesive layer, and an electrically nonconductive layer on the resistive layer; applying a second mask over selected portions of the resistive layer leaving exposed portions for electrical connections; etching the nonconductive layer and the upper adhesive layer from the exposed portions; depositing conductive electrical connections in the exposed portions to the first conductive layer; removing the second mask; and removing the first electrically conductive, upper adhesive, and the nonconductive layers outside the electrical connections, thereby leaving the electrical connections connected to the unetched portions of the resistive layer on the substrate.

Claim 11

A method of making an integrated resistor in a substrate, comprising the following steps in the sequence set forth: applying a resistive layer over an underlying substrate; applying a first photopolymer mask over selected portions of the resistive layer but leaving a portion of resistive layer uncovered; etching away the uncovered portion of the resistive layer and removing the first mask; applying in series upwardly an electrically conductive lower adhesive layer, a first electrically conductive layer, an upper adhesive layer, and an electrically nonconductive layer on the resistive layer; applying a second photopolymer mask over selected portions of the resistive layer leaving exposed portions for electrical connections; etching the nonconductive layer and the upper adhesive layer from the exposed portions; plating conductive electrical connections in the exposed portions to the first electrically conductive layer; removing the second mask; applying an electrically conductive protective coating on the electrical connections; removing the lower adhesive layer, the first electrically conductive layer, the upper adhesive layer, and the nonconductive layer outside the electrical connections, thereby leaving the electrical connections connected to the unetched portions of the resistive layer on the substrate applying a layer of polymer over the substrate.

Claim 12

A method of making an integrated resistor in a substrate, comprising the following steps in the sequence set forth: applying a resistive layer over an underlying substrate; applying a first photopolymer mask over selected portions of the resistive layer but leaving a portion of resistive layer uncovered; etching away the uncovered portion of the resistive layer and removing the first mask; applying in series upwardly an electrically conductive lower adhesive layer, a first electrically conductive layer, an upper adhesive layer, and an electrically nonconductive layer on the resistive layer; applying a second photopolymer mask over selected portions of the resistive layer leaving exposed portions for electrical connections; etching the nonconductive layer and the upper adhesive layer from the exposed portions; plating conductive electrical connections in the exposed portions to the first electrically conductive layer; removing the second mask; applying an electrically conductive protective coating on the electrical connections; removing the lower adhesive layer, the first electrically conductive layer, the upper adhesive layer, and the nonconductive layer outside the electrical connections, thereby leaving the electrical connections connected to the unetched portions of the resistive layer on the substrate applying a layer of polymer over the substrate.

Claim 14

A method of making an integrated resistor in a substrate, comprising the following steps in the sequence set forth: applying a resistive layer over an underlying substrate; applying an electrically conductive layer over the resistive layer; applying a first mask over selected portions of the conductive layer for fully defining an area of the resistor while leaving other portions of the conductive layer uncovered; etching away the uncovered portions of the conductive and resistive layers to fully form the resistor; removing the first mask; applying a pillar mask leaving openings for spaced via pillars from the resistor; applying conductive via pillars in the openings to the resistor; removing the pillar mask; and stripping the conductive layer between the via pillars down to the resistive layer; depositing a dielectric layer on the substrate which covers the resistive layer and partially covers the via pillars leaving the ends of the via pillars opposite the resistive layer exposed; and connecting the exposed ends of the via pillars to other electrical components thereby providing the first electrical interconnection between the resistor and other electrical components.

Claim 15

A method of making an integrated resistor in a substrate, comprising the following steps in the sequence set forth: applying a resistive layer over an underlying substrate; applying an electrically conductive layer over the resistive layer; applying a first mask over selected portions of the conductive layer for fully defining an area of the resistor while leaving other portions of the conductive layer uncovered; etching away the uncovered portions of the conductive and resistive layers to fully form the resistor; removing the first mask; applying a pillar mask leaving openings for spaced via pillars from the resistor; applying conductive via pillars in the openings to the resistor; removing the pillar mask; and stripping the conductive layer between the via pillars down to the resistive layer; depositing a dielectric layer on the substrate which covers the resistive layer and partially covers the via pillars leaving the ends of the via pillars opposite the resistive layer exposed; and connecting the exposed ends of the via pillars to other electrical components thereby providing the first electrical interconnection between the resistor and other electrical components.

Claim 18

A method of making an integrated resistor in a substrate, comprising the following steps in the sequence set forth: applying a resistive layer over an underlying substrate; applying a conductive layer of titanium over the resistive layer; applying a first photopolymer mask over selected portions of the titanium layer for fully defining an area of the resistor while leaving other portions of the titanium uncovered; etching away the uncovered portions of the titanium and resistive layer to fully form the resistor; removing the first mask; applying a plating mask leaving openings for spaced via pillars from the resistor; applying conductive via pillars in the openings to the resistor; removing the plating mask; and stripping the titanium layer between the via pillars down to the resistive layer; depositing a dielectric layer on the substrate which covers the resistive layer and partially covers the via pillars leaving the ends of the via pillars opposite the resistive layer exposed; and connecting the exposed ends of the via pillars to other electrical components thereby providing the first electrical interconnection between the resistor and other electrical components.

Claim 19

A method of making an integrated resistor in a substrate, comprising the following steps in the sequence set forth: applying a resistive layer over an underlying substrate; applying a conductive layer of titanium over the resistive layer; applying a first photopolymer mask over selected portions of the titanium layer for fully defining an area of the resistor while leaving other portions of the titanium uncovered; etching away the uncovered portions of the titanium and resistive layer to fully form the resistor; removing the first mask; applying a plating mask leaving openings for spaced via pillars from the resistor; applying conductive via pillars in the openings to the resistor; removing the plating mask; and stripping the titanium layer between the via pillars down to the resistive layer; depositing a dielectric layer on the substrate which covers the resistive layer and partially covers the via pillars leaving the ends of the via pillars opposite the resistive layer exposed; and connecting the exposed ends of the via pillars to other electrical components thereby providing the first electrical interconnection between the resistor and other electrical components.