US4874493A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of deposition of metal into cavities on a substrate
Assignee: Rateze Remote Mgmt LLC
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Filing: 1988-03-28
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Granted: 1989-10-17
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Expires: 2008-03-28
Abstract
Abstract A process for filling cavities in a flat surface on a substrate by metal deposition which includes depositing a film of metal onto the flat surface and cavities in a substantially perpendicular direction to the surface, and simultaneously re-sputtering and deposited film on the flat surface by ion beam milling at an angle to the surface of the substrate for achieving the deposition of metal into the cavities and filling the cavities without leaving any film on the flat surface.
Inventors
- 👤 Ju-Don T. Pan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 09:01
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/04; C23C14/046; C23C14/22; C23C14/34; C23C14/46; H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4076
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
78 words
A process for achieving the deposition of a metal into cavities in a substantially flat surface of a substrate and substantially filling the cavities without leaving enclosed holes comprising, depositing metal in the cavities and on the surface of the substrate by ion beam sputter deposition, and simultaneously re-sputtering the deposited metal on the flat surface by ion beam milling thereby substantially completely removing the film on the flat surface without removing the metal deposited in the cavities.
Claim 2
Dependent Claim
78 words
A process for achieving the deposition of a metal into cavities in a substantially flat surface of a substrate and substantially filling the cavities without leaving enclosed holes comprising, depositing metal in the cavities and on the surface of the substrate by ion beam sputter deposition, and simultaneously re-sputtering the deposited metal on the flat surface by ion beam milling thereby substantially completely removing the film on the flat surface without removing the metal deposited in the cavities.
Claim 3
Dependent Claim
21 words
The process of claim 1 wherein the direction of depositing the metal is substantially perpendicular to the surface of the substrate.
Claim 4
Dependent Claim
29 words
The process of claim 1 wherein the re-sputtering of the deposited metal is performed by directing the ion beam milling at an angle to the surface of the substrate.
Claim 5
Dependent Claim
12 words
The process of claim 3 wherein the angle is approximately 45 degrees.
Claim 6
Dependent Claim
99 words
A process for achieving the deposition of a metal into cavities in a substantially flat surface of a substrate and substantially filling the cavities without leaving enclosed holes comprising, depositing metal in the cavities and on the surface of the substrate by ion beam sputter deposition, re-sputtering the deposited film on the flat surface by ion beam milling thereby substantially completely removing the film on the flat surface without removing the metal deposited in the cavities, and alternately repeating the depositing and re-sputtering steps until sufficient metal has been deposited to substantially fill the cavities without leaving enclosed holes.
Claim 7
Dependent Claim
99 words
A process for achieving the deposition of a metal into cavities in a substantially flat surface of a substrate and substantially filling the cavities without leaving enclosed holes comprising, depositing metal in the cavities and on the surface of the substrate by ion beam sputter deposition, re-sputtering the deposited film on the flat surface by ion beam milling thereby substantially completely removing the film on the flat surface without removing the metal deposited in the cavities, and alternately repeating the depositing and re-sputtering steps until sufficient metal has been deposited to substantially fill the cavities without leaving enclosed holes.
Claim 8
Dependent Claim
74 words
A process for filling cavities in a substantially flat surface on a substrate by metal deposition comprising, depositing metal onto the flat surface and cavities in a substantially perpendicular direction to the surface, and simultaneously re-sputtering the deposited metal on the surface by ion beam milling at an angle to the surface of the substrate for preserving the deposition of metal inside the cavities, and substantially completely removing the film on the flat surface.
Claim 9
Dependent Claim
74 words
A process for filling cavities in a substantially flat surface on a substrate by metal deposition comprising, depositing metal onto the flat surface and cavities in a substantially perpendicular direction to the surface, and simultaneously re-sputtering the deposited metal on the surface by ion beam milling at an angle to the surface of the substrate for preserving the deposition of metal inside the cavities, and substantially completely removing the film on the flat surface.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-10-16 | 1993-04-17 | 1993-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-10-16 | 1997-04-17 | 1997-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-10-16 | 2001-04-17 | 2001-10-17 | $7700.00 | Window Closed / Lapsed |