Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
31 words
The combination according to claim 1 wherein said conducting means comprises a thin metallized film deposited on the top and bottom surfaces of the substrate and extending around the edge thereof.
Claim 2
Dependent Claim
48 words
The combination according to claim 1 including second conducting means connecting said first electrode film means to the active thick film circuit, with said second conducting means comprising a thin metallized film deposited on the top and bottom surfaces of the substrate and extending around the edge thereof.
Claim 3
Dependent Claim
151 words
An electronic assembly including in combination, a flat thin substrate having top and bottom surfaces, an active circuit on the top surface of the substrate, capacitor means including a first electrode film positioned on the bottom surface of the substrate, conducting means connecting said first electrode film to said active circuit, said first electrode film further having an external terminal positioned on the edge of said film Opposite to said film lead and adapted to be connected to a reference potential, a dielectric film positioned on said first electrode film, and second electrode film means positioned on said dielectric film and having a film lead extending around the edge of said substrate and connecting said second electrode film means to said active circuit, said second electrode film means having a terminal on the edge thereof opposite to said film lead, said first electrode film shielding said active circuit from said capacitor.
Claim 4
Dependent Claim
28 words
An electronic assembly according to claim 4 wherein said conducting means comprise film lead on the top and bottom surfaces and extending around the edge of the substrate.
Claim 5
Dependent Claim
12 words
An electronic assembly according to claim 4 wherein said substrate comprises alumina.
Claim 6
Dependent Claim
20 words
An electronic assembly according to claim 4 wherein said active circuit includes a pad for receiving an integrated circuit chip.
Claim 7
Dependent Claim
166 words
An electronic assembly including in combination, a substrate having at least one substantially flat surface, an active thick film circuit on a surface of said substrate, capacitor means including a first conductive electrode film on a surface of said substrate having first and second edges remote from each other, a dielectric film positioned on said first electrode film, and second conductive electrode film means positioned on said dielectric film, said second film means including a conducting portion having substantial area positioned above said first electrode film and having third and fourth edges remote from each other, conducting means connecting said first edge of said first electrode film and said third edge of said second electrode film means to said active circuit, terminal means connected to said second edge of said first electrode film for connecting said active circuit to an external reference potential, and further terminal means connected to said fourth edge of said second electrode film means for connecting said active circuit to external circuitry.
Claim 8
Dependent Claim
38 words
The combination according to claim 8 wherein said second conductive electrode film means includes a plurality of separate conducting electrodes cooperating with said dielectric film and said first conductive electrode film to form a plurality of separate capacitors.
Claim 9
Dependent Claim
37 words
The combination of claim 9 wherein said conducting means connects each of said conducting electrodes to said active thick film circuit, and said further terminal means includes a plurality of terminals individually connected to said conducting electrodes.
Claim 10
Dependent Claim
26 words
The combination of claim 8 wherein a portion of said conducting means connected to said first electrode film includes a pad for receiving an integrated circuit.
Claim 11
Dependent Claim
26 words
The combination of claim 8 wherein said first conductive electrode film and said second conductive film means are formed of an alloy of palladium and silver.