US4810332A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making an electrical multilayer copper interconnect
Assignee: Microelectronics and Computer Technology Corp
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Filing: 1988-07-21
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Granted: 1989-03-07
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Expires: 2008-07-21
Abstract
Abstract A method of making an electrical multilayer copper interconnect in which the electrical lines are protected by an electroplated overcoat. A plating interconnect is deposited on a substrate, a sacrificial layer of dielectric material is deposited on the plating interconnect. Thereafter a plating mask is formed on the dielectric material. Two self-aligned plating masks are patterned in one step, one of which is a plating mask for copper plating and the other is a plating mask for the overcoat. Preferably, before electroplating the overcoat, the copper is etched for exposing the sides adjacent the dielectric layer for allowing overcoating all of the copper.
Inventors
- 👤 Ju-Don T. Pan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 02:45
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4647; H10W70/60; H10W70/62; H10W70/66; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0577; H05K2203/0585; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K3/10; H05K3/108; H05K3/22; H05K3/24; H05K3/243; H05K3/38; H05K3/388
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
101 words
A method of making an electrical multilayer copper interconnect comprising, depositing a plating interconnect on a substrate, depositing a sacrificial layer of dielectric material on the plating interconnect, forming a plating mask on the dielectric material, etching away the dielectric material through the plating mask, plating a copper conductor into the etched away dielectric, stripping away the plating mask, forming a pillar plating mask on top of the conductor, plating a copper pillar onto the conductor, stripping the pillar plating mask, electroplating an overcoat layer on the exposed surface of the copper pillar and conductor, and stripping the sacrificial dielectric layer.
Claim 2
Independent Claim
101 words
A method of making an electrical multilayer copper interconnect comprising, depositing a plating interconnect on a substrate, depositing a sacrificial layer of dielectric material on the plating interconnect, forming a plating mask on the dielectric material, etching away the dielectric material through the plating mask, plating a copper conductor into the etched away dielectric, stripping away the plating mask, forming a pillar plating mask on top of the conductor, plating a copper pillar onto the conductor, stripping the pillar plating mask, electroplating an overcoat layer on the exposed surface of the copper pillar and conductor, and stripping the sacrificial dielectric layer.
Claim 3
Dependent Claim
29 words
The method of claim 1 including, before electroplating the overcoat, etching the copper for exposing the sides adjacent to the dielectric layer for allowing overcoating all of the copper.
Claim 4
Dependent Claim
11 words
The method of claim 1 wherein the dielectric material is polyimide.
Claim 5
Dependent Claim
15 words
The method of claim 1 including stripping the plating interconnect below the stripped dielectric layer.
Claim 6
Dependent Claim
17 words
The method of claim 1 wherein the overcoat is from a group consisting of nickel and chromium.
Claim 7
Dependent Claim
18 words
The method of claim 1 wherein the dielectric material is resistant to the stripping of the plating mask.
Claim 8
Independent Claim
126 words
A method of making an electrical multilayer copper interconnect comprising, depositing a plating interconnect on a substrate, depositing a layer of polyimide on the plating interconnect, forming a conductor plating mask on the polyimide, patterning the conductor plating mask and the polyimide in a self-aligned pattern for a conductor, electroplating a copper conductor into the pattern and connected to the interconnect, stripping away the conductor plating mask, forming a pillar mask on top of the conductor, electroplating a copper pillar onto the conductor, stripping the pillar plating mask, etching away the copper sides adjacent the polyimide, and electroplating an overcoat layer on the exposed surface of the copper pillar and conductor, stripping the layer of polyimide away, and stripping the plating interconnect below the stripped polyimide.
Claim 9
Independent Claim
126 words
A method of making an electrical multilayer copper interconnect comprising, depositing a plating interconnect on a substrate, depositing a layer of polyimide on the plating interconnect, forming a conductor plating mask on the polyimide, patterning the conductor plating mask and the polyimide in a self-aligned pattern for a conductor, electroplating a copper conductor into the pattern and connected to the interconnect, stripping away the conductor plating mask, forming a pillar mask on top of the conductor, electroplating a copper pillar onto the conductor, stripping the pillar plating mask, etching away the copper sides adjacent the polyimide, and electroplating an overcoat layer on the exposed surface of the copper pillar and conductor, stripping the layer of polyimide away, and stripping the plating interconnect below the stripped polyimide.
References Cited (Backward Citations)
US3745094A
Cited
US4082591A
Cited
US4159222A
Cited
US4190474A
Cited
US4233344A
Cited
US4409037A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-03-06 | 1992-09-05 | 1993-03-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-06 | 1996-09-05 | 1997-03-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-06 | 2000-09-05 | 2001-03-07 | $7700.00 | Window Closed / Lapsed |