US4190474A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a printed circuit board having mutually etchable copper and nickel layers
Assignee: Gould Electronics Inc
•
Filing: 1977-12-22
•
Granted: 1980-02-26
•
Expires: 1997-12-22
Abstract
Abstract A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i.e., etchable by the same etchant. The preferred amount of sulfur ranges from about 0.05 to about 10.0 weight percent.
Inventors
- 👤 Betty L. Berdan
- 👤 Betty M. Luce
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 14:10
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; C; C25; C25D; C25D3/00; C25D3/02; C25D3/12; H05K3/00; H05K3/02; H05K3/06; H05K3/067; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2201/0355; H05K2201/20; H05K2201/2063; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; Y; Y10; Y10S; Y10S205/00; Y10S205/92; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12556; Y10T428/12569; Y10T428/1266
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
103 words
A method of producing a readily etchable printed circuit board including a resinous substrate and a sheet of copper foil having a nickel barrier layer deposited on one surface thereof with the opposite surface of said nickel layer being bonded to said resinous substrate which comprises: providing a sheet of copper foil, depositing a layer of nickel on a surface of said sheet of copper foil in which said nickel layer contains an effective amount of sulfur to render said copper foil and said nickel barrier layer mutually etchable, and bonding the exposed surface of said nickel barrier layer to said resinous substrate.
Claim 2
Independent Claim
103 words
A method of producing a readily etchable printed circuit board including a resinous substrate and a sheet of copper foil having a nickel barrier layer deposited on one surface thereof with the opposite surface of said nickel layer being bonded to said resinous substrate which comprises: providing a sheet of copper foil, depositing a layer of nickel on a surface of said sheet of copper foil in which said nickel layer contains an effective amount of sulfur to render said copper foil and said nickel barrier layer mutually etchable, and bonding the exposed surface of said nickel barrier layer to said resinous substrate.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein said sulfur is present in an amount ranging from about 0.05 to about 10.0 weight percent.
Claim 4
Dependent Claim
18 words
The method of claim 1 wherein said layer of nickel is electrolytically deposited from a nickel-ion containing bath.
Claim 5
Dependent Claim
24 words
The method of claim 3 wherein said bath contains an addition agent selected from the group consisting of organic sulfonates, sulfonates, sulfonamides and sulfonimides.
Claim 6
Dependent Claim
11 words
The method of claim 4 wherein said addition agent is saccharin.
References Cited (Backward Citations)
US2233546A
Cited
US2326999A
Cited
US2984595A
Cited
US3183067A
Cited
US3454376A
Cited
US3591350A
Cited
US3585010A
Cited
US4010005A
Cited
US4061837A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-02-25 | 1983-08-27 | 1984-02-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-02-25 | 1987-08-27 | 1988-02-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-02-25 | 1991-08-27 | 1992-02-26 | $7700.00 | Window Closed / Lapsed |