US4010005A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper foil having bond strength
Assignee: Mitsui-Anaconda Electro Copper Sheet Co Ltd
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Filing: 1974-06-10
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Granted: 1977-03-01
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Expires: 1994-06-10
Abstract
Abstract A copper foil having high bond strength with an insoluble particle-containing metal plate formed thereon, the plated copper foil being adapted for use in the preparation of, for example, a printed circuit.
Inventors
- 👤 Shigeyoshi Morisaki
- 👤 Kazuo Mase
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 22:16
CPC Classifications
C; C23; C23C; C23C30/00; C25; C25D; C25D15/00; C25D15/02; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0212; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/20; H05K2201/2063; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0723; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12486; Y10T428/12493; Y10T428/1266; Y10T428/12667; Y10T428/12681; Y10T428/12771; Y10T428/12785; Y10T428/12792; Y10T428/12806; Y10T428/12826; Y10T428/12847; Y10T428/12861; Y10T428/12903; Y10T428/1291; Y10T428/12993
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
21 words
A plated copper foil having high bond strength comprising a copper foil and an insoluble fine particle-containing metal plating formed thereon.
Claim 2
Dependent Claim
21 words
A plated copper foil having high bond strength comprising a copper foil and an insoluble fine particle-containing metal plating formed thereon.
Claim 3
Dependent Claim
31 words
A plated copper foil having high bond strength according to claim 1, wherein the metal is selected from the group consisting of brass, bronze, copper, nickel, zinc, cadmium, indium and chromium.
Claim 4
Dependent Claim
37 words
A plated copper foil having high bond strength according to claim 1, wherein the insoluble fine particles are selected from the group consisting of silica, alumina, glass, barium sulfate and mixtures thereof, each in a particulate form.
Claim 5
Dependent Claim
36 words
A plated copper foil having high bond strength according to claim 1, wherein the insoluble fine particles are selected from the group consisting of epoxy, phenolic, polyvinylbutyral resins and mixtures thereof, each in a particulate form.
Claim 6
Dependent Claim
25 words
A plated copper foil having high bond strength according to claim 1, wherein the insoluble fine particles are 0.1 - 10 μ in particle size.
Claim 7
Dependent Claim
35 words
A plated copper foil having high bond strength according to claim 2, wherein the insoluble fine particles are selected from the group consisting of silica, alumina, glass and barium sulfate, each in a particulate form.
Claim 8
Dependent Claim
34 words
A plated copper foil having high bond strength according to claim 2, wherein the insoluble fine particles are selected from the group consisting of epxoy, phenolic and polyvinylbutyral resins, each in a particulate form.
Claim 9
Dependent Claim
88 words
A copper foil having a plating of a metal selected from the group consisting of brass, bronze, copper, nickel, zinc, cadmium, indium and chromium, said metal plating containing fine particles of a substance electrically insulating and chemically and thermally stable, selected from the group consisting of silica, alumina, glass, barium sulfate and mixtures thereof, prepared by electroplating said copper foil as the cathode in a bath of a plating solution of said metal, said bath containing fine particles of said electrically insulating and chemically and thermally stable substance.
Claim 10
Dependent Claim
88 words
A copper foil having a plating of a metal selected from the group consisting of brass, bronze, copper, nickel, zinc, cadmium, indium and chromium, said metal plating containing fine particles of a substance electrically insulating and chemically and thermally stable, selected from the group consisting of silica, alumina, glass, barium sulfate and mixtures thereof, prepared by electroplating said copper foil as the cathode in a bath of a plating solution of said metal, said bath containing fine particles of said electrically insulating and chemically and thermally stable substance.
Claim 11
Dependent Claim
40 words
A plated copper foil according to claim 6 wherein the particles are barium sulfate particles of average particle size 3 microns, the metal plating is of copper, said foil is free of dendritic deposits and has 2.07 kg/cm bond strength.
Claim 12
Dependent Claim
38 words
A plated copper foil according to claim 6 wherein the particles are silica powder of average particle size 6 microns, the metal plating is brass, said foil is free of dendritic deposits and has 2.03 kg/cm bond strength.
Claim 13
Dependent Claim
40 words
A plated copper foil according to claim 6 wherein the particles are an epoxy resin of average particle size 1 micron, the metal plating is of copper, said foil is free of dendritic deposits and has 2.10 kg/cm bond strength.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-02-29 | 1980-08-30 | 1981-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-02-29 | 1984-08-30 | 1985-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-02-29 | 1988-08-30 | 1989-03-01 | $7700.00 | Window Closed / Lapsed |