Printed circuit manufacture

Claim 1

2N THE PREPARATION OF PRINTED CIRCUITS BY THE PROCESS COMPRISING ELECTROFORMING AT LEAST ONE CIRCUIT ELEMENT ON THE EXPOSED AREA OF A STAINLESS STEEL BASE MEMBER WITH INSULATING COATING MATERIAL ON OTHER SURFACE PORTIONS THEREOF AND, THERAFTER, TRANSFERRING AND EMBEDDING THE CIRCUIT ELEMENT IN THE SURFACE REGION OF A PLASTIC INSULATING BASE MEMBER, THE IMPROVEMENT COMPRISING FIRST PLATING THE EXPOSED AREAS OF THE STAINLESS STEEL BASE MEMBER WITH A LAYER OF PALLADIUM FROM AN AMMONIACAL BATH TO A THICKNESS OF ABOUT 1 X 10-5 TO 10X10-6 INCH, AND THEREAFTER PLATING AT LEAST ONE ADDITIONAL LAYER OF METAL OVER THE PALLADIUM LAYER WHEREBY A READY SEPARATION BETWEEN THE PALLADIUM LAYER AND THE STAINLESS STELL BASE IS OBTAINED AND THE EXPOSED SURFACE OF EACH OF THE RESULTING CIRCUIT ELEMENTS CONSISTS OF CORROSION RESISTANT PALLADIUM WHEN EACH OF SAID CIRCUIT ELEMENTS EMBEDDED IN THE SURFACE REGION OF THE PLASTIC BASE MEMBER IS REMOVED TOGETHER WITH SAID PLATIC BASE MEMBER, FROM THE STAINLESS STEEL BASE MEMBER.