US4920639A
Expired / Lapsed
US
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Method of making a multilevel electrical airbridge interconnect
Assignee: Rateze Remote Mgmt LLC
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Filing: 1989-08-04
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Granted: 1990-05-01
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Expires: 2009-08-04
Abstract
Abstract A method of building a multilevel electrical interconnect supported by metal pillars with air as a dielectric. The metal conductors and metal support pillars are formed using a photo-imagible polymer which serves the function of patterning and also provides a temporary support during construction.
Inventors
- 👤 Ian Y. K. Yee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 04:22
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/058; H10W20/071; H10W20/072; H10W20/40; H10W20/41; H10W20/43; H10W20/432; H10W20/45; H10W20/46; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H05K1/0272; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
147 words
A method of making a multilevel electrical airbridge interconnect on a substrate comprising, applying a metal seed layer over an underlying layer, selectively patterning a photopolymer mask on the metal seed layer, applying an electrically conductive layer on the unmasked portion of the metal seed layer for forming a first conductor lavel and a first part of metal support pillars, adding a second layer of a photopolymer mask for forming another part of the support pillars, applying another part of the metal support pillars to the first part of the metal support pillars, applying a second metal seed layer over the second mask and said another part layer of the metal pillars, repeating these steps one or more times for building additional levels of metal pillar supported conductors, and sequentially removing the seed and mask layers leaving electrical conductors supported from metal pillars with a dielectric therebetween.
Claim 2
Independent Claim
147 words
A method of making a multilevel electrical airbridge interconnect on a substrate comprising, applying a metal seed layer over an underlying layer, selectively patterning a photopolymer mask on the metal seed layer, applying an electrically conductive layer on the unmasked portion of the metal seed layer for forming a first conductor lavel and a first part of metal support pillars, adding a second layer of a photopolymer mask for forming another part of the support pillars, applying another part of the metal support pillars to the first part of the metal support pillars, applying a second metal seed layer over the second mask and said another part layer of the metal pillars, repeating these steps one or more times for building additional levels of metal pillar supported conductors, and sequentially removing the seed and mask layers leaving electrical conductors supported from metal pillars with a dielectric therebetween.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein the removing of the seed layers and mask layers are separately performed beginning at the top.
Claim 4
Dependent Claim
25 words
The method of claim 1 wherein the metal seed layers are applied by evaporation and the electrical conductor layers and pillars are applied by electroplating.
Claim 5
Dependent Claim
25 words
The method of claim 3 wherein the electroplating, prior to the applying of the next seed layer, is electroplated approximately flush with the resist mask.
Claim 6
Dependent Claim
20 words
The method of claim 1 wherein a dielectric layer is applied between the substrate and the first metal seed layer.
Claim 7
Dependent Claim
20 words
The method of claim 1 wherein an adhesive layer is applied between the substrate and the first metal seed layer.
Claim 8
Dependent Claim
12 words
The method of claim 6 wherein the adhesive layer is sequentially removed.
Claim 9
Dependent Claim
10 words
The method of claim 1 wherein the dielectric is air.
Claim 10
Dependent Claim
10 words
The method of claim 1 wherein the dielectric is backfilled.
Claim 11
Independent Claim
164 words
A method of making a multilevel electrical airbridge interconnect comprising, applying a dielectric layer over a substrate, applying an adhesion layer over the dielectric, applying an metal seed layer over the adhesion layer, selectively patterning a photopolymer mask on the metal seed layer, applying an electrically conductive non-seed layer on the unmasked portion of the metal seed layer for forming a first conductor level and a first part of metal support pillars, adding a second layer of a photopolymer mask for forming another part of the support pillars, applying another part of the metal support pillars to the first part of the metal support pillars, applying a second metal seed layer over the second mask and said another part layer of the metal pillars, repeating steps three through eight one or more times for building additional levels of metal pillar supported conductors, and sequentially removing the seed layers and the mask layers leaving electrical conductors supported from metal pillars with an air dielectric therebetween.
Claim 12
Independent Claim
164 words
A method of making a multilevel electrical airbridge interconnect comprising, applying a dielectric layer over a substrate, applying an adhesion layer over the dielectric, applying an metal seed layer over the adhesion layer, selectively patterning a photopolymer mask on the metal seed layer, applying an electrically conductive non-seed layer on the unmasked portion of the metal seed layer for forming a first conductor level and a first part of metal support pillars, adding a second layer of a photopolymer mask for forming another part of the support pillars, applying another part of the metal support pillars to the first part of the metal support pillars, applying a second metal seed layer over the second mask and said another part layer of the metal pillars, repeating steps three through eight one or more times for building additional levels of metal pillar supported conductors, and sequentially removing the seed layers and the mask layers leaving electrical conductors supported from metal pillars with an air dielectric therebetween.
Claim 13
Dependent Claim
22 words
The method of claim 10 wherein the removing of the seed layers and mask layers are separately performed beginning at the top.
Claim 14
Dependent Claim
24 words
The method of claim 11 wherein the metal seed layers are applied by evaporation and the conductor layers and pillars are applied by electroplating.
Claim 15
Dependent Claim
24 words
The method of claim 10 wherein the electroplating, prior to the applying of the next seed layer, is electroplated flush with the resist mask.
Claim 16
Independent Claim
128 words
A method of making a multilevel electrical airbridge interconnect on a substrate comprising, applying a metal seed layer over an underlying layer, selectively patterning a photopolymer mask on the metal seed layer, applying an electrically conductive layer on the unmasked portion of the metal seed layer for forming a first conductor level and a first part of metal support pillars, adding a second layer of a photopolymer mask for forming another part of the support pillars, applying another part of the metal support pillars to the first part of the metal support pillars, repeating these steps one or more times for building additional levels of metal pillar supported conductors, and sequentially removing the seed and mask layers leaving electrical conductors supported from metal pillars with a dielectric therebetween.
Claim 17
Independent Claim
128 words
A method of making a multilevel electrical airbridge interconnect on a substrate comprising, applying a metal seed layer over an underlying layer, selectively patterning a photopolymer mask on the metal seed layer, applying an electrically conductive layer on the unmasked portion of the metal seed layer for forming a first conductor level and a first part of metal support pillars, adding a second layer of a photopolymer mask for forming another part of the support pillars, applying another part of the metal support pillars to the first part of the metal support pillars, repeating these steps one or more times for building additional levels of metal pillar supported conductors, and sequentially removing the seed and mask layers leaving electrical conductors supported from metal pillars with a dielectric therebetween.
Claim 18
Dependent Claim
22 words
The method of claim 14 wherein the removing of the seed layers and mask layers are separately performed beginning at the top.
Claim 19
Dependent Claim
25 words
The method of claim 14 wherein the metal seed layers are applied by evaporation and the electrical conductor layers and pillars are applied by electroplating.
Claim 20
Dependent Claim
25 words
The method of claim 14 wherein the electroplating, prior to the applying of the next seed layer, is electroplated approximately flush with the resist mask.
Claim 21
Dependent Claim
20 words
The method of claim 14 wherein a dielectric layer is applied between the substrate and the first metal seed layer.
Claim 22
Dependent Claim
20 words
The method of claim 14 wherein an adhesive layer is applied between the substrate and the first metal seed layer.
Claim 23
Dependent Claim
12 words
The method of claim 19 wherein the adhesive layer is sequentially removed.
Claim 24
Dependent Claim
10 words
The method of claim 14 wherein the dielectric is air.
Claim 25
Dependent Claim
10 words
The method of claim 14 wherein the dielectric is backfilled.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-30 | 1993-10-30 | 1994-05-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-30 | 1997-10-30 | 1998-05-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-30 | 2001-10-30 | 2002-05-01 | $7700.00 | Window Closed / Lapsed |